- All
- Favorite
- Popular
- Most rated
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | IS4000 / IS6000 |
| Temperature Range (Pyrometer) | 450 °C – 1,300 °C |
| Temperature Range (Bandgap Module) | Room Temperature – 700 °C |
| Spectral Bands (Pyrometer) | 950 nm & 850 nm |
| Spectral Bands (Reflectometer) | 950 nm & 470 nm |
| NETD (Pyrometer) | < 0.5 °C |
| NETD (Thickness) | < 1 nm @ film > 100 nm |
| Spot Size | Ø2.75″ CF flange (optional Ø4.5″ CF with edge mount) |
| Dimensions | 100 × 140 × 130 mm |
| Minimum Target Distance | > 7 mm |
| Substrate Compatibility | Si, GaAs, InP, Sapphire, STO, GaSb, MCT, ZnO, GaN, ZnTe, SiC, CIGS |
| Interface | RS-232 serial |
| OS Requirement | Windows XP or later |
| Compliance | Designed for GLP/GMP-aligned process environments |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SSA Pro 100/150-25, SSA Pro 250/200-10 |
| Crucible Capacity | 10–100 cc |
| Beam Uniformity | ±1.5% over 100 mm² at 150 mm source-to-substrate distance (SSA Pro 100/150-25) |
| Beam Current Stability | ±1.0% |
| Beam Response Time | ≤250 ms |
| Shutter Actuation Time | <0.5 s |
| Maximum Deposition Rate | >10 Å/s (Alq₃ at 340 °C |
| Substrate Temperature | <40 °C during operation |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVT-Excel |
| Temperature Range | 0–600 °C |
| Power Rating | 600–1000 W |
| Temperature Stability | ±0.1 °C |
| Temperature Repeatability | ±0.1 °C |
| Thermocouple Type | K-type |
| Crucible Capacities | 16, 20, 22, 40, 60, and 150 cm³ (including conical-walled and PBN crucibles) |
| Standard Length | 12 in (304.8 mm) |
| Flange Options | 2.75 in or 4.5 in OD ConFlat (CF) |
| Filament | Amphenol annular heater |
| Thermocouple Connector | Omega subminiature |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 35V14 |
| Pricing | Available Upon Request |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-LBFM |
| Vacuum Compatibility | Ultra-High Vacuum (UHV) |
| Filament Positioning | Front-of-source mountable |
| Bakeout Temperature | 230 °C (max), 200 °C (standard operational) |
| Flange Options | 2.75″ CF or 4.5″ CF |
| Optional Isolation Valve | Yes |
| Beam Voltage | 10 kV |
| Filament Current | 3 A |
| Emission Current | 5 A |
| Optical Path Clearance | 4.5″ CF-compatible aperture |
| Beam Spot Diameter | 1.0 mm at 17″ (432 mm) working distance |
| Customizable Probe Length | Yes |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | RHEED |
| Electron Beam Energy | 10 keV |
| Filament Current | 3 A |
| Emission Current | 5 A |
| Spot Size | 1.0 mm at 17″ (432 mm) working distance |
| Maximum Bakeout Temperature | 230 °C |
| Flange Options | 2.75″ and 4″ CF |
| Detector | High-Resolution CCD or Scientific CMOS Camera |
| Software | Real-Time RHEED Image Analysis Suite (2D/3D intensity profiling, oscillation tracking, growth rate calculation) |
| Magnetic Shielding | Integrated mu-metal housing for electron optics |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-C-30000 |
| Capacity | 30,000 cc |
| Compatible Materials | Se, Te, S |
| Feedthrough Flange | 4.5″ (DN63) CF (custom sizes available) |
| Max Bulk Evaporation Temperature | 450 °C / 500 °C (outgassing) |
| Diverting Aperture Max Temperature | 700 °C / 900 °C (outgassing) |
| Source Temperature Stability | ±0.1 °C |
| Thermocouple Type | K-type |
| Electrical Connectors | Amphenol circular feedthrough (filament), Omega subminiature T/C connectors |
| Bakeout Temperature | 200 °C |
