Semiconductor Instruments
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| Brand | GuanCe |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GCGEST-125 |
| Price | USD 1,560 (FOB Beijing) |
| Measurement Principle | Four-Terminal DC Voltage-Current Method (Constant Current Source + High-Impedance Voltmeter) |
| Resistivity Range | 1.0×10⁻⁴ – 1.0×10⁵ Ω·cm |
| Resolution | 1.0×10⁻⁶ Ω·cm |
| Voltage Ranges | 2 mV / 20 mV / 200 mV / 2 V |
| Voltage Accuracy | ±(0.5% rdg + 2 digits) for 20 mV–2 V range |
| Current Outputs | 10 μA, 100 μA, 1 mA, 10 mA, 100 mA |
| Current Accuracy | ±(0.5% rdg + 2 digits) |
| Electrode Contact Width | 5 mm |
| Electrode Contact Force | 0.6 N |
| Sample Thickness Input | Manual entry via front-panel keypad |
| Display | Triple 4½-digit LED (voltage, thickness, resistivity) |
| Power Supply | 220 V ±10%, 50/60 Hz, <50 W |
| Brand | Guarder |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GDR-30PR |
| Dimensions (W×D×H) | 630 × 650 × 420 mm |
| Chamber Volume | ~30 L (290 × 290 × 360 mm) |
| Electrode Size | 180 × 210 mm (capacitively coupled, internal) |
| RF Generator | 13.56 MHz, 0–300 W continuous adjustable output with auto-impedance matching |
| Optional | 40 kHz medium-frequency plasma source |
| Control System | 7-inch HMI touchscreen + PLC (Omron/Siemens components), manual/auto modes |
| Vacuum System | Leybold vacuum pump, SMC isolation & vent valves, Inficon pressure sensor |
| Pressure Control | PID closed-loop regulation, ±1 Pa accuracy |
| Gas Delivery | Dual-channel, FITOK gas lines, mass flow controllers + needle valves |
| Operating Modes | RIE (Reactive Ion Etching) and PE (Plasma Enhanced) selectable |
| Compliance | Designed for ISO Class 5–7 cleanroom environments, compatible with GLP laboratory workflows |
| Brand | HAIDA INTERNATIONAL |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic (PRC-Made) |
| Model | HAIDA HDV-001 Membrane Mechanical Strength Tester for Battery Separators |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Hakuto IBE-4000 |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 20 IBE-C |
| Pricing | Upon Request |
| Brand | Hitachi |
|---|---|
| Origin | Japan |
| Model | IM400II / ArBlade 5000 |
| Sample Stage Cooling | Yes (Optional) |
| Vacuum Transfer Capability | Yes (Optional) |
| Dual-Stage Milling Mode | Yes |
| Touchscreen Interface | Yes |
| Maximum Cross-Section Width | 8 mm (±5 mm Traverse Range) |
| Ion Gun Configuration | PLUS Ion Gun (IM400II), PLUS II Ion Gun (ArBlade 5000) |
| Compliance | Designed for SEM/TEM sample preparation per ISO 14644-1 Class 5 cleanroom-compatible operation |
| Brand | HORIBA |
|---|---|
| Origin | Japan |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported |
| Model | PD-Xpadion |
| Pricing | Available Upon Request |
| Particle Detection Sensitivity | 0.5 µm (standard), 0.35 µm (optional), 0.1 µm (with RP-1 integration) |
| Throughput | 12 min per mask (front + back side scan) |
| Mask Size Compatibility | 5-inch to 9-inch |
| Uptime | ≥98% |
| MTBF | 1500 hours |
| Scan Surfaces | Glass substrate, thin-film layer, and patterned side (3-sided inspection) |
| Scan Time per Side | ≤4 minutes |
| Automation Interface | OHT, EFEM, SECS/GEM compliant |
| Optional Modules | Raman-based particle characterization, film thickness & uniformity mapping, film health monitoring, integrated particle removal (RP-1 system) |
| Brand | Hprobe |
|---|---|
| Origin | France |
| Model | IBEX-300 |
| Wafer Compatibility | 100–300 mm |
| Magnetic Field Orientation | Full 3D vector control (in-plane & out-of-plane) |
| Field Scan Speed | Sub-second field reorientation |
