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BoDong Company (Pfeiffer Vacuum Germany)

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BrandSyskey
OriginTaiwan
ModelThermal ALD
Substrate SizeCustomizable, up to 300 mm wafer
Process TemperatureUp to 400 °C (substrate heater)
Uniformity±1%
Precursor ChannelsUp to 6, each independently heated to 200 °C
Pulse Valve Response Time10 ms
Chamber MaterialAluminum or stainless steel
CoolingIntegrated water-cooling system
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