| Beam Flux Stability | <1% (with integrated beam flux sensor) |
| Max Operating Pressure | 1×10⁻⁴ Torr |
| Deposition Uniformity | ±6% at 300 mm source-to-substrate distance |
| Heating Time to 400 °C | <60 min |
| Cooling Time to 100 °C | <120 min |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | CL/HL/HT Series |
| Temperature Range | 0 °C to 1,400 °C |
| Power | 600 W or 1 kW |
| Temperature Stability | ±0.1 °C |
| Temperature Repeatability | ±0.1 °C |
| Thermocouple | Type C (Type D optional) |
| Crucible Capacity | 16–80 cm³ |
| Standard Flange | 2.75″ or 4.5″ OD-CF |
| Standard Length | 12″ (305 mm) |
| Filament | Amphenol annular filament |
| Thermocouple Connector | Omega subminiature |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | AccuFlux |
| Application | Real-time, non-invasive atomic beam flux monitoring in molecular beam epitaxy (MBE) and metalorganic chemical vapor deposition (MOCVD) systems |
| Simultaneous Channels | 4 elements |
| Minimum Detectable Growth Rate | <0.002 nm/s |
| Light Source Type | Element-specific hollow-cathode lamps |
| Optical Architecture | Self-referencing, self-aligning optical path |
| Source Compatibility | Solid-source effusion cells and gas-phase precursors |
| Environmental Robustness | Operable under high partial pressure conditions (e.g., As₂, PH₃, O₂) |
| Control Interface | Optional remote I/O module with real-time shutter and source feedback for closed-loop process control |
| Regulatory Alignment | Designed to support GLP-compliant data integrity and ASTM F1526-22 compliant thin-film process validation |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVT-AH |
| Heating Principle | Electron-beam heated tungsten/molybdenum filament |
| Max Filament Temperature | 2873 K |
| Emission Current | Up to 100 mA |
| Power Supply Requirement | 300 W |
| Filament Current | 15 A |
| Vacuum Interface | 2.75″ (70 mm) CF flange |
| Compatible With | Standard MBE Systems via Adaptable Flange Kits |
| Recommended Power Supply | SVTA-H1-PS (Triply Integrated: High-Voltage Bias, High-Current Filament, and Emission Control with Beam Current Monitoring & Display) |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model Options | 2.75", 4.5", 6.0" CF Flange |
| RF Power Range | 200–600 W |
| Gas Flow Range | 0.1–10 SCCM (N₂, O₂, H₂) |
| Plasma Chamber Materials | Pyrolytic Boron Nitride (PBN), Alumina, Quartz |
| Cooling | Water, 0.17 GPM (0.227 m³/hr) |
| Plasma Viewing Window | Integrated |
| Aperture & Cavity Geometry | Customizable |
| RF Matching | Manual (Auto-tuning optional) |
| Plasma Beam Composition | Predominantly neutral atomic species, negligible ion energy (<5 eV) |
| Typical Growth Rate | >4 µm/hr for nitride/oxide films |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-O3 |
| Configuration | Integrated Ozone Generation, Cryogenic Storage & Controlled Delivery Subsystem |
| Compliance | Designed for UHV-Compatible MBE Integration |
| Control Interface | Touchscreen HMI + RoboMBE™ Remote Software Suite |
| Gas Purity | >99.999% O₃ (Ozone-in-O₂ basis), <1 ppm NOₓ/H₂O hydrocarbon contaminants |
| Operating Pressure Range | 1×10⁻⁸ to 1×10⁻³ Torr (process chamber interface) |
| Ozone Concentration Range | 1–15 wt% in oxygen carrier gas |
| Cryogenic Trap Temperature Range | –120 °C to –40 °C (programmable) |
| Delivery Line Material | Electropolished 316L SS + Fluorosilicone-elastomer-sealed VCR® fittings |
| Cooling | Integrated recirculating chiller (water-cooled ozone injector head) |