| Integrated Calibration | On-board Hall sensors with traceable calibration |
| Software Suite | MRAM characterization, sensor parameter extraction, and automated test sequencing |
| Probe Interface | Compatible with standard RF/microwave and DC probe cards |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments and GLP-compliant magnetic device qualification |
| Brand | EWIN-TECH |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | HPT-L7 |
| Pricing | Upon Request |
| Brand | IBS |
|---|---|
| Origin | France |
| Model | FLEXion 200/400 |
| Product Type | Medium-Current Ion Implanter |
| Wafer Size Compatibility | 8-inch to 12-inch |
| Implant Energy Range | 50 keV (configurable down to 3 keV or up to 400–600 keV for multiply charged species) |
| Primary Implant Species | p⁺ (¹¹B, ³¹P, ⁷⁵As, etc.) |
| Beam Current | >600 µA (¹¹B⁺), >1500 µA (³¹P⁺ or ⁷⁵As⁺) at 120–200 keV |
| Dose Range | 1×10¹¹ – 1×10¹⁸ atoms/cm² |
| Uniformity | <1.0% (1σ) across wafer under standard conditions |
| Vacuum | <7×10⁻⁷ mbar in beamline and target chamber |
| Gas Lines | 5 integrated (BF₃, PH₃, AsH₃, Ar, N₂) with real-time gas consumption monitoring and cylinder-end detection |
| Brand | IBS |
|---|---|
| Origin | France |
| Model | IMC210 |
| Product Type | Medium-Current Ion Implanter |
| Application Domain | IC Fabrication & Semiconductor Doping |
| Implant Energy | 50 keV (adjustable 20–200 keV, upgradable to 3 keV or 400/600 keV for multiply charged ions) |
| Wafer Size Compatibility | 8-inch and 12-inch wafers (backward-compatible with 6-inch, 2–5-inch, and irregular substrates down to 1 cm²) |
| Implant Species | p⁺ (e.g., ¹¹B, ³¹P, ⁷⁵As), Al⁺, H⁺, N⁺, He⁺, Ar⁺ |
| Beam Current | >600 µA (¹¹B⁺), >1500 µA (³¹P⁺ or ⁷⁵As⁺) at 120–200 keV |
| Dose Range | 1×10¹¹ – 1×10¹⁸ atoms/cm² |
| Uniformity | <1.0% 1σ (measured on 6″ Si wafers with 100 nm SiO₂, ¹¹B⁺ at 100 keV, 1×10¹⁴ atoms/cm²) |
| Vacuum | Ion source <2×10⁻⁶ mbar |
| Gas Delivery | Integrated 5-channel system (BF₃, PH₃, AsH₃, Ar, N₂) with real-time gas consumption monitoring and cylinder endpoint detection |
| Brand | Instec |
|---|---|
| Origin | USA |
| Model | HCP621G-PM |
| Temperature Range | -190 °C to 600 °C (LN₂ required for sub-ambient operation) |
| Heating/Cooling Rate | +80 °C/min (heating at 100 °C), -50 °C/min (cooling at 100 °C) |
| Temperature Stability | ±0.05 °C (>25 °C), ±0.1 °C (<25 °C) |
| Temperature Resolution | 0.01 °C |
| Control Sensor | 100 Ω Pt RTD |
| Control Method | PID with LVDC low-noise power supply |
| Heating Area | 28 mm × 30 mm |
| Sealing | Hermetic chamber (N₂ or inert gas compatible) |
| Optical Access | Removable φ38 mm viewport, ±60.7° viewing angle, 8.5 mm objective working distance |
| Electrical Interface | Standard BNC, optional triaxial for pA-level measurements |
| Probe Type | Manual lever-actuated Re-W bent probes |
| Sample Stage Grounding | Default grounded, optional floating or triaxial back-electrode configuration |
| Optional Modifications | Non-magnetic construction, internal feedthroughs, transmission-mode optical port, in-chamber wiring posts |
| Operation Mode | Manual probe positioning |
| Compliance | Designed for ASTM F1528, ISO/IEC 17025-aligned lab environments, supports GLP/GMP traceability via software SDK |
| Brand | Jandel |
|---|---|
| Origin | United Kingdom |
| Model | Cartridge |
| Probe Spacing Options | 0.500 mm, 0.635 mm, 1.00 mm, 1.27 mm, 1.591 mm (±10 µm tolerance) |
| Tip Material | Tungsten Carbide (standard) |
| Tip Diameter | 0.4 mm (standard), 0.3 mm (for high-density spacing) |
| Tip Radius of Curvature | 12.5, 25, 40, 100, 150, 200, 300, or 500 µm |
