Optical Instruments
Filter
Showing 6541–6570 of 7810 results
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER |
| Price Range | USD 920,000 – 1,315,000 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER X |
| Price Range | USD 1.3–2.0 million |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN AMBER X |
| Ion Source | Xe Plasma FIB |
| Electron Source | Ultra-High-Resolution Schottky Field Emission Gun (FEG) |
| Maximum FIB Current | 1 µA |
| FIB Resolution | < 15 nm @ 30 kV |
| SEM Resolution | 1.5 nm @ 1 kV |
| Max Cross-Section Width | 1 mm |
| Cross-Section Preparation Time | ≤ 3.5 h |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN CLARA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Thermal Field Emission (TFE) |
| Secondary Electron (SE) Resolution | 0.9 nm @ 15 kV |
| Backscattered Electron (BSE) Resolution | 2.0 nm @ 30 kV (Low Vacuum Mode) |
| Accelerating Voltage | 50 V – 30 kV |
| Magnification Range | 2× – 2,000,000× |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Thermal Field-Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (with deceleration mode down to 50 V) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV (in low-vacuum mode) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | AMBER, SOLARIS, AMBER X, SOLARIS X |
| Ion Sources | Liquid Metal Ga⁺ & Plasma Xe⁺ |
| Resolution (Xe-FIB) | <15 nm |
| Beam Alignment | Co-located Electron/Ion Optical Axes |
| System Architecture | Integrated UHV Dual-Column Platform |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (reduced to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN-MAGNA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| SEM Class | Ultra-High-Resolution FE-SEM |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun (FEG) |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 0.2–30 kV (deceleration mode down to <50 V) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN MAGNA |
| Instrument Type | Floor-Standing SEM |
| Electron Gun | Schottky Field-Emission |
| SEM Class | Ultra-High-Resolution FE-SEM |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 7× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model Series | MIRA / CLARA / MAGNA |
| Instrument Type | Floor-Standing FE-SEM |
| Electron Source | Schottky Field-Emission Gun |
| Beam Technology | BrightBeam (CLARA), Triglav Ultra-High-Resolution Column (MAGNA) |
| Application Scope | Nanoscale Imaging & Microanalysis of Conductive, Semi-Conductive, and Insulating Materials |
| Compliance Framework | Designed for ASTM E1558, ISO 16700, and GLP/GMP-aligned laboratory environments |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Magnification Range | ×2 to ×1,000,000 |
| Accelerating Voltage | 50 V (decelerated mode) to 30 kV |
| Chamber Configuration | AMU (Advanced Macro-Utility) Ultra-Large Specimen Chamber |
| Compliance | CE, ISO 9001, IEC 61000-6-3/6-4 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-standing SEM |
| Electron Source | Schottky Field Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 50 V–30 kV (with beam deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN MIRA |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Schottky Field Emission |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (down to 50 V in deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model(s) | MIRA / CLARA / MAGNA |
| Instrument Type | Floor-standing FE-SEM |
| Electron Source | Schottky Field Emission Gun |
| Beam Technology | BrightBeam (CLARA), Triglav (MAGNA) |
| Primary Application Domains | Semiconductor Metrology, Advanced Materials Characterization, Life Sciences Imaging, Geoscience Microanalysis |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | NanoSpace |
| Price Range | USD 1.9M – 3.2M |
| Main Chamber Base Pressure | 5 × 10⁻¹⁰ mbar |
| Bake-Out Temperature | Up to 120 °C |
| Sample Transfer Time (Atmosphere → UHV Main Chamber) | ≤30 min |
| Stage X/Y Travel Range | 100 mm ± 50 nm |
| BrightBeam e-Optics Resolution | <1.6 nm @ 12 mm WD, 0.5–30 keV, beam current: few pA to >350 nA |
| e-CLIPSE+ e-Optics Resolution | 5 nm @ 1 pA, 0.5–30 keV, beam current: 1 pA–2.5 µA @ 30 keV, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| DeepFIB Ga⁺ Source Resolution | 2.5 nm @ 1 pA, 250 V–30 keV, max ion current: 125 nA |
| PFIB Gas Field Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 25 nm @ 1 pA @ 3 keV, beam current up to 3.5 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%), Si milling rate: 800 µm³/s |
| Veloce LMAIS (AuGe/AuSi/Bi) | 5 nm @ 1 pA, mass range: 14 (Si⁺) to 613 (AuSi⁺), 1–30 keV, max current: 50 nA |
| iVeloce Wien-filtered Gas Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 3–30 keV, max current: 1 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| Brand | TESCAN |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | FIB/SEM Column Upgrade Service |
| Instrument Form Factor | Floor-Standing |
| Electron Source Type | Thermal Field Emission |
| Microscope Class | Ultra-High-Resolution Field-Emission SEM/FIB |
| Secondary Electron Imaging Resolution | ≤1.6 nm (Brightbeam), ≤5 nm (e-CLIPSE+), ≤2.5 nm (DeepFIB), ≤25 nm (PFIB), ≤5 nm (Veloce), ≤30 nm (iVeloce) |
| Accelerating Voltage Range | 0.5–30 keV (e-beam) |
| Backscattered Electron Imaging Resolution | Comparable to SE resolution under optimized conditions |
