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| Brand | KRI (Kaufman) |
|---|---|
| Origin | USA |
| Model | eH 200 |
| Configuration | Cylindrical & Linear Ion Gun Architecture |
| Neutralizer | Integrated Thermionic Cathode |
| Anode Module | Yes |
| Compatible Process Gases | Ar, O₂, N₂, Xe, CH₄, CF₄, and other inert, reactive, or organic gases |
| Power Supply | eH Plasma Power Pack (Compact, Rack-Mountable, Programmable DC/RF Hybrid Control) |
| Operating Pressure Range | 1×10⁻⁵ to 5×10⁻³ Torr |
| Beam Energy Range | 50–2000 eV (adjustable in 1 eV increments) |
| Beam Current Density | Up to 1.2 mA/cm² (at 1000 eV, Ar) |
| Extraction Aperture | 200 mm diameter |
| Beam Divergence | <±3° full angle |
| Cooling | Water-cooled anode and cathode assembly |
| Vacuum Interface | Conflat (CF) 200 or ISO-K 200 flange |
| Compliance | CE-marked, RoHS-compliant, compatible with ISO 9001-certified vacuum system integration |
| Brand | KRI (Kimball Physics / Kaufman) |
|---|---|
| Origin | USA |
| Model | KDC 10 |
| Ion Energy Range | 100–1200 eV |
| Max Ion Current | >10 mA |
| Grid Diameter | 1 cm |
| Magnetic Confinement | DC |
| Anode Voltage | 0–100 V DC |
| Gas Compatibility | Ar, O₂, N₂, Xe, or mixed inert/active gases |
| Mounting Flange | CF or ISO-K (customizable) |
| Beam Geometry | Broad, Collimated, Low-Divergence |
| Recommended Working Distance | 5–30 cm |
| Typical Applications | In-situ ion cleaning, IBAD, IBE, IBSD, surface activation, TEM/SEM sample preparation |
| Brand | KRI (Kimball Physics / Kaufman) |
|---|---|
| Origin | USA |
| Model | KDC 100 |
| Ion Energy Range | 100–1200 eV |
| Max. Ion Current | >400 mA |
| Grid Diameter | 12 cm |
| Cathode Configuration | Dual Filament |
| Confinement | DC Magnetic |
| Anode Voltage | 0–100 V DC |
| Neutralizer Options | Sidewinder Filament, LFN 2000, or KSC 1212 |
| Beam Collimation | Parallel, Low-Divergence |
| Mounting | Quick-Release or Movable Flange |
| Operating Distance | 20–91 cm (8–36 in) |
| Gas Compatibility | Inert (Ar, Xe), Reactive (O₂, N₂, CF₄), or Mixed Gases |
| Control Interface | Analog + Digital (4-gas MFC support) |
| Optional | Motorized Tilt Mount |
| Brand | KRI (Kimball Physics / Kaufman) |
|---|---|
| Origin | USA |
| Model | KDC 160 |
| Beam Diameter | 16 cm |
| Ion Energy Range | 100–1200 eV |
| Max Ion Current | >800 mA (up to >1000 mA under optimized conditions) |
| Cathode Configuration | Dual Filament (Sidewinder or LFN-2000 compatible) |
| Anode Voltage | 0–100 V DC |
| Magnetic Confinement | DC |
| Neutralizer | Integrated thermionic filament (KSC-1212 controller compatible) |
| Mounting | Quick-release or movable flange |
| Height | 9.92 in (252 mm) |
| Diameter | 9.1 in (231 mm) |
| Beam Collimation | Parallel or divergent |
| Compatible Gases | Inert (Ar, Xe), reactive (O₂, N₂, CF₄), and gas mixtures |
| Working Distance | 8–45 in (203–1143 mm) |
| Gas Control | Up to 4-channel automated mass flow control (optional) |
| Cooling | Air-cooled (no water cooling required) |
| Compliance | Designed for UHV-compatible vacuum systems (≤1×10⁻⁷ Torr base pressure) |
| Brand | KRI (Kimball Physics / Kaufman) |
|---|---|
| Origin | USA |
| Model | KDC 40 |
| Ion Beam Diameter | 4 cm |
| Ion Energy Range | 100–1200 eV |
| Max Ion Current | >120 mA |
| Discharge Power Supply | DC, magnetic confinement |
| Cathode | Tungsten or LFN-1000 filament |
| Anode Voltage | 0–100 V DC |
| Neutralizer | Integrated thermionic cathode (Sidewinder or LFN-1000 compatible) |