| Flatness | ≥ ±0.025 mm |
| Tip Load Range | 10 g to 250 g |
| Insulation Resistance | ≥10¹³ Ω at 500 V (between adjacent probes) |
| Probe Arrangement | Linear or rectangular |
| Buffer Zone | 0.5 mm |
| Automation Level | Manual |
| Brand | JEOL |
|---|---|
| Origin | Japan |
| Model | JBX-9500FS |
| Acceleration Voltage | 100 kV |
| Maximum Substrate Size | 300 mm Ø wafers or 6-inch masks |
| Maximum Field Size | 1000 µm × 1000 µm |
| Stage Travel Range | 260 mm × 240 mm |
| Minimum Positioning Unit (LBC) | 0.15 nm (λ/4096) |
| Overlay Accuracy | ≤ ±11 nm |
| Field Stitching Accuracy | ≤ ±10 nm |
| In-Field Placement Accuracy | ≤ ±9 nm |
| Position DAC Resolution | 20-bit |
| Scan DAC Resolution | 14-bit |
| Scan Step Size | 0.25 nm |
| Maximum Scan Rate | 100 MHz |
| Electron Source | ZrO/W Schottky Emitter |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | MPPS |
| Maximum Wire Saw Speed | 400 mm/s |
| Sample Stage | Vacuum-Chuck with Rotatable Platform (Max Ø200 mm) |
| Angular Adjustment Resolution | 0.006° (Range ±4°) |
| Scribing Stroke Length | 250 mm |
| Scribing Width | 240 mm |
| Positioning Accuracy | 0.01 mm |
| Max Sample Thickness | 10 mm |
| Adjustable Scribing Force | 5–581 g |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Manual Pull Testing System for Wire Bond Strength Evaluation |
| Measurement Principle | Mechanical Force Transduction via Precision Dial Gauge |
| Test Modes | Destructive and Non-Destructive Pull Testing |
| Vertical Travel Range | 10–150 mm (Coarse) + Micrometer-Driven Fine Adjustment (0.1 mm resolution) |
| Hook Tip Diameter | 15–50 µm |
| Max Test Wire/Die Bond Diameter | 200 µm |
| Z-Axis Control | Manual Handwheel |
| Damping Mechanism | Adjustable Mechanical Damping to Suppress Vibration Artifacts |
| Preset Force Threshold | User-Adjustable for Non-Destructive Mode |
| Compliance | Designed to Support ISO/IEC 17025 Traceability Requirements (Manual Recording Pathway) |
| Optional Accessories | High-Precision XYZ+Theta Stage (25 × 25 mm travel, 1 µm resolution |
| Brand | JFP |
|---|---|
| Origin | France |
| Type | Imported Semiconductor Assembly & Packaging Equipment |
| Model | PP Stacker |
| Application | Precision Pick-and-Place, Stacking & De-stacking of Laser Diode Bars |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Software | JFP StackerControl v3.2 with Audit Trail & Event Logging |
| Power Supply | 100/230 VAC, 1 kW |
| Pneumatic Requirements | Dry air at 5 bar, vacuum ≥90% |
| Dimensions (W×D×H) | 900 × 830 × 1750 mm |
| Throughput | 600 units/hour (single bar + single spacer cycle) |
| Pick-up Force | <5 g (non-damaging micro-handling) |
| XY Stage Resolution | 1 µm (micrometer-adjustable manual stage) |
| Vision System | Triple 5 MP color cameras (vertical orientation), independent digital video control, LED illumination (adjustable intensity), field-of-view up to 20 mm, continuous optical zoom, 11× digital zoom, PIP mode (3 windows), calibrated scale bar (0.6 mm @ 20×) |
| Sample Compatibility | Laser diode bars (max. 18 mm length |
| Tooling Options | Manual blue-tape ejection kit |
| Brand | JFP |
|---|---|
| Country of Origin | France |
| Model | PP6 / PP7 / MPS |
| Type | Manual Semiconductor Die Bonder & Pick-and-Place System |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Control Interface | Ergonomic joystick + 7-inch capacitive touchscreen |
| Optical System | UHD coaxial camera with adjustable magnification (10×–100×) |
| Bonding Capabilities | Epoxy, solder, eutectic, and formic acid-compatible chucks |
| Max Substrate Thickness | 100 mm |
| Min Die Size | 70 µm × 70 µm |