| Footprint | 600 mm × 750 mm × 1,200 mm (W×D×H) |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | PLD-01 / PLD-02 |
| Chamber Diameter | 12" (305 mm) |
| Base Pressure | ≤5×10⁻⁸ Torr (with 250 L/s turbomolecular pump) |
| Target Mount | 6×1" (25 mm) rotating and Z-adjustable |
| Substrate Holder | 1" (25 mm), heated to 800 °C (1000 °C optional), rotation & Z-motion enabled |
| In-situ Monitoring | Quartz Crystal Microbalance (QCM) deposition rate monitor |
| Optional Add-ons | RHEED, differential pumping, laser beam scanning, RF plasma source (O₂/N₂), load-lock integration, L-MBE upgrade |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-APH3-GCS |
| Operating Temperature Range | 150 °C to 1300 °C |
| Heating Configuration | Single Filament with Dual-Gas-Tube Furnace |
| Cracking Zone Materials | High-Purity Pyrolytic Boron Nitride (PBN) and Tantalum |
| Aperture Plate System | Modular, User-Selectable |
| Gas Delivery | High-Pressure Compatible, MFC-Integrated |
| Beam Uniformity Optimization | Customizable Source Length |
| Control Interface | Automated Beam Flux Regulation via Mass Flow Controllers (MFCs) |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-LES-300 |
| Deposition Width | 300 mm |
| Source Capacity | 500 cc |
| Flange | 6″ (DN100) CF |
| Maximum Effusion Orifice Temperature | 1,600 °C |
| Maximum Bulk Heater Temperature | 1,500 °C |
| Source Temperature Stability | ±0.1 °C |
| Beam Flux Stability | <1% |
| Operating Pressure Range | ≤5×10⁻⁵ Torr |
| Thickness Uniformity | ±4% (at 300 mm source-to-substrate distance) |
| Thermocouple Type | Type C (Type K optional) |
| Cooling Time (from 100 °C) | <120 min |
| Bakeout Temperature | 200 °C |
| Cooling Water Connections | 2 × 1/4″ VCR (inlet & outlet) |
| Max Water Pressure | 80 psi |
| Flow Rate | 500 mL/min |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVT-35 Series (e.g., 35-6, 35-N, 35-G-4, SM-6, S-8, 35-D, SVT-V, NanoFab, UVD-02, PLD-02, 35V14, 26-O-V) |
| Base Vacuum | < 1×10⁻¹⁰ Torr |
| Substrate Size Options | 2″, 3″, 4″, 6″, 8″, or multiple small wafers (up to 14″ in 35V14) |
| Source Capacity | Up to 10 effusion cells (standard), plus optional RF plasma sources, cracking cells, e-beam evaporators, or liquid-source injectors |
| Chamber Architecture | Modular UHV system with load-lock, prep/analysis chamber, and main growth chamber |
| Compliance | Designed for ASTM F1529, ISO 14644-1 Class 4 cleanroom integration, and GLP/GMP-aligned process documentation workflows |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-CLM-6, SVTA-CLM-4 |
| Maximum Substrate Size | 200 mm (SVTA-CLM-6), 125 mm (SVTA-CLM-4) |
| Port Configuration | Six 305 mm (12″) CF flanges + one 152 mm (6″) CF viewport + one 70 mm (2.75″) CF ion gauge port (SVTA-CLM-6) |
| Vacuum Compatibility | UHV-capable (≤1×10⁻⁹ Torr base pressure with appropriate pumping) |
| Structural Material | 304 or 316 stainless steel, electropolished interior |
| Flange Standard | ConFlat (CF), ISO-K and ISO-F variants available upon request |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-MAN |
| Vacuum Compatibility | Ultra-High Vacuum (UHV) |
| Max Substrate Temperature | 1400 °C |
| X-Y Positioning Resolution | 1 µm |
| X-Y Repeatability | ±1 µm |
| X-Y Travel Range | ±0.5 inch |
| Z Travel Range | 4.0 inch |
| Z Resolution | 1 mm (or 1/32 inch) |
| Z Repeatability | ±1 mm (or ±1/32 inch) |
| Rotary Accuracy | ±1.25° |
| Rotary Hysteresis | <1° |
