Semiconductor Instruments
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| Brand | MOJI-NANO |
|---|---|
| Origin | Shandong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) & Material Developer |
| Product Category | Domestic Advanced Photoresist for Maskless Direct Laser Writing |
| Model | 3D Micro/Nano-Scale Photoresist Series |
| Pricing | Available upon Technical Consultation |
| Brand | MONODE |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Instrument |
| Model | MONODE Barcode Reader |
| Price | USD 1,400 (approx.) |
| Brand | Monode |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | BRAVO IV |
| Price | USD 7,200 (FOB USA) |
| Brand | Monode |
|---|---|
| Origin | USA |
| Model | ICE |
| Marking Area | 120 mm × 100 mm |
| Column Height | 400 mm |
| Connectivity | Ethernet & Wi-Fi |
| User Interface | Touchscreen, Multilingual (22 languages) |
| Supported Content | Alphanumeric text, DataMatrix, QR codes, barcodes |
| Data Input | CSV file import |
| Logging | Timestamped marking log with traceability |
| Integration | PLC-compatible I/O, barcode printer interface |
| Compliance | CE, RoHS, FCC Part 15 |
| Brand | Monode |
|---|---|
| Origin | USA |
| Model | Monode Portable Pin Maker |
| Power Source | Rechargeable Lithium-ion Battery (5 Ah) |
| Marking Window | 50 mm × 30 mm |
| Marking Force | Adjustable |
| Marking Speed | Variable (file-driven) |
| Battery Runtime | Up to 3 h continuous / ~8 h intermittent |
| Compliance | HPGL-compatible output |
| Included Accessories | 1 charger + 2 batteries |
| Enclosure | Industrial-grade portable carry case with linear guide rails on X/Y axes |
| Weight & Form Factor | Compact, cordless, handheld design |
| Brand | MONODE |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Category | Imported Equipment |
| Model | Vestige Series Revolution |
| Laser Source | Pulsed Fiber (10 W or 20 W), Diode-Pumped, Air-Cooled |
| Compliance | FDA 21 CFR 1040.10, ANSI Z136.1-2000, MIL-STD-130 |
| Label Feed | Motorized Roll-to-Roll (4″ × 1000 ft) |
| Integrated Fume Extraction | HEPA-Filter Replaceable |
| UID Verification | Patented In-Line Validation Engine |
| Maintenance Profile | Low-Cost Scheduled Maintenance |
| Brand | MPI |
|---|---|
| Origin | Taiwan |
| Model | TS150 & TS200 & TS300 |
| Probe Station Type | Manual RF Probe Station |
| Wafer Compatibility | 150 mm (6″), 200 mm (8″), 300 mm (12″) |
| Platen Lift Range | 0–300 µm / 3 mm (3-stage) |
| Positioning Repeatability | ±1 µm |
| XY-θ Motion Stage | 25 × 25 mm with micrometer adjustment |
| Z-Axis Fine Adjustment | 25 mm travel with 1 mm engraved scale |
| RF MicroPositioner Capacity | up to 4 four-port RF probes or 10 DC probes |
| Thermal Chuck Compatibility | ERS-series temperature-controlled chucks (–60 °C to +300 °C) |
| Optical Options | MPI SZ10 stereo zoom, MZ12 monocular zoom, 90° tilt standard |
| Vibration Isolation | Integrated damping base |
| EMI Shielding | Optional light-tight, EMI-shielded enclosure |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TS200-SE Probe System |
| Price Range | USD 13,500 – 40,500 (FOB) |
| Product Category | Temperature-Controlled Manual Probe Station |
| Operation Mode | Manual |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | MR200 |
| Price Range | USD 13,500 – 40,500 (FOB) |
| Maximum Scribing Length | 200 mm |
| Scribing Force Range | 10 g – 130 g |
| Diamond Blade Contact Width | 5 µm – 10 µm |
| Zoom Microscope Magnification | 8× – 40× (continuous, stepless) |
| Optical Resolution at 10× | < 10 µm |
| X/Y Manual Stage Travel | 200 mm × 200 mm |
