Semiconductor Instruments
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| Brand | Forge Nano |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PROMETHEUS |
| Quotation | Upon Request |
| Substrate Capacity | 5–5000 g powder |
| Process Temperature | Up to 200 °C |
| Precursor Channels | 2–8 |
| Weight | >200 kg |
| Footprint | Floor-Standing |
| Uniformity | Conformal atomic-layer coating across entire powder surface |
| Brand | Forge Nano |
|---|---|
| Origin | USA |
| Equipment Type | Import |
| Model | Prometheus XL 10(20)L Bench-Scale Fluidized-Bed ALD System |
| Process Temperature | up to 400 °C |
| Precursor Channels | 2–8 |
| Powder Capacity | up to 10 kg per batch |
| Coating Uniformity | sub-nanometer (nm-level) |
| Brand | Other brands |
|---|---|
| Origin | Hong Kong |
| Manufacturer Type | General distributor |
| Domestic/Imported | Domestic |
| Model | FP NanoPrinter |
| Price Range | USD 140,000 – 700,000 |
| Key Features | DMD-based dynamic holographic patterning |
| Laser Safety Class | Class 4 |
| XY/Z Feature Size | 142 nm / 175 nm |
| Resolution (Diffraction-Limited) | 285 nm / 500 nm |
| Layer Spacing | ≥ 0.05 µm |
| Throughput | 100 mm³/hr |
| Parallel Foci | ≥ 100 |
| Surface Roughness | ≤ 20 nm |
| Operating Temp | 23 ± 1 ℃ |
| RH | < 50% (recommended < 35%) |
| Vibration Requirement | Active isolation required |
| Power Supply | 220 V, > 35 A |
| Brand | pv-tools |
|---|---|
| Origin | Germany |
| Model | 4ppscan |
| Automation Level | Semi-Automatic |
| Max Test Current | 30 mA |
| Mapping Area | 10 × 10 cm |
| Measurement Duration (10×10 grid) | 4 min |
| Probe Tip Radius | 0.25 mm |
| Weight | 16 kg |
| Dimensions (L×W×H) | 36 × 48 × 24 cm |
| Vacuum Chuck Material | Borosilicate Glass |
| Probe Material | Tungsten Carbide |
| Software Features | Color-mapped resistivity visualization, histogram analysis, line-scan extraction, point re-measurement, I–V sweep linearity validation, auto-numbering |
| Brand | Freiberg Instruments |
|---|---|
| Origin | Germany |
| Model | MDPlinescan |
| Sample Type | Monocrystalline & Multicrystalline Silicon Wafers, Ingots, and Processed Substrates |
| Measurement Principle | µ-PCD (Microwave Photoconductance Decay) & Steady-State Photoconductance |
| Carrier Lifetime Range | 0.1 µs – 10 ms (typ.) |
| Resistivity Range | 0.2 – 10³ Ω·cm |
| Conductivity Type | p-type & n-type |
| Sample Dimensions | Up to 50 × 50 mm² |
| Hardware Interface | Ethernet (TCP/IP, Modbus TCP) |
| Power Supply | 24 V DC, 2 A |
| Dimensions | 174 × 107 × 205 mm |
| Weight | 3 kg |
| Compliance | CE, RoHS, IEC 61000-6-2/6-4 |
| Software Protocol | Standard OPC UA & RESTful API support |
| Brand | Freiberg Instruments |
|---|---|
| Origin | Germany |
| Model | MDPpro 850+ |
| Measurement Principle | Microwave Photoconductance Decay (µPCD) & Quasi-Steady-State Photoconductance (QSS-PCD/MDP) |
| Lifetime Range | 20 ns – 100 ms (for resistivity > 0.3 Ω·cm) |
| Scan Speed | Line scan < 30 s |
| Simultaneous Parameters | Minority carrier lifetime (µPCD/MDP), photoconductivity, resistivity |
| Sample Geometry Recognition | Automatic (G12, M10 bricks, wafers up to Ø300 mm) |
