TESCAN
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| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | AMBER / SOLARIS Series |
| Ion Sources | Liquid Metal Ga⁺ & Plasma Xe⁺ |
| Resolution (Xe-FIB) | <15 nm |
| Dual-Beam Alignment | Co-located Electron/Ion Optical Axes |
| Application Domain | Nanofabrication, TEM Lamella Preparation, 3D Microstructural Analysis, Circuit Edit, Failure Analysis |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Variants | AMBER, SOLARIS, AMBER X, SOLARIS X |
| Ion Sources | Liquid Metal Ga⁺ & Plasma Xe⁺ |
| Beam Alignment | Co-located Electron/Ion Optical Axes |
| Resolution (Xe⁺ FIB) | <15 nm |
| Material Removal Rate (Xe⁺) | Up to 50× higher than Ga⁺ FIB |
| Application Domain | Cross-sectioning, TEM lamella preparation, circuit edit, 3D tomography, in-situ nanofabrication |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, compatible with GLP/GMP workflow documentation requirements |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | AMBER / SOLARIS / AMBER X / SOLARIS X |
| Ion Sources | Liquid Metal Gallium (Ga⁺) & Xenon Plasma (Xe⁺) |
| Resolution (Xe-FIB) | <15 nm |
| Dual-Beam Alignment | Co-located Electron and Ion Probe Axes |
| Application Domain | Nanoscale Imaging, Cross-Sectioning, TEM Lamella Preparation, Circuit Edit, 3D Tomography, In Situ Nanofabrication |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN AMBER |
| Beam Sources | Schottky Field-Emission Electron Gun + Liquid-Metal Gallium Ion Source |
| SEM Resolution | ≤0.6 nm @ 30 kV (in-lens detection) |
| FIB Resolution | <2.5 nm @ 30 kV |
| Minimum FIB Acceleration Voltage | 500 V |
| Maximum FIB Current | 100 nA |
| Real-time Multi-channel Acquisition | Up to 8 Simultaneous Signals |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER |
| Price Range | USD 920,000 – 1,315,000 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER X |
| Price Range | USD 1.3–2.0 million |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN AMBER X |
| Ion Source | Xe Plasma FIB |
| Electron Source | Ultra-High-Resolution Schottky Field Emission Gun (FEG) |
| Maximum FIB Current | 1 µA |
| FIB Resolution | < 15 nm @ 30 kV |
| SEM Resolution | 1.5 nm @ 1 kV |
| Max Cross-Section Width | 1 mm |
| Cross-Section Preparation Time | ≤ 3.5 h |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN CLARA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Thermal Field Emission (TFE) |
| Secondary Electron (SE) Resolution | 0.9 nm @ 15 kV |
| Backscattered Electron (BSE) Resolution | 2.0 nm @ 30 kV (Low Vacuum Mode) |
| Accelerating Voltage | 50 V – 30 kV |
| Magnification Range | 2× – 2,000,000× |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Thermal Field-Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (with deceleration mode down to 50 V) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV (in low-vacuum mode) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | CoreTOM, DynaTOM, UniTOM HR |
| Maximum Sample Diameter | 30 cm |
| Maximum Sample Height | 50 cm |
| Spatial Resolution (UniTOM HR) | ≤ 0.6 µm |
| Spatial Resolution (CoreTOM & DynaTOM) | ≤ 3 µm (JIMA mode) |
| Scan Time (DynaTOM, full tomogram) | ~seconds |
| In-situ/4D Capability | Yes |
| System Architecture | Fixed-sample (DynaTOM), Variable-sample (CoreTOM, UniTOM HR) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | CoreTOM, DynaTOM, UniTOM HR |
| Spatial Resolution (min) | 0.6 µm (UniTOM HR), 3 µm (CoreTOM & DynaTOM, JIMA mode) |
| Max Sample Dimensions | Ø300 mm × H500 mm (UniTOM HR), up to 1150 mm length (CoreTOM) |