| Fine Positioning Accuracy | 0.01 mm (X/Y), 0.006° (rotation) |
| Wafer Chuck Diameter | 200 mm (standard), optional 100 mm |
| Vacuum Hold-Down Pressure | < 75 mbar |
| Power Supply | 100–220 V AC, 60 W |
| Dimensions (W×D×H) | 430 mm × 700 mm × 550 mm |
| Weight | ~16 kg |
| Brand | Nano-Master |
|---|---|
| Origin | USA |
| Manufacturer | Nano-Master, Inc. |
| Type | Magnetron Sputter Deposition System |
| Substrate Size | 6-inch (152 mm) |
| Maximum Substrate Temperature | 700 °C |
| Thickness Uniformity | <1% (1σ, across 6″ wafer) |
| Base Pressure | ≤1 × 10⁻⁷ Torr |
| Pumping Speed | 260 L/s Turbo Molecular Pump (optional) |
| Power Supplies | 1 kW DC + 300–600 W RF (13.56 MHz) |
| Magnetron Configuration | Up to 3 off-axis planar magnetrons |
| Chamber | 14″ cubic aluminum vacuum chamber with viewport |
| Control Interface | LabVIEW-based PC control with multi-level password protection and full interlock safety architecture |
| Brand | Nano-Master |
|---|---|
| Origin | Germany |
| Model | SWC-3000 |
| Maximum Substrate Size | 300 mm (12") round or 230 mm × 230 mm (9" × 9") square |
| Control System | Microprocessor-based automation |
| Optional Modules | PVA brush station, Chemical Dispense Unit (CDU), N₂ ionizer, IR drying lamp, custom photomask/wafer chucks |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P130 / S130 |
| Price Range | USD 280,000 – 420,000 |
| UV Light Source | 405 nm LED |
| XY Resolution | 2–10 µm |
| Layer Thickness | 5–20 µm |
| Build Volume (P130) | 3.84 × 2.16 × 10 mm (Mode 1) / 38.4 × 21.6 × 10 mm (Mode 2) / 50 × 50 × 10 mm (Mode 3) |
| Build Volume (S130) | Up to 100 × 100 × 50 mm |
| Optical System | High-NA Projection Micro-Lithography Optics |
| Post-Processing | Integrated Vacuum Despersion + UV Curing Station |
| Power Requirement | 200–240 V AC, 50/60 Hz, 3 kW |
| Weight | 450 kg |
| Dimensions | 1720 × 650 × 1820 mm |
| Brand | Nanoscribe |
|---|---|
| Country of Origin | Germany |
| Model | Photonic Professional GT2 |
| Category | Two-Photon Polymerization (TPP) Microfabrication System |
| Automation Level | Fully Automated |
| User Interface | Intuitive Graphical Workflow Environment |
| Compliance Framework | Designed for ISO 14644-1 Class 5 cleanroom integration |
| Software Architecture | Windows-based, FDA 21 CFR Part 11–ready audit trail support (optional configuration) |
| Brand | NAURA |
|---|---|
| Origin | Beijing, China |
| Model | GSE C200 |
| Wafer Size Capacity | ≤8-inch |
| Plasma Source Type | High-Density Inductively Coupled Plasma (ICP) |
| Etch Uniformity | <±3% (1σ, across 200 mm wafer) |
| Material Compatibility | Si, SiO₂, Si₃N₄, GaN, GaAs, InP, LiNbO₃, Nb, PI, metals, organics |
| Application Scope | R&D, failure analysis, pilot-line process development |
| Compliance | Designed to meet SEMI S2/S8 safety guidelines |
| Software | Integrated recipe management with audit trail logging (21 CFR Part 11–ready configuration available) |
| Brand | NAURA |
|---|---|
| Origin | Beijing, China |
| Model | HORIC D200 Series |
| Wafer Sizes | 4", 6", 8" |
| Compatible Substrates | Silicon (Si), Silicon Carbide (SiC), Silicon-on-Gallium Nitride (Si/GaN) |
| Process Capabilities | Phosphorus Diffusion, Boron Diffusion, Thermal Oxidation, Annealing, Alloying |
| Application Domains | R&D Laboratories, Compound Semiconductor Fabrication |
| Compliance | GB/T Standards, IEC 61000-6-2/6-4, SEMI S2-0215, CE Marked (EMC & LVD) |
| MES Integration | SECS/GEM, OPC UA, Custom API Support |
| Brand | NBM |
|---|---|
| Origin | USA |
| Model | Micro PLD |
| Substrate Heating Temperature | 1200 °C |
| Base Vacuum | 1×10⁻⁶ Torr |