| Beam Collimation | Parallel, low-divergence |
| Gas Compatibility | Ar, O₂, N₂, Xe, mixtures |
| Mounting | Conflat CF-63 (2.5") or CF-100 (4") flange |
| Operating Distance | 15–45 cm (6–18 in) |
| Optional Features | Motorized tilt stage, multi-gas manifold (up to 4 gases), third-grid auto-alignment capability |
| Compliance | Designed for UHV-compatible vacuum systems (≤1×10⁻⁷ Torr base pressure) |
| Brand | KRI (Kimball Physics / Kaufman) |
|---|---|
| Origin | USA |
| Model | KDC 75 |
| Beam Diameter | 14 cm |
| Flange Interface | 8" Conflat (CF) |
| Cathodes | Dual filament (1 active + 1 redundant) |
| Ion Energy Range | 100–1200 eV |
| Max Ion Current | >250 mA |
| Grid Diameter | 7.5 cm |
| Magnetic Confinement | DC |
| Neutralizer Options | Filament, Sidewinder Filament, or LFN-2000 |
| Mounting | Movable or Quick-Release Flange |
| Height | 7.9 in (201 mm) |
| Diameter | 5.5 in (140 mm) |
| Beam Profile | Parallel or Divergent |
| Compatible Gases | Inert (Ar, Xe), Reactive (O₂, N₂, Cl₂), or Mixed |
| Working Distance | 6–24 in (152–610 mm) |
| Gas Control | Up to 4 independent gas channels (optional auto-control) |
| Brand | Kaufman (KRI) |
|---|---|
| Origin | USA |
| Model | RFICP 100 |
| Discharge Anode | RF |
| Ion Beam Current | >350 mA |
| Ion Energy Range | 100–1200 eV |
| Grid Diameter | 10 cm |
| Beam Optics | Focused, Parallel, or Divergent Configurations |
| Process Gases | Ar, Kr, Xe, O₂, N₂, H₂ |
| Operating Pressure | <0.5 mTorr |
| Length | 23.5 cm |
| Outer Diameter | 19.1 cm |
| Neutralizer | LFN-2000 |
| Flange | 10" CF |
| Brand | Kaufman |
|---|---|
| Origin | USA |
| Model | RFICP 220 |
| Anode Power | 2 kW @ 2 MHz |
| Max Beam Current | >1000 mA |
| Ion Energy Range | 100–1200 eV |
| Beam Diameter | 22 cm |
| Gas Compatibility | Ar, O₂, N₂, others |
| Gas Flow | 5–50 sccm |
| Operating Pressure | <0.5 mTorr |
| Grid Material | Molybdenum |
| Ion Optics | OptiBeam™ self-aligning electrostatic lens system |
| Neutralizer | LFN 2000 or MHC 1000 |
| Flange | 10" CF |
| Dimensions (H × D) | 30 cm × 41 cm |
| Compliance | Designed for UHV integration and compatible with ISO-KF/CF vacuum standards |
| Brand | Kaufman & Robinson, Inc. (KRI) |
|---|---|
| Origin | USA |
| Model | RFICP 40 |
| Discharge Chamber Anode | RF-coupled |
| Ion Beam Current | >100 mA |
| Ion Kinetic Energy | 100–1200 eV |
| Grid Diameter | 4 cm |
| Beam Modes | Focused, Parallel, Divergent |
| Process Gas Flow | 3–10 sccm |
| Compatible Gases | Ar, Kr, Xe, O₂, N₂, H₂ |
| Operating Pressure | < 0.5 mTorr |
| Dimensions (L × Ø) | 12.7 cm × 13.5 cm |
| Neutralizer | LFN-2000 |
| Brand | Kaufman & Robinson (KRI) |
|---|---|
| Origin | USA |
| Model | RFICP Series |
| Discharge Type | RF Inductive Coupling |
| Beam Current Range | 100–1500 mA |
| Beam Energy Range | 100–1200 V |
| Grid Aperture Diameter | 4–30 cm |
| Operating Gases | Ar, Kr, Xe, O₂, N₂, H₂ |
| Chamber Pressure | < 0.5 mTorr |
| System Components | Ion Source Body, RF Power Supply, Neutralizer (LFN-2000), Automated Control Unit |
| Compliance | Designed for integration into UHV and HV vacuum systems per ASTM F1716 and ISO 20000-1 standards |
| Brand | Kaufman (KRI) |
|---|---|
| Origin | USA |
| Model | RFICP-380 |
| Discharge Power | 2 kW @ 1.8 MHz |
| RF Auto-Matching | Yes |
| Max Anode Power | >1 kW |
| Max Ion Beam Current | >1000 mA |
| Ion Beam Energy | 100–1200 eV |
| Grid Diameter | 38 cm (Φ) |
| Grid Material | Molybdenum |
| Beam Optics | OptiBeam™ Self-Aligning Ion Optics |
