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| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | EVO10 |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3 nm at 30 kV |
| Magnification Range | 10× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Maximum Sample Dimensions | Ø220 mm × 100 mm (H) |
| Stage Travel | X = 80 mm, Y = 100 mm, Z = 35 mm |
| Standard Detectors | Everhart-Thornley Secondary Electron Detector (SED), Solid-State Backscattered Electron Detector (BSE) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Instrument Type | Floor-standing High-Resolution FE-SEM |
| Electron Source | Thermal Field Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV, 1.3 nm @ 1 kV |
| Magnification Range | 10× – 1,000,000× |
| Accelerating Voltage | 0.02 – 30 kV |
| Maximum Sample Diameter | ≤ 179 mm |
| Stage | 5-Axis Motorized Eucentric Stage |
| Standard Detectors | In-Lens SE Detector, Everhart-Thornley SE Detector, Solid-State Backscattered Electron (BSE) Detector |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Crossbeam 550 |
| Configuration | Fully Integrated FIB-SEM Platform with Gemini II Electron Optics and High-Current Ga⁺ Focused Ion Beam |
| Maximum Ion Beam Current | 100 nA |
| Resolution (SE, 1 kV, Tandem Decel) | ≤1.4 nm |
| Sample Chamber Options | Standard (18 ports) or Extended (22 ports) |
| X/Y Stage Travel | 100 mm (standard chamber) or 153 mm (extended chamber) |
| Inlens EsB Detector Depth Sensitivity | <3 nm |
| EDS Integration | Full 3D Tomography-Compatible Energy-Dispersive Spectroscopy Module |
| Software Platform | ZEISS Atlas 5 for Automated 3D FIB-SEM Tomography and Correlative Analysis |
| Compliance | Designed for GLP/GMP environments |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model Series | SIGMA |
| Instrument Type | Desktop SEM |
| Electron Gun Type | Cold Field Emission |
| Microscope Class | High-Resolution Field Emission SEM |
| Secondary Electron (SE) Image Resolution | 1.0 nm @ 1 kV, 0.8 nm @ 3 kV |
| Maximum Magnification | 1,000,000× |
| Accelerating Voltage Range | 0.02–30 kV |
| Backscattered Electron (BSE) Image Resolution | 3.0 nm @ 30 kV |
| Working Distance for Analysis | 8.5 mm |
| Tilt Angle for EDS Collection | 35° |
| Variable Pressure Mode | Yes (C2D & VP-SE Detectors) |
| In-Lens SE/BSE Dual Detection | Yes |
| STEM-in-SEM Capability | Yes (aSTEM Detector Optional) |
| EDS Integration | SmartEDX (Si(Li)/SDD, Nitride Window Optimized for Light Elements) |
| RISE Integration | Yes (Fully Integrated Confocal Raman Imaging) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Crossbeam 350 |
| Configuration | Standard Chamber (18 ports) |
| Electron Optics | Gemini I with Tandem Decel |
| FIB Source | Liquid Metal Ga⁺ |
| Max FIB Current | 100 nA |
| SEM Resolution | ≤1.4 nm @ 1 kV (Tandem Decel) |
| Chamber Dimensions | Ø220 mm × H220 mm |
| Stage Travel | X/Y = 100 mm, Z = 40 mm |
| Detector Options | Inlens SE, Inlens EsB, VPSE, Inlens Duo |
| Software Platform | ZEISS Atlas 5 (3D Tomography & EDS Integration) |
| Compliance | Fully compatible with ASTM E1558, ISO/IEC 17025 workflows, GLP/GMP audit-ready data traceability (via Atlas 5 metadata logging) |
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