| Placement Accuracy | ±1 µm (repeatability under controlled lab conditions) |
| Optional Modules | Flip-chip alignment stage, dispensing module, ultrasonic bonding head, thermal chuck (60–250 °C) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | PP7 |
| Type | Semi-Automatic Pick-and-Place Die Bonder for Precision Semiconductor Assembly |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Mechanical Architecture | Vibration-isolated granite base with motorized Z-axis and coaxial optical alignment system |
| Imaging | Dual-axis programmable high-magnification telecentric optics with real-time focus tracking |
| Placement Accuracy | ≤ ±1.5 µm (3σ, under controlled environmental conditions) |
| Bond Height Independence | Achieved via dynamic focus-servo loop synchronized with Z-motion control |
| Substrate Compatibility | Wafers (up to 8″), ceramic packages, leadframes, and custom carriers with curvature compensation |
| Tooling Interface | Standard vacuum nozzle exchange (ISO 9409-1-22-6-40) |
| Software Platform | JFP ControlSuite v4.x with audit trail, user-level permissions, and exportable placement logs (CSV/Excel) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S100 Semi-Automatic Scribe & Break System |
| Scribing force range | 10–80 g (constant-weight mechanism, optional auxiliary weights) |
| Diamond scribe tip | adjustable angle and rotational orientation |
| Wafer chuck capacity | up to 4-inch diameter |
| Die size compatibility | 100 µm × 100 µm minimum to 10 mm × 10 mm maximum |
| Wafer thickness tolerance | ≥50 µm |
| XY stage resolution | 0.23 µm |
| Optical imaging system | 22″ TFT display + ultra-HD color camera |
| Digital zoom | ×10 electronic |
| Break mode | manual or programmable auto-actuation |
| Break mechanism | top rubber clamping + bottom linear blade actuation |
| Control interface | 7″ capacitive touchscreen |
| Y-axis scribing speed | 0.1–20 mm/s |
| Power supply | 100/230 VAC, 1 kW |
| Pneumatic supply | 70 psi |
| Vacuum requirement | full vacuum (100%), 15 L/min flow rate |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm (25 × 32 × 60 in) |
| Weight | 70 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | S200 Semi-Automatic Scriber and Breaker |
| Power Supply | 100–230 VAC, 1 kW |
| Air Pressure | 80 psi |
| Vacuum System | 100% vacuum, 15 L/min |
| Dimensions (W×D×H) | 650 × 820 × 1500 mm |
| Weight | 70 kg |
| Wafer Handling | 2″ to 8″ |
| Minimum Die Size | 100 µm × 100 µm |
| Maximum Die Size | 150 mm × 150 mm |
| Z-axis Force Range | 5–80 g (adjustable via calibrated weights) |
| Diamond Scribe Tip | Adjustable angle & rotation |
| XY Stage Resolution | 1 µm (display), ±5 µm (positioning accuracy) |
| Y-axis Scribing Speed | 0.1–100 mm/s |
| Optical System | 22″ TFT monitor, ultra-HD color camera, electronic zoom ×10, LED illumination, JFP crosshair reticle |
| Control Interface | 7″ touchscreen, programmable step indexing & vertical spacing, scribe count & die ID logging |
| Brand | JFP |
|---|---|
| Origin | France |
| Equipment Type | Automatic Wire Bonder |
| Model | WB 200-e |
| Bonding Technology | Thermosonic Ball Bonding with 360° Rotational Capillary Actuation |
| Max. Z-Travel | 40 mm |
| Z-Axis Resolution | 0.23 µm |
| XY-Stage Range | 80 × 80 mm |
| XY/Z Resolution | 0.23 µm |
| Ultrasonic Power Range | 0–5 W |
| Frequency | 62 kHz (standard), optional 40/80 kHz |
| Bond Force Range | 10–150 cN |
| Bond Time Range | 0–2000 ms |
| Wire Diameter Support | Au/Al 17–50 µm, Ribbon 40–250 µm (w) × 12–25 µm (t) |
| Heating Stage Temp. Range | 60–250 °C (±1% accuracy) |