| Laser Sources | 980 nm IR diode (≤500 mW) + 905 nm IR diode (≤9 W) |
| Resistivity Range | 0.5 – 5 Ω·cm (custom ranges available) |
| Conductivity Type | p-type and n-type silicon |
| Compliance | SEMI PV9-1110, CE, ISO 9001 |
| Software Platform | MDP Studio (Windows 11+, .NET Framework, dual Ethernet) |
| Power Supply | 100–250 V AC, 6 A |
| Dimensions (W×H×L) | 2560 × 1910 × 1440 mm |
| Weight | ~200 kg |
| Brand | Freiberg Instruments |
|---|---|
| Origin | Germany |
| Model | MDPspot- |
| Minority Carrier Lifetime Range | 20 ns to several tens of ms |
| Penetration Depth | 500 µm |
| Sample Size | min. 50 × 50 mm², max. 12″ (300 mm) or 210 × 210 mm² |
| Resistivity Range | 0.2 – >10³ Ω·cm |
| Compatible Materials | Silicon, compound semiconductors, oxides, wide-bandgap materials, perovskites, epitaxial layers |
| Brand | FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Instrument |
| Model | FRT Optical Surface Metrology System |
| Pricing | Available Upon Request |
| Brand | FSM |
|---|---|
| Origin | USA |
| Model | FSM Inline & Dimensional Metrology |
| Temperature Range | Up to 900 °C (for 200 mm and 300 mm wafers) |
| Vacuum/Inert Gas Operation | Yes |
| TDS Capability | Yes |
| Wafer Size Support | 200 mm, 300 mm, 450 mm |
| Non-contact Optical Measurement | Yes |
| Laser Optical Lever (OptiLever®) Technology | Yes |
| Spatial Resolution (XY) | ±0.5 µm |
| Spectral Resolution (Raman option) | 0.1 cm⁻¹ |
| Brand | G&N |
|---|---|
| Origin | Germany |
| Model | MPS R400CV |
| Wafer Compatibility | 2″, 3″, 4″, 5″, 6″, 8″ |
| Chuck Flatness Error | ≤2 µm |
| Grinding Method | Z-axis plunge grinding with synchronized wafer and spindle rotation |
| Spindle Type | Integrated high-precision air-bearing spindle |
| Spindle Speed | 2560 rpm |
| Spindle Power | 3.7 kW |
| Grinding Wheel Diameter | 200 mm |
| Number of Spindles | 1 |
| Coarse/Fine Feed Range | 170 mm |
| Feed Resolution | ≤1 µm |
| Minimum Step Size | 0.1 µm |
| Coarse Grinding Rate | 2–1000 µm/min |
| Fine Grinding Rate | 2–1000 µm/min |
| Surface Roughness (Ra) | Down to 0.016 µm (with D7 diamond wheel) |
| Total Thickness Variation (TTV) | ≤3 µm per wafer |
| Inter-wafer Thickness Uniformity | ≤2 µm |
| Wheel Material | Diamond or CBN |
| Wheel Mounting | Single or dual-wheel configuration (manual or optional automatic change) |
| Chuck Sizes | Multiple vacuum chucks for 2″–8″ wafers |
| Sample Table Diameter | 400 mm |
| Sample Table Speed | 2–20 rpm |
| Control System | High-precision PLC-based controller with touchscreen HMI |
| Recipe Storage | Multiple programmable process recipes |
| Optional Module | In-situ thickness measurement unit |
| Enclosure | Fully enclosed grinding chamber |
| Machine Weight | 1130 kg |
| Footprint | 1640 × 1210 mm |
| Brand | G&P |
|---|---|
| Origin | South Korea |
| Model | GNP POLI-762 / POLI-500 / POLI-400L |
| Platen Diameter | Φ762 mm (30″), Φ508 mm (20″), Φ406 mm (16″) |
| Platen Material | Anodized Aluminum (optional Teflon-coated) |
| Head & Table Rotation Speed | 30–200 rpm |
| Head Oscillation | ±15 mm |
