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| Brand | PIE |
|---|---|
| Origin | USA |
| Model | EM-KLEEN |
| RF Frequency | 13.56 MHz |
| RF Power | 75 W |
| Control | Fully Automated |
| Gas Configuration | Single- or Triple-Gas Mixing System (O₂, H₂, Ar, N₂, CF₄, NF₃, NH₃, HF, H₂S) |
| Plasma Type | Remote Inductively Coupled Plasma (ICP), Non-Microwave, Non-Underfill, Non-Wafer-Specific |
| Chamber Compatibility | Direct integration with SEM, FIB-SEM, TEM, XPS, ALD, CD-SEM, EBR, EBI, EUVL, and other UHV/XHV systems |
| Sample & Chamber Cleaning | Simultaneous in-situ cleaning of both specimen surface and vacuum chamber interior |
| Plasma Intensity Monitoring | Integrated real-time plasma emission sensor |
| Flow Control | Pressure-feedback-based automated mass flow control (no manual needle valve) |
| User Interface | Capacitive touchscreen with 60 programmable cleaning protocols |
| Safety Modes | Dual-mode operation (Smart Safety Mode + Expert Control Mode) |
| Scheduling | SmartSchedule™ logic triggered by chamber venting cycles, sample load count, or time-based intervals |
| Electromagnetic Compatibility | Low-EMI architecture |
| Optional Upgrades | Sapphire plasma tube assembly |
| Brand | PIE Scientific |
|---|---|
| Origin | USA |
| Model | SEMI-KLEEN |
| RF Frequency | 13.56 MHz |
| RF Power Output | 0–100 W (continuously adjustable) |
| Max Input Power | 200 W |
| Vacuum Interface | KF40 (NW40) flange |
| Ignition Pressure | <0.1 mTorr |
| Operating Pressure Range | <0.1 mTorr to >1.0 Torr |
| Leak Rate | <0.005 sccm |
| Gas | Ambient air (no external gas supply required) |
| Control | Microprocessor-based touchscreen interface with programmable cleaning protocols |
| Plasma Monitoring | Integrated real-time plasma intensity sensor |
| Automatic RF Matching | Yes |
| Particle Filtration | Dual-stage proprietary particulate filter compliant with semiconductor-grade cleanliness requirements |
| Compliance | Designed for GLP/GMP-adjacent vacuum system maintenance |
| Brand | PIE Scientific |
|---|---|
| Model | Tergeo EM |
| Origin | USA |
| RF Frequency | 13.56 MHz |
| RF Power | 75 W (optional 150 W) |
| Chamber Dimensions | Ø110 mm × Depth 280 mm |
| Chamber Volume | 2.6 L |
| Chamber Material | High-Purity Fused Quartz |
| Gas Inlets | 2 standard, optional 3rd inlet |
| Control Interface | 7-inch full-color touchscreen, fully automated |
| Plasma Type | Capacitively Coupled RF Plasma (CCP), no microwave, no downstream-only, no wafer-specific configuration |
| Compliance | Designed for GLP-compliant lab environments |
| Brand | Safematic |
|---|---|
| Origin | Switzerland |
| Model | CCU-010 HV_SP-010 |
| Sputtering Target Materials | Au, Pt, Cr, Al, Ir, W, C, ferromagnetic materials, ITO, DLC |
| Control Mode | Fully Automatic |
| Sample Stage Diameter | ≥60 mm |
| Sputtering Gas | Argon or Air |
| Vacuum System | Integrated diaphragm pump + turbomolecular pump |
| Vacuum Measurement | Full-range (Pirani + cold cathode gauge) |
| Film Thickness Monitoring | Dual-position FTM sensor with real-time feedback |
| Brand | PIE Scientific |
|---|---|
| Origin | USA |
| Model | Tergeo Basic |
| RF Frequency | 13.56 MHz |
| RF Power | 75 W (optional 150 W) |
| Chamber Internal Diameter × Depth | 110 mm × 280 mm |
| Chamber Volume | 2.6 L |
| Chamber Material | High-Purity Fused Quartz |
| Gas Inlets | 2 standard, optional 3rd |
| Control Interface | 7-inch full-color touchscreen, fully automated |
| Plasma Type | Capacitively Coupled RF Plasma (CCP), non-microwave, non-underfill, non-wafer-specific |
| Compliance | CE, RoHS, FCC Class A |
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