| Vision System | 5 MP industrial camera, 8× optical zoom, programmable coaxial & oblique LED illumination |
| Footprint | 640 × 710 × 550 mm |
| Weight | 60 kg |
| Brand | JFP |
|---|---|
| Origin | France |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | WB200e |
| Pricing | Upon Request |
| Brand | k-Space |
|---|---|
| Origin | USA |
| Manufacturer Status | Authorized Distributor |
| Product Origin | Imported |
| Model | kSA 400 |
| Pricing | Upon Request |
| Brand | NIPPON FILCON |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kayaku Advanced Materials SU-8 2000 Series Photoresists |
| Pricing | Upon Request |
| Brand | Kingsemi |
|---|---|
| Model | KS-CF300/200-8SR |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Wet Cleaning System |
| Configuration | Dual-Stage Rotational Scrubbing with Edge & Backside Processing Capability |
| Control Interface | Customizable HMI with Digital Parameter Display & Industrial PC Data Logging |
| Compliance | Designed for ISO Class 1–5 cleanroom integration |
| Automation Interface | SECS/GEM compliant (optional) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Optical Patterned Defect Inspection System |
| Model | Candela® 6300 |
| Detection Sensitivity | Sub-0.1 Å surface roughness change |
| Spatial Bandwidth | 0.22–2000 µm |
| Measurement Modes | Radial & tangential topography profiling, roll-off analysis, texture uniformity, particle/scratch detection |
| Compliance | Designed for semiconductor and data storage manufacturing environments |
| Brand | KLA-Filmetrics |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported |
| Model | Candela® 8720 |
| Instrument Type | Optical Patterned Wafer Defect Inspection System |
| Primary Application | Automated wafer inspection with Statistical Process Control (SPC) integration |
| Wafer Diameter | 200 mm |
| Detection Principle | Multi-angle elastic and inelastic scattering imaging |
| Key Capabilities | Simultaneous dual-angle scatterometry, surface topography mapping, reflectance profiling, phase contrast imaging, and photoluminescence (PL) detection |
| Compliance | Designed for semiconductor fab environments compliant with SEMI E30 (SECS/GEM), ISO 9001, and industry-aligned GLP/GMP data integrity expectations |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | R54 |
| Automation Level | Semi-Automatic |
| Resistivity Measurement Range | 1 mΩ/□ to 200 Ω/□ |
| Resistivity Measurement Accuracy | < 0.02% |
| Z-Travel Range | 15 mm |
| XY Stage Type | Motorized |
| Max Sample Height | 15 mm |
| Max Sample Weight | 2.5 kg |
| 4PP Measurement Repeatability | < 0.02% |
| EC Measurement Repeatability | < 0.2% |
| Compatible Sample Sizes | Up to 300 mm Ø or A4 (210 × 297 mm) |
| Probe Configurations | Customizable rectangular, linear, polar, and user-defined mapping patterns |
| Dual-Mode Operation | Four-Point Probe (4PP) and Non-Contact Eddy Current (EC) |
| Brand | Klocke Nanotechnik |
|---|---|
| Origin | Germany |
| Model | Micro Production |
| Type | Precision Nanomanipulation & 3D Coordinate Metrology Platform |
| Application Domain | Semiconductor Process Development, In-situ SEM/TEM Nanomanipulation, MEMS/NEMS Characterization, Nanofabrication Integration |
| Compliance | Designed for ISO 14644-1 Class 5 cleanroom environments |
| Positioning Resolution | Sub-nanometer (≤1 nm) in X/Y/Z |
| Force Sensing Capability | Integrated piezoresistive microforce feedback (mN range) |
| Vacuum Compatibility | Fully compatible with high-vacuum SEM/TEM chambers (10⁻⁷ mbar and below) |
| Interface | Standardized flange mounts (CF, KF, or custom) for JEOL, Zeiss, Thermo Fisher (FEI), Hitachi, TESCAN, and Raith systems |