| Downforce Range | 70–500 g/cm² (1–7.1 psi) |
| System Height | 1850–1960 mm |
| Process Mode | Automated Dry/Wet Sequential Operation |
| Wafer Compatibility | Up to 300 mm (12″), 200 mm (8″), or 150 mm (6″) |
| Compliance | Designed for GLP/GMP-aligned R&D and process qualification environments |
| Brand | GBITEST |
|---|---|
| Model | GCP-CPX |
| Cooling Options | Liquid Nitrogen (LN₂) or Liquid Helium (LHe) |
| Base Temperature | <5 K (with LHe) |
| Sample Stage Diameter | Standard 2-inch, Optional up to 4-inch |
| Cooling Method | Direct cryogen immersion with multi-layer radiation shields |
| Temperature Monitoring | Multiple calibrated Pt sensors with ±10 mK stability |
| Operation Mode | Manual probe positioning |
| Construction | Stainless steel vacuum chamber with optical access windows |
| Vacuum Compatibility | <1×10⁻⁶ Torr typical base pressure |
| Radiation Shield Configuration | Dual-layer (LN₂ and LHe optimized) |
| Visual Access | Integrated quartz viewport on radiation shield |
| Mounting Interface | Standard SM1 (1.035"-40) and kinematic optical breadboard compatibility |
| Electrical Feedthroughs | 24-channel low-noise coaxial + 4-channel triaxial (optional) |
| Compliance | Designed per ISO 14644-1 Class 5 cleanroom handling guidelines for semiconductor lab use |
| Brand | Gel-Pak |
|---|---|
| Origin | USA |
| Model | APV / VRP / MB Series |
| Surface Resistivity | < 10⁹ Ω (APV & VRP), ≤ 10¹¹ Ω/sq (MB) |
| Material | Silicone-Free Crosslinked Polyurethane Elastomer |
| Adhesion Grade | EH-02 (Low Tack) to EH-07 (High Tack) |
| Hardness | 60–68 Shore A |
| Shear Modulus (G) | 200 kPa |
| Operating Temperature | +10 °C to +35 °C |
| Storage/Transport Temperature | −10 °C to +75 °C |
| Compliance | ANSI/ESD S20.20, IEC 61340-5-1, RoHS |
| Brand | Gel-Pak |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | Gel-Pak BMP |
| Price Range | USD 10–14 |
| Brand | Gel-Pak |
|---|---|
| Origin | USA |
| Model | GP-CLIP-22C, GP-CLIP-22C-M |
| Material | Conductive black polypropylene |
| ESD Surface Resistivity | 10³–10⁶ Ω |
| Max Operating Temperature | 85 °C |
| Compliance | ESD-S20.20 compliant |
| Packaging Type | Vacuum Release (VR) tray retention clip |
| Application | 2-inch semiconductor wafer carrier fixation |
| Brand | Gel-Pak |
|---|---|
| Origin | USA |
| Model | MB Series |
| Construction | Polyether Polyurethane Membrane + POLYREX® PG-33 Polystyrene Housing |
| Transparency | High-Optical Clarity |
| Reusability | Yes |
| Compliance | ESD-S20.20 Compliant (for SD variants) |
| Dimensions Range | 38 × 38 × 16 mm to 300 × 300 × 50 mm |
| Frame Options | Transparent, Black, White, Blue Clips |
| Brand | Gel-Pak |
|---|---|
| Origin | USA |
| Model | Gel-Pak Vertec® VFM |
| Material | Vertec TPE elastomer (FDA/USP compliant) & semiconductor-grade polycarbonate |
| Surface resistivity | >1×10¹⁴ Ω |
| Storage temperature | −10 to +65 °C |
| Outgassing (70 °C, 2 h, static headspace GC-MS per IDEMA M8-98) | Total volatile organics ≤0.32 ppm |
| Contact area on FAC device | ≤10% (edge-only) |
| Channel options | 5–7 channels (5-channel variant features six TPE retention ridges) |
