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| Brand | CTS |
|---|---|
| Origin | South Korea |
| Model | AP200 |
| Wafer Size Compatibility | 4", 6", 8" |
| Platen Count | 1 |
| Platen Speed | 0–200 rpm |
| Polishing Head Speed | 0–200 rpm |
| Polishing Head Oscillation Range | ±15 mm |
| Pressure Control Zones | 3 (Center, Edge, Retaining Ring) |
| Pressure Range | 0.14–14 psi |
| Platen Diameter | 20 in |
| Slurry Flow Rate | 20–500 cc/min (via dual peristaltic pumps) |
| Conditioning Head | 10-zone segmented actuation |
| Conditioning Sweep Speed | 10 sweeps/min |
| Conditioning Downforce | 3–20 lbs |
| Conditioning Speed | 0–150 rpm |
| Within-Wafer Non-Uniformity (WIWNU, 5-mm edge exclusion) | <5% (1σ) |
| Wafer-to-Wafer Non-Uniformity (WTWNU, 5-mm edge exclusion) | <3% (1σ) |
| Dimensions (W×L×H) | 1000 × 2030 × 2100 mm |
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