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| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Volutome |
| Application | Integrated in-chamber ultramicrotome for serial block-face imaging in field-emission scanning electron microscopy (FE-SEM) |
| Detector | Volume BSD (Backscattered Electron Detector optimized for volumetric surface imaging) |
| Charge Compensation | Patented localized charge compensation system |
| Automation | Unattended operation up to 72 hours |
| Workflow Integration | End-to-end solution from sectioning and imaging to 3D reconstruction and visualization |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | SIGMA |
| Detector Options | InLens SE, ETSE, aBSD, Sense BSD |
| EDS Geometry | Optimized for High-Solid-Angle Collection |
| Operating Modes | NanoVP Lite, High-Resolution SEM, Low-Voltage Imaging, In-Situ Compatible |
| Vacuum System | Differential Pumping with Dual-Stage Turbo-Molecular Pumps |
| Stage | Motorized 5-Axis Precision Stage (±0.1 µm repeatability) |
| Beam Control | Gemini II Electron Optics with Active Stigmator and Auto-Alignment |
| Software Platform | SmartSEM with GLP/GMP-Compliant Audit Trail (21 CFR Part 11 Ready) |
| Compliance | ISO 14644-1 Class 5 Cleanroom-Compatible Design, CE Marked, RoHS Compliant |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | Crossbeam 550 Samplefab |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing DualBeam System |
| Electron Source | Thermal Field Emission Gun |
| Secondary Electron Resolution | 0.9 nm @ 15 kV (Crossbeam 550), 1.0 nm @ 15 kV (Crossbeam 340) |
| Magnification Range | 12× – 2,000,000× (SEM mode) |
| Acceleration Voltage | 0.02–30 kV (SEM), 0.5–30 kV (FIB) |
| Backscattered Electron Resolution | Not specified |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing / Conventional Large-format SEM |
| Model | Gemini |
| Key Features | High-efficiency in-lens detection |
| Sample compatibility | Conductive & non-conductive, magnetic & non-magnetic, bulk & coated specimens |
| Compliance | Designed for ISO/IEC 17025-compliant labs |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EVO |
| Pricing | Available Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Cold Field Emission (CFEG) |
| Secondary Electron Resolution | 0.5 nm @ 15 kV, 0.8 nm @ 1 kV (with Tandem Decel) |
| Magnification Range | 50× – 2,000,000× |
| Accelerating Voltage | 0.02 – 30 kV |
| Backscattered Electron Resolution | 1.0 nm @ 1 kV (ESB detector) |
| Detector Configuration | In-lens SE, ET-SE, optional ESB, aSTEM-4, EDS, EBSD, CL |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | ZEISS Cryo-Correlative Workflow Solution |
| Instrument Form Factor | Floor-standing / Conventional Large-scale |
| Electron Source | Cold Field Emission Gun |
| Secondary Electron Resolution | Not Specified |
| Magnification Range | Not Specified |
| Accelerating Voltage | Not Specified |
| Backscattered Electron Resolution | Not Specified |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MultiSEM 706 |
| Beam Count | 91 parallel electron beams |
| Imaging Speed | ~1.5 s per 132 μm × 114 μm hexagonal field of view |
| Resolution | Nanoscale (sub-5 nm typical at 1–3 kV) |
| Sample Capacity | Up to 100 mm wafers or large biological tissue blocks (e.g., 1 mm³ human cortical tissue) |
| Application Scope | High-throughput volumetric EM for semiconductor metrology, connectomics, and materials science |
| Compliance | Designed for integration into GLP/GMP-adjacent workflows |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | In Situ Liquid Electrochemistry Solution |
| Application | Real-time, high-resolution SEM imaging and multimodal analysis of electrochemical cells under operational conditions |
| Key Components | MEMS-based liquid cell chip, custom in situ battery stage, integrated electrical feedthroughs, 10 nm electron-transparent SiN window |
| Compatibility | Standard ZEISS GeminiSEM and SIGMA SEM platforms |
| Compliance | Designed for GLP-compliant workflows |
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