TESCAN
Filter
Showing 31–48 of 48 results
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | RISE Microscope |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Image Resolution | 1.0 nm @ 15 kV |
| Confocal Raman Spatial Resolution | 360 nm (with 532 nm laser) |
| Optical Architecture | Parallel-Axis Co-Localized SEM–Raman Design |
| Maximum Sample Chamber Capacity | Compatible with TESCAN’s Ultra-Large Chamber Platforms |
| Detector Compatibility | Full Integration with BSE, CL, EDS, and Other In-Chamber Detectors |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Imported High-Resolution Dual-Beam FIB-SEM |
| Model | TESCAN SOLARIS |
| Price Range | USD 1.3–2.0 million (FOB Europe) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN SOLARIS |
| Ion Source | Liquid Metal Gallium (Ga⁺) |
| SEM Column | Triglav™ High-Resolution Field Emission SEM |
| FIB Column | Orage™ High-Current Ga⁺ FIB |
| Maximum Ion Beam Current | 100 nA |
| Minimum FIB Acceleration Voltage | 500 V |
| In-Column Detector System | Energy-Filtered Axial Backscattered Electron (BSE) Detection |
| Integrated GIS | Up to 3 OptiGIS™ or 5-Nozzle Coaxial Gas Injection Systems |
| Software Platform | TESCAN Essence™ with DrawBeam™ Vector-Based Milling Engine |
| Sample Chamber | Ultra-Large, Optimized for 6″–8″ Wafers |
| Electron Beam Current | Up to 400 nA (Schottky Field Emission Gun) |
| Compliance | Designed for GLP/GMP environments |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Category | Imported Instrument |
| Model | TESCAN SOLARIS X |
| Price Range | USD 1.3M – 1.9M |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN SOLARIS X |
| Beam Type | Xenon (Xe⁺) Plasma Ion Source |
| SEM Column | Triglav™ UHR Schottky FE |
| FIB Column | iFIB+™ Xenon Plasma |
| Software Platform | TESCAN Essence™ |
| Detector System | TriSE™ + TriBE™ In-column SE/BSE |
| GIS Capacity | Up to 5 OptiGIS™ Units |
| Maximum FIB Current | 2 µA |
| FoV at 30 kV | >1 mm |
| Wafer Compatibility | 6″ and 8″ |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TENSOR |
| Acceleration Voltage | Medium-voltage (e.g., 80–200 kV) |
| Vacuum Level | Near-UHV (10⁻⁶ Pa in specimen chamber) |
| Detector Configuration | Dual large-solid-angle windowless EDS detectors |
| Precession Frequency | Up to 72 kHz |
| Camera | Hybrid-pixel direct electron diffraction camera |
| Software Platform | TESCAN Explore (real-time 4D-STEM processing) |
| Beam Control | Integrated electrostatic beam blanker |
| Emission Source | Schottky field-emission gun (FEG) |
| Compatibility | API support for HyperSpy, LiberTEM, Py4DSTEM |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN TENSOR |
| Acceleration Voltage | Medium-voltage (80–200 kV) |
| Vacuum Level | Near-UHV (10⁻⁶ Pa in specimen chamber) |
| Integrated 4D-STEM Platform | Yes |
| Direct Detection Diffraction Camera | Hybrid-pixel, electron-sensitive |
| EDS Detectors | Two windowless, large-solid-angle SDDs |
| Precession Frequency | Up to 72 kHz |
| Beam Blanking | Integrated electrostatic |
| Software Platform | TESCAN Explore (real-time 4D-STEM processing & visualization) |
| Compatibility | HyperSpy, LiberTEM, Py4DSTEM (API-supported data export) |
| Operating Mode | STEM BF/ADF/HAADF, lattice-resolved imaging, orientation mapping, phase distribution, strain mapping, virtual STEM, EDS tomography, diffraction reconstruction |
| Regulatory Compliance | Designed for GLP/GMP-aligned workflows |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TENSOR |
| Pricing | Available Upon Request |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TIMA-X |
| Electron Source | Cold Field Emission Gun |
| Secondary Electron Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 15 kV |
| EDS Detector Configuration | Up to four EDAX Silicon Drift Detectors (SDD) with 30 mm² active area, Peltier-cooled, Si₃N₄ window |
| Automation | Integrated AutoLoader™ robotic sample handler (2–100 epoxy-mounted polished blocks) |
| Software Platform | TIMA Suite v6+ with embedded EDAX TEAM™ EDS quantification engine |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Category | Imported |
| Model | TIMA-X FEG LMU/LMH |
| Electron Source | Cold Field Emission Gun (CFEG) |
| Secondary Electron Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 15 kV |
| EDX Detector Configuration | Up to 4 Peltier-cooled Silicon Drift Detectors (SDD) |
| Sample Chamber | Large-volume, motorized multi-position stage accommodating up to seven 30 mm-diameter samples |
| Vacuum Mode | High Vacuum (standard), Low Vacuum (optional) |
| Platform Base | MIRA FEG SEM platform with differential pumping and gun isolation valve |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | TIMA-X |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron (BSE) Image Resolution | 2.0 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Belgium |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | UniTOM XL |
| Pricing | Available Upon Request |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN s.r.o. |
| Type | Imported Instrument |
| Model | TESCAN VEGA COMPACT |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | VEGA |
| Instrument Type | Floor-standing SEM |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× – 1,000,000× |
| Acceleration Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN VEGA |
| Instrument Type | Floor-standing Conventional SEM |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× – 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN-VEGA |
| Instrument Type | Floor-standing Conventional SEM |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | VEGA |
| Electron Source | Tungsten (W) Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN VEGA |
| Instrument Type | Floor-standing SEM |
| Electron Source | Tungsten Filament |
| Resolution (Secondary Electrons) | 3.0 nm @ 30 kV |
| Resolution (Backscattered Electrons) | 3.5 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV (continuously adjustable) |
| Software Platform | TESCAN Essence™ |
| Vacuum Mode | SingleVac™ (standard) |
| Optical Design | Wide Field Optics™ |
| Beam Control | In-Flight Beam Tracing™ |
| Safety System | Essence™ 3D Collision Prevention Module |
| Energy Efficiency | Vacuum Buffer Unit |