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| Brand | Onto Innovation |
|---|---|
| Model | Dragonfly® G3 |
| Origin | Malaysia |
| Equipment Type | Inline AOI for Front-End & Advanced Packaging |
| Minimum Detectable Line Width/Spacing | 0.7 µm |
| Wafer Size Support | 100 mm – 330 mm |
| Maximum Substrate Area | >6400 mm² |
| 翘曲晶圆 & Taiko Handling | Supported |
| Imaging Modes | Brightfield, Darkfield, Oblique Illumination, IR Transmission |
| 3D Metrology | Truebump® (Multi-Modal 3D Profilometry) |
| Residue Detection | Clearfind® |
| Software Platform | nLINE™ with Real-Time Analysis, Offline Review, and Exploratory Bump-Level Data Analytics |
| Compliance Framework | Supports ASTM F2598 (Wafer Defect Classification), ISO 14644-1 (Cleanroom Integration), and GLP/GMP-aligned Audit Trail Logging |
| Brand | LynceeTec |
|---|---|
| Origin | Switzerland |
| Model | DHM R1000 MEMS |
| Measurement Principle | Digital Holographic Interferometry (DHI) |
| Operating Mode | Non-contact, Full-field, Single-shot 4D Imaging (3D topography + time) |
| Vertical Resolution | ≤5 pm |
| In-plane Displacement Resolution | ≤1 nm (sub-pixel algorithm) |
| Maximum Excitation Frequency | 25 MHz |
| Frame Rate | Up to 1.25 MHz (with burst mode) |
| Software | MEMSAnalysis Tool v5.x |
| Compliance | ASTM E2558, ISO/IEC 17025-compatible workflows, FDA 21 CFR Part 11 audit trail support (optional), GLP/GMP-ready metadata logging |
| Brand | G&N |
|---|---|
| Origin | Germany |
| Model | MPS R400CV |
| Wafer Compatibility | 2″, 3″, 4″, 5″, 6″, 8″ |
| Chuck Flatness Error | ≤2 µm |
| Grinding Method | Z-axis plunge grinding with synchronized wafer and spindle rotation |
| Spindle Type | Integrated high-precision air-bearing spindle |
| Spindle Speed | 2560 rpm |
| Spindle Power | 3.7 kW |
| Grinding Wheel Diameter | 200 mm |
| Number of Spindles | 1 |
| Coarse/Fine Feed Range | 170 mm |
| Feed Resolution | ≤1 µm |
| Minimum Step Size | 0.1 µm |
| Coarse Grinding Rate | 2–1000 µm/min |
| Fine Grinding Rate | 2–1000 µm/min |
| Surface Roughness (Ra) | Down to 0.016 µm (with D7 diamond wheel) |
| Total Thickness Variation (TTV) | ≤3 µm per wafer |
| Inter-wafer Thickness Uniformity | ≤2 µm |
| Wheel Material | Diamond or CBN |
| Wheel Mounting | Single or dual-wheel configuration (manual or optional automatic change) |
| Chuck Sizes | Multiple vacuum chucks for 2″–8″ wafers |
| Sample Table Diameter | 400 mm |
| Sample Table Speed | 2–20 rpm |
| Control System | High-precision PLC-based controller with touchscreen HMI |
| Recipe Storage | Multiple programmable process recipes |
| Optional Module | In-situ thickness measurement unit |
| Enclosure | Fully enclosed grinding chamber |
| Machine Weight | 1130 kg |
| Footprint | 1640 × 1210 mm |
| Brand | Fastmicro |
|---|---|
| Origin | Netherlands |
| Model | FM-PS-PFS-V01 |
| Minimum Detectable Particle Size | 0.5 µm |
| Measurement Speed | Real-time, second-level continuous monitoring |
| Output Formats | KLARF, Excel |
| Interface | USB, Ethernet |
| Sample Stage Diameter | 50 mm (base), compatible with 25 mm wafers |
| Environmental Operation | Ambient air and vacuum-compatible |
| Dimensions (L×W×H) | 405 mm × 183 mm × 209 mm |
| Detection Principle | Mie scattering-based surface particle imaging |
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