| Substrate Diameter | 2 inch |
| Target Positions | 4 |
| Substrate Rotation Speed | 20 rpm |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 180 PED |
| Quotation | Upon Request |
| Vacuum Chamber | 18" spherical chamber with 8" CF viewport, 6.75" CF PED source port, three 6" CF ports, two additional 2.75" and 1.33" CF ports |
| Electron Gun Energy | 8–20 keV |
| Pulse Energy | 100–800 mJ |
| Pulse Width | 100 ns |
| Max Repetition Rate | 10 Hz at 15 kV, 5 Hz at 20 kV |
| Beam Cross-Section (Min) | 8 × 10⁻² cm² |
| Peak Power Density | 1.3 × 10⁸ W/cm² |
| Z-Axis Alignment Range | 50 mm |
| XY Alignment Range | ±20 mm |
| Spark Plug Lifetime | ~3 × 10⁷ pulses |
| Substrate Heater | Ø2" max / 10×10 mm² min |
| Substrate Rotation | 1–30 RPM (360° continuous) |
| Target Carousel | 6 × 1" or 3 × 2" targets |
| Target Grid Scanning | Programmable raster ablation pattern |
| Target Height Adjustment | Motorized |
| Target Shutters | Individual shutters per target to prevent cross-contamination |
| Process Gas Compatibility | O₂, N₂, Ar |
| Pulse Energy Stability | ±10% |
| Base Pressure | ≤8 × 10⁻⁸ Torr (with dry pump + turbomolecular pump) |
| Software Platform | Windows 7 + LabVIEW 2013 |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Ion-Assisted PLD System |
| Pricing | Upon Request |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Model | Large-Area PLD Systems |
| Substrate Diameter | 4" (100 mm), 6" (150 mm), 8" (200 mm) |
| Chamber Type | 18-inch-diameter spherical or cylindrical vacuum chamber |
| Max. Substrate Temperature | 850 °C (for 4″), 750 °C (for 6″), 700 °C (for 8″) |
| Target Mount | 4 × 2-inch rotary target assembly |
| Thickness Uniformity | ±5% or better across full wafer |
| Process Gases | O₂, N₂, Ar with mass flow controllers (MFCs) |
| Load Lock | Integrated |
| Automation Platform | Windows 7 + LabVIEW 2013 |
| Laser Scanning | Programmable beam rastering with inverse-velocity dwell-time compensation |
| Oxygen-Compatible High-Temperature Operation | Yes |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Pioneer 120 Advanced PLD System |
| Substrate Heating | Up to 850°C, Radiant Heater, O₂-Compatible |
| Substrate Size | 10 mm × 10 mm to 2-inch diameter |
| Vacuum Base Pressure | ≤5×10⁻⁹ Torr |
| Chamber Diameter | 12 inches |
| Target Capacity | 6×1″ or 3×2″ targets |
| Turbo Pump Speed | 260 L/s (software-controlled) |
| In-situ Diagnostics | RHEED-compatible |
| Load Lock | Optional |
| Software Platform | Windows 7 + LabVIEW 2013 |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Model | Pioneer 120 PLD System |
| Substrate Heater Type | Conductive (electrical) heating stage |
| Max Substrate Temperature | 950 °C |
| Heater Compatibility | O₂-compatible up to 1 atm (760 Torr) |
| Target Changer | Motorized, programmable multi-target rotator with rastering and position indexing |
| Vacuum System | Dry-pump stack — turbomolecular pump backed by diaphragm or scroll pump |
| Deposition Chamber Ports | 8" CF for pump, 8" CF for heater, 8" CF for target assembly |
| Laser Source | KrF excimer laser (248 nm) |
| Optical Path | 45° turning mirror, plano-convex lens (f ≈ 50 cm) |
| Control Software | Windows 7 + LabVIEW 2013 (integrated real-time control of heater, target rotation, pressure regulation, pump sequencing, and laser triggering) |
| Compliance | Designed for GLP/GMP-aligned thin-film R&D |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Model | Pioneer 180 Laser MBE/PLD System |
| Substrate Heating | 1000 °C (laser heater), 850 °C (radiant heater) |