| Ion Beam Current Range | Up to 125 nA (DeepFIB), up to 3.5 µA (PFIB), up to 50 nA (Veloce), up to 1 µA (iVeloce) |
| Field of View (at 10 keV) | 1250 × 1250 µm (±10%) for e-CLIPSE+, PFIB, iVeloce |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Resolution | 1.0 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | RISE Microscope |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Image Resolution | 1.0 nm @ 15 kV |
| Confocal Raman Spatial Resolution | 360 nm (with 532 nm laser) |
| Optical Architecture | Parallel-Axis Co-Localized SEM–Raman Design |
| Maximum Sample Chamber Capacity | Compatible with TESCAN’s Ultra-Large Chamber Platforms |
| Detector Compatibility | Full Integration with BSE, CL, EDS, and Other In-Chamber Detectors |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Imported High-Resolution Dual-Beam FIB-SEM |
| Model | TESCAN SOLARIS |
| Price Range | USD 1.3–2.0 million (FOB Europe) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN SOLARIS |
| Ion Source | Liquid Metal Gallium (Ga⁺) |
| SEM Column | Triglav™ High-Resolution Field Emission SEM |
| FIB Column | Orage™ High-Current Ga⁺ FIB |
| Maximum Ion Beam Current | 100 nA |
| Minimum FIB Acceleration Voltage | 500 V |
| In-Column Detector System | Energy-Filtered Axial Backscattered Electron (BSE) Detection |
| Integrated GIS | Up to 3 OptiGIS™ or 5-Nozzle Coaxial Gas Injection Systems |
| Software Platform | TESCAN Essence™ with DrawBeam™ Vector-Based Milling Engine |
| Sample Chamber | Ultra-Large, Optimized for 6″–8″ Wafers |
| Electron Beam Current | Up to 400 nA (Schottky Field Emission Gun) |
| Compliance | Designed for GLP/GMP environments |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Category | Imported Instrument |
| Model | TESCAN SOLARIS X |
| Price Range | USD 1.3M – 1.9M |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN SOLARIS X |
| Beam Type | Xenon (Xe⁺) Plasma Ion Source |
| SEM Column | Triglav™ UHR Schottky FE |
| FIB Column | iFIB+™ Xenon Plasma |
| Software Platform | TESCAN Essence™ |
| Detector System | TriSE™ + TriBE™ In-column SE/BSE |
| GIS Capacity | Up to 5 OptiGIS™ Units |
| Maximum FIB Current | 2 µA |
| FoV at 30 kV | >1 mm |
| Wafer Compatibility | 6″ and 8″ |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TENSOR |
| Acceleration Voltage | Medium-voltage (e.g., 80–200 kV) |
| Vacuum Level | Near-UHV (10⁻⁶ Pa in specimen chamber) |
| Detector Configuration | Dual large-solid-angle windowless EDS detectors |
| Precession Frequency | Up to 72 kHz |
| Camera | Hybrid-pixel direct electron diffraction camera |
| Software Platform | TESCAN Explore (real-time 4D-STEM processing) |
| Beam Control | Integrated electrostatic beam blanker |
| Emission Source | Schottky field-emission gun (FEG) |
| Compatibility | API support for HyperSpy, LiberTEM, Py4DSTEM |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TESCAN TENSOR |
| Acceleration Voltage | Medium-voltage (80–200 kV) |
| Vacuum Level | Near-UHV (10⁻⁶ Pa in specimen chamber) |
| Integrated 4D-STEM Platform | Yes |
| Direct Detection Diffraction Camera | Hybrid-pixel, electron-sensitive |
| EDS Detectors | Two windowless, large-solid-angle SDDs |
| Precession Frequency | Up to 72 kHz |
| Beam Blanking | Integrated electrostatic |
| Software Platform | TESCAN Explore (real-time 4D-STEM processing & visualization) |
| Compatibility | HyperSpy, LiberTEM, Py4DSTEM (API-supported data export) |
| Operating Mode | STEM BF/ADF/HAADF, lattice-resolved imaging, orientation mapping, phase distribution, strain mapping, virtual STEM, EDS tomography, diffraction reconstruction |
| Regulatory Compliance | Designed for GLP/GMP-aligned workflows |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TENSOR |
| Pricing | Available Upon Request |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Model | TIMA-X |
| Electron Source | Cold Field Emission Gun |
| Secondary Electron Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 15 kV |
| EDS Detector Configuration | Up to four EDAX Silicon Drift Detectors (SDD) with 30 mm² active area, Peltier-cooled, Si₃N₄ window |
| Automation | Integrated AutoLoader™ robotic sample handler (2–100 epoxy-mounted polished blocks) |
| Software Platform | TIMA Suite v6+ with embedded EDAX TEAM™ EDS quantification engine |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Category | Imported |
| Model | TIMA-X FEG LMU/LMH |
| Electron Source | Cold Field Emission Gun (CFEG) |
| Secondary Electron Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 15 kV |
| EDX Detector Configuration | Up to 4 Peltier-cooled Silicon Drift Detectors (SDD) |
| Sample Chamber | Large-volume, motorized multi-position stage accommodating up to seven 30 mm-diameter samples |
| Vacuum Mode | High Vacuum (standard), Low Vacuum (optional) |
| Platform Base | MIRA FEG SEM platform with differential pumping and gun isolation valve |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | TIMA-X |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.2 nm @ 30 kV |
| Magnification Range | 1× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Backscattered Electron (BSE) Image Resolution | 2.0 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN s.r.o. |
| Type | Imported Instrument |
| Model | TESCAN VEGA COMPACT |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 200 V – 30 kV (continuously adjustable) |
| Backscattered Electron Resolution | 3.5 nm @ 30 kV |