| Scan Speed | Full tomogram in seconds (DynaTOM), high-throughput multi-scale acquisition (CoreTOM), configurable acquisition timing (UniTOM HR) |
| System Architecture | Fixed-sample geometry with rotating X-ray source/detector (DynaTOM) |
| Brand | TESCAN |
|---|---|
| Origin | Belgium |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | CoreTOM |
| Pricing | Available upon Request |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | CoreTOM, DynaTOM, UniTOM HR |
| Spatial Resolution (CoreTOM) | ≥3 µm (JIMA mode) |
| Spatial Resolution (UniTOM HR) | ≤600 nm |
| Max Sample Dimensions (UniTOM HR) | Ø300 mm × H500 mm |
| Max Sample Height (CoreTOM) | 1150 mm |
| Acquisition Speed (DynaTOM) | Full tomogram in seconds |
| Geometry | Fixed-sample (DynaTOM, UniTOM HR), Sample-stage rotation (CoreTOM) |
| Compliance | Designed for ASTM E1441, ISO 15747, and GLP/GMP-aligned workflows |
| Brand | TESCAN |
|---|---|
| Model | DynaTOM |
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported Industrial Micro-CT System |
| Imaging Principle | Cone-Beam X-ray Computed Tomography with Continuous Rotational Acquisition |
| Temporal Resolution | <10 s per full 360° scan |
| Spatial Resolution | ≤2 µm |
| Geometry | Fixed-sample, rotating source–detector gantry |
| Software Suite | DynaTOM 4D Reconstruction & In Situ Workflow Package |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | AMBER, SOLARIS, AMBER X, SOLARIS X |
| Ion Sources | Liquid Metal Ga⁺ & Plasma Xe⁺ |
| Resolution (Xe-FIB) | <15 nm |
| Beam Alignment | Co-located Electron/Ion Optical Axes |
| System Architecture | Integrated UHV Dual-Column Platform |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | FIB-SEM-TOF-SIMS |
| Price Range | USD 1.3M–2.6M (FOB Europe) |
| Mass Analyzer Type | Time-of-Flight (TOF) |
| Primary Ion Beam Energy | 30 kV |
| Mass Range | 1–2500 Da |
| Mass Resolution (M/ΔM) | >800 (at 10% valley definition) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (reduced to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN-MAGNA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| SEM Class | Ultra-High-Resolution FE-SEM |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun (FEG) |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 0.2–30 kV (deceleration mode down to <50 V) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN MAGNA |
| Instrument Type | Floor-Standing SEM |
| Electron Gun | Schottky Field-Emission |
| SEM Class | Ultra-High-Resolution FE-SEM |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | MIRA / CLARA / MAGNA |
| Instrument Type | Floor-Standing FE-SEM |
| Electron Source | Schottky Field-Emission Gun |
| Beam Technology | BrightBeam (CLARA), Triglav Ultra-High-Resolution Column (MAGNA) |
| Application Scope | Nanoscale Imaging & Microanalysis of Conductive, Semi-Conductive, and Insulating Materials |
| Compliance Framework | Designed for ASTM E1558, ISO 16700, and GLP/GMP-aligned laboratory environments |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Magnification Range | ×2 to ×1,000,000 |
| Accelerating Voltage | 50 V (decelerated mode) to 30 kV |
| Chamber Configuration | AMU (Advanced Macro-Utility) Ultra-Large Specimen Chamber |
| Compliance | CE, ISO 9001, IEC 61000-6-3/6-4 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-standing SEM |
| Electron Source | Schottky Field Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 50 V–30 kV (with beam deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN MIRA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model(s) | MIRA / CLARA / MAGNA |