| Substrate Size | 1 cm × 1 cm (laser-heated stage), 2″ diameter (radiant-heated stage) |
| Vacuum Chamber Diameter | 18″ |
| RHEED Gun Voltage | 30 keV |
| RHEED Operating Pressure | ≤500 mTorr (O₂) |
| Gas Flow Control | O₂/N₂ up to 100 SCCM |
| Software Platform | Windows 7 + LabVIEW 2013 |
| Target Mounting Options | 6 × 1″ or 3 × 2″ rotating target holder |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Model | Pioneer 180 MAPLE PLD System |
| Substrate Heating | Up to 500 °C with programmable controller |
| Substrate Size | Max. 2" diameter or multiple 1 cm × 1 cm samples |
| Substrate Rotation | 20 RPM |
| Vacuum Chamber Diameter | 18" |
| Target Stage | LN₂-cooled, single-target standard (multi-target optional) |
| Gas Flow Control | 50–100 SCCM MFC |
| Brand | Neocera |
|---|---|
| Origin | USA |
| Model | Pioneer 180 PLD System |
| Vacuum Base Pressure | ≤5×10⁻⁹ Torr |
| Chamber Diameter | 18 in |
| Max Substrate Size | 6 in |
| Max Target Capacity | 6×1″ or 3×2″ |
| Substrate Heater | Radiant, O₂-compatible up to 1 atm (760 Torr) |
| Max Substrate Temperature | 850 °C (upgradable to 1000 °C) |
| Turbo Pump Speed | 400 L/s (software-controlled) |
| In-situ Diagnostics Support | RHEED, LAXS, IES |
| Load-Lock Compatible | Yes |
| Multi-Source Integration Options | PED, RF/DC Sputtering, DC Ion Gun |
| UHV Cluster Integration Ready | XPS, ARPES, MBE |
| Brand | Netzsch |
|---|---|
| Origin | Germany |
| Model | DSC 214 Polyma |
| Temperature Range | −100 °C to 600 °C |
| Heating/Cooling Rate | up to 500 °C/min |
| Sensor Type | Corona® high-reproducibility heat-flux sensor |
| Crucible System | Concavus® concave-bottom crucibles with fixed annular contact geometry |
| Software Platform | Proteus® with Smart Mode, Expert Mode, TM-DSC, Beflat® baseline correction, Auto-Analysis, Identify™ polymer recognition database |
| Compliance | ISO 11357-1, ASTM E794, ASTM E1356, USP <1151>, GLP/GMP-ready audit trail (FDA 21 CFR Part 11 optional) |
| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CNI V4.0 PV |
| Pricing | Upon Request |
| Imprint Area | Up to Ø210 mm (8″) |
| Chamber Height | 20 mm |
| Thermal NIL Max Temp | 200 °C (optional 250 °C module) |
| UV-NIL Wavelength | 365 nm (optional 405 nm module) |
| Vacuum Level | ≤0.1 mbar |
| Maximum Imprint Pressure | 11 bar |
| Control Interface | Laptop-based with dedicated software |
| Automation Level | Fully automated process execution (manual stamp/substrate loading) |
| Form Factor | Benchtop, modular, plug-and-play |
| Brand | NIPPON FILCON |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | NIPPON KAYAKU KPM-500 DFR |
| Pricing | Upon Request |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Model | PlasmaEtch |
| Technology | Microwave-induced plasma etching |
| Patent | US Patent 9,548,227 B2 |
| Compliance | RoHS-compliant process, halogen-free etchant chemistry |
| Application | Semiconductor IC decapsulation for failure analysis (FA), cross-sectioning, and package-level defect inspection |
| Brand | 1124123/13213112 |
|---|---|
| Origin | France |
| Supplier Type | Authorized Distributor |
| Import Status | Imported |
| Model | NISQ-5 |
| Price | USD 1.4M (FOB) |
| Brand | NS |
|---|---|
| Origin | Japan |
| Model | 4 IBE |
| Sample Holder | 4" φ, single wafer |
| Ion Incidence Angle | 0° to ±90° |
| Ion Source | KDC-40 Kaufman-type (KRI, USA) |
| Base Pressure | ≤1×10⁻⁴ Pa |
| Turbomolecular Pump | Pfeiffer, 350 L/s |
| Etch Uniformity | ≤±5% |
| Cooling | Direct substrate cooling |
| Motion Control | Planetary rotation (rotation + revolution) |
| Gas Compatibility | Ar, O₂, N₂, CF₄, Xe, and mixed process gases |