| Brand | Genmark |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | Sort-Max Wafer Sorter |
| Pricing | Available Upon Request |
| Brand | GLASER |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | SMART ETCH II |
| Price | Upon Request |
| Laser Type | Air-Cooled Fiber Laser |
| Scanning Head | German High-Precision Digital Galvo Scanner |
| Wavelength | 1064 nm |
| Output Power | 20 W (Adjustable 1–100%) |
| Pulse Width | 1 ns – 250 ns |
| Beam Quality | M² ≤ 1.3 |
| Repetition Rate | 1 kHz – 4000 kHz |
| Decapsulation Depth Range | 0.01 mm – 3 mm |
| Maximum Scan Area | 150 mm × 150 mm |
| Focusing | Motorized Auto-Focus with Real-Time Red Dot Indicator |
| Imaging System | Integrated Coaxial Color CCD (Same-Optical-Path, Confocal Design) |
| Image Import Formats | X-Ray, SAM, SEM, JPG, PLT |
| Brand | GuanCe |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GCGEST-125 |
| Price | USD 1,560 (FOB Beijing) |
| Measurement Principle | Four-Terminal DC Voltage-Current Method (Constant Current Source + High-Impedance Voltmeter) |
| Resistivity Range | 1.0×10⁻⁴ – 1.0×10⁵ Ω·cm |
| Resolution | 1.0×10⁻⁶ Ω·cm |
| Voltage Ranges | 2 mV / 20 mV / 200 mV / 2 V |
| Voltage Accuracy | ±(0.5% rdg + 2 digits) for 20 mV–2 V range |
| Current Outputs | 10 μA, 100 μA, 1 mA, 10 mA, 100 mA |
| Current Accuracy | ±(0.5% rdg + 2 digits) |
| Electrode Contact Width | 5 mm |
| Electrode Contact Force | 0.6 N |
| Sample Thickness Input | Manual entry via front-panel keypad |
| Display | Triple 4½-digit LED (voltage, thickness, resistivity) |
| Power Supply | 220 V ±10%, 50/60 Hz, <50 W |
| Brand | Guarder |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | GDR-30PR |
| Dimensions (W×D×H) | 630 × 650 × 420 mm |
| Chamber Volume | ~30 L (290 × 290 × 360 mm) |
| Electrode Size | 180 × 210 mm (capacitively coupled, internal) |
| RF Generator | 13.56 MHz, 0–300 W continuous adjustable output with auto-impedance matching |
| Optional | 40 kHz medium-frequency plasma source |
| Control System | 7-inch HMI touchscreen + PLC (Omron/Siemens components), manual/auto modes |
| Vacuum System | Leybold vacuum pump, SMC isolation & vent valves, Inficon pressure sensor |
| Pressure Control | PID closed-loop regulation, ±1 Pa accuracy |
| Gas Delivery | Dual-channel, FITOK gas lines, mass flow controllers + needle valves |
| Operating Modes | RIE (Reactive Ion Etching) and PE (Plasma Enhanced) selectable |
| Compliance | Designed for ISO Class 5–7 cleanroom environments, compatible with GLP laboratory workflows |
| Brand | HAIDA INTERNATIONAL |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic (PRC-Made) |
| Model | HAIDA HDV-001 Membrane Mechanical Strength Tester for Battery Separators |
| Pricing | Upon Request |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Hakuto IBE-4000 |
| Pricing | Upon Request |
| Brand | NS (Nippon Seiko) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | IBE |
| Price Range | USD 210,000 – 280,000 |
| Sample Diameter | 3"–6" φ |
| Max. Ion Incidence Angle | ±90° |
| Ion Source | Kaufman-type KDC-40 / KDC-75 / KDC-160 (KRI, USA) |
