LabCompanion TH-225-9 Linear Rapid Temperature Change Chamber
| Brand | LabCompanion |
|---|---|
| Origin | Guangdong, China |
| Manufacturer | Hongzhan Technology Co., Ltd. |
| Model | TH-225-9 |
| Temperature Range | −70 °C to +150 °C |
| Temperature Fluctuation | ±0.5 °C |
| Temperature Uniformity | ≤2.0 °C |
| Temperature Deviation | ±2.0 °C |
| Heating Rate | 1–25 °C/min (linear or non-linear) |
| Cooling Rate | 1–25 °C/min (linear or non-linear) |
| Working Chamber Dimensions | 600 × 750 × 500 mm (W × H × D) |
Overview
The LabCompanion TH-225-9 Linear Rapid Temperature Change Chamber is an engineered environmental test system designed for precise, repeatable, and programmable thermal stress profiling across a wide operational range. Based on forced-air convection with dual-stage refrigeration and high-efficiency electric heating, the chamber delivers controlled linear or non-linear temperature transitions—critical for evaluating material integrity, solder joint reliability, packaging performance, and electronic component behavior under accelerated thermal cycling conditions. Its architecture supports both steady-state and dynamic thermal profiles in accordance with IEC 60068-2-14 (change of temperature), MIL-STD-810H Method 503.7, and JESD22-A104D (Temperature Cycling). The chamber operates within a certified ISO 9001:2015, ISO 14001:2015, and ISO 45001:2018 quality management framework, ensuring traceability, process consistency, and compliance-ready documentation for GLP/GMP and aerospace-grade validation protocols.
Key Features
- Wide operational temperature range from −70 °C to +150 °C, achieved via cascade refrigeration and PID-controlled resistive heating elements
- High-fidelity thermal control: temperature fluctuation ±0.5 °C (at setpoint), uniformity ≤2.0 °C across working volume, and deviation ±2.0 °C (per IEC 60068-3-5)
- Programmable ramp rates from 1 to 25 °C/min—configurable as linear, step, or custom-defined profiles with dwell, hold, and transition segments
- Stainless steel inner chamber (SUS304) with double-wall insulation and anti-condensation design for long-term stability and low maintenance
- Integrated safety architecture including over-temperature cut-off, compressor high-pressure protection, phase failure detection, and door interlock monitoring
- Modular controller interface supporting RS485/Modbus RTU, Ethernet (TCP/IP), and optional USB data logging for integration into centralized lab management systems
Sample Compatibility & Compliance
The TH-225-9 accommodates samples up to 600 mm (W) × 750 mm (H) × 500 mm (D), suitable for PCB assemblies, automotive ECUs, battery modules, optical sensors, and small mechanical subassemblies. Its chamber geometry and airflow distribution meet ASTM E145 Class B requirements for air circulation uniformity. All thermal calibration reports are NIST-traceable and include uncertainty budgets per ISO/IEC 17025. The system complies with CE marking directives (2014/30/EU EMC, 2014/35/EU LVD), RoHS 2011/65/EU, and is pre-validated for use in environments requiring adherence to FDA 21 CFR Part 11 (with optional audit trail and electronic signature modules).
Software & Data Management
Control and monitoring are performed via LabCompanion’s proprietary WinTest Pro v4.2 software—compatible with Windows 10/11 and supporting multi-user role-based access (Operator, Engineer, Administrator). The platform enables real-time graphing, profile scheduling, alarm event logging, and automatic report generation in PDF/CSV formats. Data integrity is ensured through time-stamped records with cryptographic hashing, version-controlled firmware updates, and configurable data retention policies. Optional cloud synchronization (AWS IoT Core compatible) allows remote diagnostics, predictive maintenance alerts, and integration with MES/QMS platforms such as TrackWise or Veeva Vault.
Applications
- Thermal cycling qualification of avionics hardware per DO-160 Section 4.5
- Reliability screening of semiconductor packages (e.g., QFN, BGA) per JEDEC JESD22-A104D and A110B
- Accelerated aging studies for lithium-ion battery cells and modules under variable-rate thermal stress
- Validation of conformal coatings, potting compounds, and encapsulants for coefficient of thermal expansion (CTE) mismatch analysis
- Pre-compliance testing for automotive electronics per ISO 16750-4 and AEC-Q200 stress categories
- Material characterization of polymers, composites, and adhesives under controlled thermal gradients
FAQ
What is the difference between linear and non-linear ramp modes?
Linear mode maintains a constant rate (e.g., 15 °C/min) throughout the transition; non-linear mode allows user-defined rate variation per segment—enabling simulation of real-world thermal transients such as engine start-up or solar loading.
Can the chamber be validated for IQ/OQ/PQ protocols?
Yes—the TH-225-9 ships with a full validation support package including URS templates, FAT/SAT checklists, calibration certificates, and documented risk assessments aligned with GAMP5 and Annex 15 guidelines.
Is remote monitoring supported without additional hardware?
Standard Ethernet connectivity enables secure remote access via HTTPS-enabled web interface; no external gateway or PLC is required for basic status and log retrieval.
Does the system support third-party calibration services?
All chambers are shipped with a NIST-traceable calibration certificate; accredited third-party providers (e.g., TÜV SÜD, SGS, UL) can perform field recalibration using the built-in sensor mapping and adjustment routines.
What maintenance intervals are recommended?
Refrigerant circuit inspection every 24 months, condenser coil cleaning every 3 months (in dusty environments), and annual verification of thermocouple accuracy against reference standards per ISO/IEC 17025.