| Beam Profiles | Collimated, Focused, or Divergent |
| Neutralizer | LFN-2000 |
| Operating Gases | Ar, O₂, N₂, and other process gases |
| Gas Flow Rate | 5–50 sccm |
| Chamber Pressure | < 0.5 mTorr |
| Mounting Flange | 12″ CF |
| Height | 38.1 cm |
| Diameter | 58.2 cm |
| Applications | Ion Beam Etching (IBE), Sputter Deposition, Surface Cleaning, Ion Assisted Deposition (IAD) |
| Brand | k-Space |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | KSA RateRat |
| Price Range | USD $13,500 – $40,500 (based on configuration) |
| Compatible Target Materials | Metals and Semiconductors |
| Brand | KYKY |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | SBC-2 |
| Vacuum System | Mechanical Pump + Turbo Molecular Pump |
| Ultimate Vacuum | ≤2 × 10⁻³ Pa |
| Sputtering Voltage | 3 kV |
| Sample Stage Motion | Planar Rotation + Tilt Rotation |
| Carbon Evaporation Target Diameter | Φ38 mm |
| Sample Holder Diameter | Φ40 mm |
| Bell Jar Dimensions | Φ250 mm × H340 mm |
| Evaporation Glass Dome | Φ88 mm × H140 mm |
| Sputtering Glass Dome | Φ88 mm × H57 mm |
| Brand | LUXOR (Aptco Technologies, Belgium) |
|---|---|
| Origin | Belgium |
| Model | LUXOR Au |
| Target Material | Gold (Au) |
| Coating Method | Magnetron Sputtering |
| Operating Atmosphere | Air or Argon |
| Max. Magnification Compatibility | 50,000× (for Tungsten Filament & Desktop SEMs) |
| Sample Capacity | Up to 7 × 12 mm stubs or 3 × 25 mm stubs |
| Target Diameter | 30 mm |
| Target Thickness | 100 µm |
| Brand | LUXOR (Aptco Technologies, Belgium) |
|---|---|
| Origin | Belgium |
| Model | LUXOR C |
| Evaporation Source | Bradley-type carbon rod |
| Max. Sample Capacity | 7 × 12.5 mm pin stubs or 3 × 25 mm pin stubs |
| Design | Inverted configuration |
| Automation Level | Fully automated touchscreen interface |
| Compliance | CE-marked, designed for ISO/IEC 17025-compliant labs, compatible with GLP/GMP documentation workflows |
| Brand | LUXOR (Aptco Technologies) |
|---|---|
| Origin | Belgium |
| Model | LUXOR Pt |
| Target Material | Platinum (99.999% purity, 30 mm diameter × 100 µm thickness) |
| Operating Atmosphere | Argon only |
| Sample Capacity | Up to 7 × 12.5 mm or 3 × 25 mm pin-mount samples |
| Design | Inverted chamber with integrated sample stage |
| Automation Level | Fully automated via capacitive touchscreen interface |
| Safety | Fully enclosed high-voltage circuitry |
| Compliance | Designed for GLP-compliant SEM sample preparation workflows |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | Cluster |
| Substrate Size | 30 × 40 cm |
| Chamber Configuration | 8-port cluster architecture |
| Deposition Methods | Plasma-Enhanced CVD (PECVD), Hot-Wire CVD (HWCVD), DC/RF Sputtering |
| Control System | Fully computer-integrated with programmable process sequencing |
| Category | Cluster-Type Thin-Film Deposition System |
| Import Status | Imported Equipment |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | MVS-PECVD |
| Price | USD $1,000,000 |
| Chamber Configuration | Modular Cluster Tool (8–10 port), In-Line, or Single-Chamber Options |
| Substrate Compatibility | Rigid (15.6×15.6 cm, 30×40 cm) and Flexible Web (15–30 cm width) |
| Deposition Technologies | PECVD, HWCVD, Sputtering, Annealing |
| Vacuum Architecture | High-Vacuum (≤1×10⁻⁷ Torr base pressure) |
| Process Control | Fully Computer-Controlled with Real-Time Parameter Logging |
| In-Situ Characterization Option | Integrated UHV-compatible optical/electrical test module |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | Reel-to-Reel Cassette System |