| Ultimate Vacuum | ≤1×10⁻⁴ Pa (4IBE/7.5IBE/16IBE/20IBE), ≤8×10⁻⁵ Pa (MEL 3100) |
| Turbomolecular Pump | Pfeiffer (350 L/s or 1250 L/s) |
| Etch Uniformity | ≤±5% |
| Cooling | Direct substrate cooling |
| Motion System | Dry Chuck Planet (planetary rotation + revolution) |
| Etch Mode | Physical sputtering (Ar⁺ beam), non-reactive, anisotropic |
| Brand | ACCRETECH (Tokyo Seimitsu) |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 20 IBE-C |
| Pricing | Upon Request |
| Brand | HalfMoon |
|---|---|
| Origin | Japan |
| Wavelength Range | 190–1100 nm |
| Thickness Measurement Range | 1 nm – 250 µm |
| Optical Configuration | Non-contact, Spectroscopic Interferometry |
| Detector | PDA or CCD, 512-channel, thermoelectrically cooled |
| Light Sources | Deuterium (D₂) lamp (UV), Tungsten-Halogen (W) lamp (Vis), D₂ + W combination |
| Standard Measurement Aperture | Microscope-coupled objective port |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, compatible with GLP/GMP data integrity workflows (audit trail, user access control, electronic signatures per FDA 21 CFR Part 11) |
| Brand | HalfMoon |
|---|---|
| Origin | Japan |
| Model | 01 |
| Type | In-situ, Fiber-optic-based Spectroscopic Reflectometry System |
| Deployment | Inline/At-line Integration for Semiconductor Processing Equipment |
| Environmental Rating | Vacuum-Compatible (up to 1×10⁻⁶ Pa), Cleanroom Class 100 Certified |
| Measurement Principle | Broadband Spectral Reflectometry (400–1100 nm) with Real-time Interference Analysis |
| Brand | HalfMoon |
|---|---|
| Origin | Japan |
| Supplier Type | Authorized Distributor |
| Import Status | Imported |
| Wavelength Range | 250–800 nm (optional 350–1000 nm) |
| Thickness Measurement Range | 0.1 nm to >10 µm |
| Detector | Thermoelectrically Cooled Photodiode Array, 512 channels |
| Angle of Incidence/Reflection | 45°–90° (motorized, fully adjustable) |
| Power Supply | AC 1500 VA |
| Dimensions (H×D×W) | 1300 × 900 × 1750 mm |
| Weight | ~350 kg |
| Measurement Principle | Spectroscopic Ellipsometry (SE) |
| Brand | HalfMoon |
|---|---|
| Origin | Japan |
| Model Series | FE-300V / FE-300UV / FE-300NIR / FE-300NIR+ |
| Optical Principle | Normal-Incidence Spectroscopic Reflectometry (Spectroscopic Reflectance Analysis) with Nonlinear Least-Squares Fitting of Optical Constants (n, k) |
| Wavelength Ranges | 450–780 nm (FE-300V), 300–800 nm (FE-300UV), 900–1600 nm (FE-300NIR), 1470–1600 nm (FE-300NIR+) |
| Thickness Range | 10 nm – 1.5 mm (model-dependent) |
| Thickness Accuracy | ≤ ±0.2 nm (for thin films < 1 µm) |
| Repeatability (2σ) | ≤ 0.1 nm |
| Spot Size | ~Φ3 mm |
| Max Sample | 8-inch wafer (≤5 mm thick) |
| Measurement Time | 0.1–10 s per point |
| Light Sources | Tungsten-halogen lamp (V/NIR), Deuterium lamp (UV) |
| Interface | USB 2.0 |
| Dimensions | 280 × 570 × 350 mm (W×D×H) |
| Weight | ~24 kg |
| Software | Standard reflectance peak/valley analysis, FFT, optimization-based fitting, nonlinear least-squares inversion |
| Optional Modules | Multi-layer optical model builder, reference standard calibration suite, dispersion-corrected material database |