Empowering Scientific Discovery

Shanghai Aiyao Scientific Instruments Co., Ltd.

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BrandG&N
OriginGermany
ModelMPS R400CV
Wafer Compatibility2″, 3″, 4″, 5″, 6″, 8″
Chuck Flatness Error≤2 µm
Grinding MethodZ-axis plunge grinding with synchronized wafer and spindle rotation
Spindle TypeIntegrated high-precision air-bearing spindle
Spindle Speed2560 rpm
Spindle Power3.7 kW
Grinding Wheel Diameter200 mm
Number of Spindles1
Coarse/Fine Feed Range170 mm
Feed Resolution≤1 µm
Minimum Step Size0.1 µm
Coarse Grinding Rate2–1000 µm/min
Fine Grinding Rate2–1000 µm/min
Surface Roughness (Ra)Down to 0.016 µm (with D7 diamond wheel)
Total Thickness Variation (TTV)≤3 µm per wafer
Inter-wafer Thickness Uniformity≤2 µm
Wheel MaterialDiamond or CBN
Wheel MountingSingle or dual-wheel configuration (manual or optional automatic change)
Chuck SizesMultiple vacuum chucks for 2″–8″ wafers
Sample Table Diameter400 mm
Sample Table Speed2–20 rpm
Control SystemHigh-precision PLC-based controller with touchscreen HMI
Recipe StorageMultiple programmable process recipes
Optional ModuleIn-situ thickness measurement unit
EnclosureFully enclosed grinding chamber
Machine Weight1130 kg
Footprint1640 × 1210 mm
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