| Web Width | 15 cm – 30 cm |
| Process Capabilities | PECVD, HWCVD, Sputtering |
| Patent | US Patent No. 6,258,408B1 |
| Architecture | 8-Port Cluster Tool with Robotic Cassette Transport |
| Control | Fully Computer-Controlled |
| Chamber Independence | Individual Chamber Servicing Enabled |
| Cross-Contamination Mitigation | Cassette-Based Isolation Between Process Steps |
| Compliance | Designed for GLP/GMP-aligned thin-film R&D environments |
| Brand | MVSystems |
|---|---|
| Origin | USA |
| Model | SiNx-PECVD |
| Throughput | >475 wafers/hr |
| SiNx Film Uniformity | <5% (1σ, across 156 mm × 156 mm wafer) |
| Deposition Technology | RF (13.56 MHz) Plasma-Enhanced CVD |
| Precursor Gases | Silane (SiH₄) and Ammonia (NH₃) |
| Substrate Temperature | 200–400 °C |
| Chamber Configuration | Single-wafer, Load-lock compatible |
| Process Control | Fully automated recipe-based operation with real-time RF power, pressure, and gas flow monitoring |
| Brand | Nano-Master |
|---|---|
| Origin | USA |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported Equipment |
| Model | NTE-3500 (M) |
| Price Range | USD 110,000 – 140,000 |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | PlasmaPro 100 Cobra |
| Wafer Capacity | Single-wafer and batch processing up to 200 mm |
| Temperature Range | −150 °C to +400 °C |
| Electrode Cooling/Heating | Liquid nitrogen, recirculating chiller, or resistive heating |
| RF Power Delivery | Top-mounted electrode with dual-frequency (LF/RF) capability |
| ICP Source Options | 65 mm, 180 mm, 300 mm |
| Process Pressure Range | Wide operational window enabled by high-pumping-speed vacuum system |
| Substrate Thickness Compatibility | Up to 10 mm |
| Backside He–cooling | Integrated electrostatic chuck with helium backside cooling |
| Endpoint Detection | Real-time optical emission spectroscopy (OES) monitoring |
| Chamber Architecture | Symmetric, low-inductance plasma chamber with uniform gas distribution and high-conductance pumping path |
| Brand | Paratronix |
|---|---|
| Origin | USA |
| Model | V494 (Vertical) / H1092 (Horizontal) |
| Voltage Options | Internal Transformer Supported |
| Cooling | Integrated Mechanical Chiller (LN₂-Free) |
| Control System | PLC with Touchscreen HMI (Rotating & Tilting Pod), USB & Ethernet Connectivity |
| Operation Modes | Manual, Semi-Automatic Batch, Recipe-Driven Deposition |
| Safety Features | Over-Temperature Cut-off, Vacuum-Level Interlock, Alarm History Logging |
| Compliance | UL 508A (US/CAN), CE Marked |
| Warranty | 1 Year |
| Brand | PW (Yuelian) |
|---|---|
| Origin | Guangdong, China |
| Model | PW-TB320 |
| Coating Method | Wire-Bar (Standard ISO/GB Compliant, Optional Selection) |
| Coating Width | 300 × 420 mm |
| Travel Range (X-axis) | 300 × 420 mm |
| Coating Speed | Adjustable 1–5 m/min |
| Drive System | Infinitely Variable AC Motor |
| Control Interface | Dedicated Panel with Coating/Return/Stop/Speed Adjustment |
| Weighting System | Dual-Side Adjustable Counterweights |
| Wire-Bar Length | 400 mm |
| Power Supply | 110–220 V AC, 50/60 Hz |
| Rated Power | 120 W |
| Net Weight | 20 kg |
| Overall Dimensions | 710 × 420 × 285 mm (L×W×H) |
| Accuracy | Dependent on Wire-Bar Tolerance per ISO 2137 and GB/T 9278 |
| Brand | Safematic |
|---|---|
| Origin | Switzerland |
| Model | CCU-010 LV_CT |
| Vacuum Type | Low-Vacuum Thermal Evaporation System |
| Coating Method | Resistive Thermal Evaporation (Carbon Rope Feed) |
