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| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | ABN-500-Y1 |
| Vacuum Base Pressure | ≤4×10⁻⁵ Pa |
| Pump-Down Time | ≤30 min to 5×10⁻⁴ Pa |
| Thickness Uniformity | ±3% (max deviation ±5%) |
| Thickness Control Accuracy | ±5% |
| Deposition Rate | Up to 5 nm/s (material- and source-dependent) |
| Process Duration Range | 0–30 min |
| Cooling | Water-cooled electrodes and chamber flanges |
| Safety Interlocks | Vacuum, overcurrent, and cooling water flow monitoring |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | ABN-500-Y2 |
| Base Price | USD 67,000 (FOB Jiangsu) |
| Operating Pressure Range | 5×10⁻⁵ Pa – 5×10⁻³ Pa |
| Gas Inlets | 2 independent MFC-controlled channels |
| Substrate Heating | RT to 300 °C |
| Max DC/RF Current | 0.1–100 A |
| RF Power Stability | ≤5% |
| Target Diameter | 6 inch |
| Uniformity | ±3% over Ø100 mm substrate |
| Compatible Power Modes | DC, RF, Pulsed DC |
| Brand | Abner |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | EI Series |
| Pricing | Available Upon Request |
| Brand | ULVAC |
|---|---|
| Model | EI-5Z |
| Evaporation Sources | Dual-mode (Electron Beam + Resistive Thermal) |
| Substrate Compatibility | 2–8 inch wafers (Si, GaAs, glass, ceramics) |
| Base Pressure | ≤3.0 × 10⁻⁵ Pa |
| Pumping Speed | Achieves 3.0 × 10⁻⁴ Pa in ≤20 min |
| Thickness Uniformity | ±5% across substrate |
| Control System | Fully Automated PLC-Based Interface |
| Chamber Configuration | Vertical-Incidence Deposition |
| Optional Integration | Wall-Through (Penetrating) Design |
| Material Compatibility | Au, Ag, Al, Cr, Ni, Ti, ITO, SiO₂, Al₂O₃, and other conductive/insulating evaporants |
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