| Instrument Type | Floor-standing FE-SEM |
| Electron Source | Schottky Field Emission Gun |
| Beam Technology | BrightBeam (CLARA), Triglav (MAGNA) |
| Primary Application Domains | Semiconductor Metrology, Advanced Materials Characterization, Life Sciences Imaging, Geoscience Microanalysis |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | NanoSpace |
| Price Range | USD 1.9M – 3.2M |
| Main Chamber Base Pressure | 5 × 10⁻¹⁰ mbar |
| Bake-Out Temperature | Up to 120 °C |
| Sample Transfer Time (Atmosphere → UHV Main Chamber) | ≤30 min |
| Stage X/Y Travel Range | 100 mm ± 50 nm |
| BrightBeam e-Optics Resolution | <1.6 nm @ 12 mm WD, 0.5–30 keV, beam current: few pA to >350 nA |
| e-CLIPSE+ e-Optics Resolution | 5 nm @ 1 pA, 0.5–30 keV, beam current: 1 pA–2.5 µA @ 30 keV, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| DeepFIB Ga⁺ Source Resolution | 2.5 nm @ 1 pA, 250 V–30 keV, max ion current: 125 nA |
| PFIB Gas Field Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 25 nm @ 1 pA @ 3 keV, beam current up to 3.5 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%), Si milling rate: 800 µm³/s |
| Veloce LMAIS (AuGe/AuSi/Bi) | 5 nm @ 1 pA, mass range: 14 (Si⁺) to 613 (AuSi⁺), 1–30 keV, max current: 50 nA |
| iVeloce Wien-filtered Gas Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 3–30 keV, max current: 1 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | Nanospace SIMS |
| Instrument Type | Orthogonal Time-of-Flight (OTOF) SIMS |
| Mass Range | 1–1,500 Da |
| Mass Resolution | >9,500 (FWHM at m/z 100) |
| Brand | TESCAN |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | FIB/SEM Column Upgrade Service |
| Instrument Form Factor | Floor-Standing |
| Electron Source Type | Thermal Field Emission |
| Microscope Class | Ultra-High-Resolution Field-Emission SEM/FIB |
| Secondary Electron Imaging Resolution | ≤1.6 nm (Brightbeam), ≤5 nm (e-CLIPSE+), ≤2.5 nm (DeepFIB), ≤25 nm (PFIB), ≤5 nm (Veloce), ≤30 nm (iVeloce) |
| Accelerating Voltage Range | 0.5–30 keV (e-beam) |
| Backscattered Electron Imaging Resolution | Comparable to SE resolution under optimized conditions |
| Ion Beam Current Range | Up to 125 nA (DeepFIB), up to 3.5 µA (PFIB), up to 50 nA (Veloce), up to 1 µA (iVeloce) |
| Field of View (at 10 keV) | 1250 × 1250 µm (±10%) for e-CLIPSE+, PFIB, iVeloce |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported High-Energy Ion Implanter |
| Model | Quiin |
| Product Type | Dual-Beam FIB-SEM with Integrated Quantum-Scale Ion Implantation Capability |
| Application Domain | IC Fabrication, Quantum Device Engineering, Advanced Materials Modification |
| Electron Source | Schottky Field-Emission Gun (e-CLIPSE), Lifetime ≥ 2 years |
| Electron Beam Landing Energy | 500 eV – 30 keV |
| Electron Probe Current | ~pA to >100 nA |
| FIB Sources | iVeloce (ECR plasma source, Xe/O₂/Ar/He/N₂), Veloce (Liquid Metal Ion Source, Ga⁺/Ge⁺/Au⁺/Au₃⁺/Si⁺/Au clusters) |
| Ion Beam Energy Range | 3–30 keV |
| Minimum Measurable Ion Current | 20 fA |
| Maximum Probe Current | 1 µA (iVeloce), 50 nA (Veloce) |
| FIB Resolution | 5 nm @ 30 keV (Veloce), 40 nm @ 30 keV (iVeloce) |
| SEM Resolution | 4 nm @ 25 keV |
| Working Distance | 12 mm |
| Beam Intersection Angle | 55° |
| In-situ Heating Stage (FurnaSEM 1000) | Max Temp = 950°C, Ramp Rate = 0.01–3 °C/s, Area = 50 × 30 mm |
| GIS | Energis system with 3 precursor reservoirs (e.g., Pt, W, C, SiOₓ, H₂O, XeF₂) |
| Software Platform | Pegasus GUI & API |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Resolution | 1.0 nm @ 15 kV |