| Plasma Treatment | Optional Integrated Glow Discharge (GD-010) and Plasma Etching (ET-010) Modules |
| Thickness Monitoring | Dual-Position Quartz Crystal Microbalance (QCM) |
| Control Interface | TFT Touchscreen + Windows-Based Remote Software (RC-010) |
| Sample Stage | Ø ≥60 mm, Height-Adjustable & Tilt-Compatible |
| Compliance | Designed for SEM/EDS Sample Preparation per ISO 13822, ASTM E1558, and GLP-Compliant Workflow Support |
| Brand | SDI |
|---|---|
| Origin | Japan |
| Model | MD-0408-N1-CE |
| Max Travel | 800 mm |
| Min Speed | 1 nm/s |
| Max Speed | 60 mm/s |
| Speed Resolution | 1 nm/s |
| Programmable Speed Steps | 16 |
| Preset Programs | 8 |
| Display Language | English/Japanese (toggleable) |
| Control Interface | Touchscreen Panel |
| Motor Feedback | Real-time speed, position, and remaining runtime |
| Operation Modes | Continuous, Manual (independent up/down speed), Reciprocal |
| Stop Positions | 16 configurable |
| Dwell Times | 16 programmable |
| Standard Clamp Material | Polypropylene (PP) |
| Power Supply | AC 100 V, 250 VA |
| Max Sample Height | 150 mm |
| Max Load Capacity | 1 kg |
| Brand | SDI |
|---|---|
| Origin | Japan |
| Model | ND-0407-N1-CE |
| Z-Axis Travel | 100 mm |
| X-Axis Travel | 100 mm |
| Minimum Withdrawal Speed | 1 nm/s |
| Maximum Withdrawal Speed | 60 mm/s |
| Speed Control Resolution | 1 nm/s |
| Programmable Speed Change Points | 16 |
| Programmable Stop Positions | 16 |
| Programmable Dwell Times | 16 |
| Stored Motion Programs | 8 |
| Max Load Capacity | 500 g |
| Max Substrate Height | 100 mm |
| Power Supply | AC 100 V, 300 VA |
| Dimensions (Unit) | 442 × 250 × 451 mm |
| Dimensions (Control Box) | 300 × 285 × 163 mm |
| Standard Clamp Material | Polypropylene (PP) |
| Operating Languages | English & Japanese (toggleable) |
| Brand | Syskey |
|---|---|
| Origin | Taiwan |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China (Taiwan Region) |
| Model | Sputter 16 |
| Vacuum Base Pressure | ≤2×10⁻¹⁰ Torr |
| Pumping System | Pfeiffer HiPace 800/1000 Molecular Pumps + KRI KDC-300 Ion Source |
| Sputtering Cathodes | 4 (Independent RF/DC configurable) |
| Substrate Manipulator | 4-Axis (Rotation + XYZ Translation) |
| Heater | SiC Radiant Heater (up to 800 °C) |
| Gas Flow Control | Precision MFCs with Throughput Regulation |
| Compliance | ISO 27001-certified distribution & GLP-aligned installation support |
| Brand | TQC Sheen |
|---|---|
| Origin | Netherlands |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Automatic Film Applicator |
| Pricing | Upon Request |
| Traverse Speed | 0.1–500 mm/s |
| Stroke Length | 50–430 mm (1.97–16.34 in) |
| Vacuum Zones | DIN A5, DIN A4, DIN A3 |
| Control Interface | 5-key navigation switch, optional mouse & keyboard |
| Memory Capacity | Expanded user profile storage |
| Optional Heating Module | Integrated temperature-controlled base for thermal coating studies |
| Brand | ULVAC |
|---|---|
| Model | EI-5Z |
| Evaporation Sources | Dual-mode (Electron Beam + Resistive Thermal) |
| Substrate Compatibility | 2–8 inch wafers (Si, GaAs, glass, ceramics) |
| Base Pressure | ≤3.0 × 10⁻⁵ Pa |
| Pumping Speed | Achieves 3.0 × 10⁻⁴ Pa in ≤20 min |
| Thickness Uniformity | ±5% across substrate |
| Control System | Fully Automated PLC-Based Interface |
| Chamber Configuration | Vertical-Incidence Deposition |
| Optional Integration | Wall-Through (Penetrating) Design |
| Material Compatibility | Au, Ag, Al, Cr, Ni, Ti, ITO, SiO₂, Al₂O₃, and other conductive/insulating evaporants |