| Corrosion-Resistant Options | O₂-compatible, NH₃-compatible |
| Substrate Diameter Support | 1″ to 8″ |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVT-DF |
| Interface | 4.5″ or larger Conflat (CF) flange |
| Temperature Range | 0 °C to 1,400 °C |
| Power Rating | 600 W / 1 kW |
| Temperature Stability | ±0.1 °C |
| Temperature Reproducibility | ±0.1 °C |
| Thermocouple Type | Type C (Type D optional) |
| Crucible Capacities | 16 cc, 20 cc, 22 cc, 40 cc, 60 cc, 85 cc, 150 cc |
| Standard Length | 12″ (304.8 mm) |
| Flange Options | 2.75″ or 4.5″ OD CF |
| Filament Connector | Amphenol ring-type |
| Thermocouple Connector | Omega subminiature |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SVTA-CL |
| Pricing | Upon Request |
| Spectral Range | 200–900 nm |
| Optical Resolution | 0.5 nm |
| Detector Quantum Efficiency | 25% |
| Detector Output | 10 V/nW |
| Noise-Equivalent Voltage | <250 V |
| Viewport | 2.75'' ConFlat (CF) |
| External Dimensions | 9.0'' × 25.5'' × 10.1'' (22 cm × 65 cm × 26 cm) |
| Internal Chamber Clearance | 1.25'' × 13.1'' (3.2 cm × 34 cm) |
| Linear Translation Stroke | 8'' (20.3 cm) |
| Target-to-Detector Distance | 2'' (5.1 cm) |
| OS Compatibility | Windows 9x/2000/XP |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SMART NanoFab |
| Pricing | Upon Request |
| Source Capacity | 4 or 8 effusion cells / e-beam sources |
| Integrated In-situ Monitors | RHEED, QCM, Linear Beam Flux Monitor |
| Growth Modes | Thermal Evaporation, E-beam Evaporation, RF Plasma, Pulsed Laser Deposition (PLD), Sputtering, Gas-Phase Precursor Delivery |
| Compatible Materials | III–V (e.g., GaAs, InP), II–VI (e.g., CdTe, ZnSe), II–Oxides (e.g., ZnO), III–Nitrides (e.g., GaN, AlN), and other compound semiconductors |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | SVTA-VC-45 |
| Heating Zones | As (2-zone), P/Sb/Te/Se/S (3-zone) |
| Cooling | Integrated water-cooled jackets for evaporator body, valve, cracking tube, and PBN crucible |
| Control Options | Manual needle valve (standard), computer-controlled ACM valve (optional, SVTA-VC-ACM) |
| Software Integration | Compatible with RoboMBE® |
| Crucible Materials | High-purity PBN, molybdenum, or tantalum |
| Vacuum Compatibility | UHV (≤1×10⁻¹⁰ Torr) |
| Source Capacities | 200 cm³ or 500 cm³ |
| Compliance | Designed for GLP/GMP-aligned MBE process environments |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | WP-15 |
| Cleaving Capacity | 15 mm × 15 mm input wafer (10–32 mm square configurable) → 15 × 1 mm × 15 mm bar strips (bar width: 1–5 mm adjustable) |
| Vacuum Compatibility | UHV (<1×10⁻⁹ Torr) |
| Flange | 8-inch CF (ConFlat), bakeable to 180 °C (200 °C optional) |
| Sample Orientation | Dual-axis alignment (X/Y-direction cleaving) |
| Loading | Cassette-based, load-lock compatible |
| Integrated Option | In-situ passivation deposition module (e.g., SiO₂, SiNₓ, Al₂O₃) |
| Brand | SVT Associates |
|---|---|
| Origin | USA |
| Model | 35-V-100 |
| Substrate Size | 4-inch |
| Source Capacity | Up to 10 effusion cells |
| Se Source Options | Point sources (200–2000 cm³), Linear source (8000 cm³) |
| Substrate Heater | High-temperature, uniform, programmable up to 700 °C |
| Vacuum System | Multi-pump configuration with integrated Se trap |
| Chamber Architecture | Modular design |
| In-situ Monitoring | Integrated quartz crystal microbalance (QCM) and optical emission spectroscopy (OES) |
| Compliance | Designed for GLP-compliant R&D environments |
Show next