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| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | FlipScribe |
| Maximum Scribing Speed | Manual Operation |
| Application Scope | Semiconductor Wafer Dicing, Backside Alignment Scribing, Brittle Substrate Preparation |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | LatticeAx 420 |
| Maximum Linear Scribing Speed | 600 µm/s |
| Application Scope | Semiconductor Wafers, MEMS, Compound Semiconductors (SiC, GaN), Optical Substrates, and Research-Scale Device Fabrication |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Model | FlexScribe |
| Sample Size Range | 5 mm to 300 mm |
| Blade Options | Tungsten Carbide (#54346), Diamond (#54343), Deep-Cut Wheel (#54344) |
| Primary Application | Semiconductor Wafer and Brittle Material Scribing |
| Operation Mode | Manual Linear Scribing Only |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, compatible with GLP documentation workflows |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | LatticeAx 120 |
| Maximum Linear Scribing Speed | 100 mm/min |
| Application Scope | Semiconductor Wafers, Compound Semiconductors, Optical Substrates |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Type | Manual Cleaving Instrument |
| Model | Small Sample Cleaver |
| Sample Width Capacity | 3–15 mm |
| Sample Thickness Range | 200–900 µm |
| Cleave Platform Dimensions | ≤2 × 2 mm |
| Indent Length | 0.5 mm |
| Compatibility | Designed for use with PELCO® LatticeAx® (1 mm indent) |
| Mounting | Four magnetic fixation points |
| Portability | Handheld, volume ≈ 100 mm³ |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | LatticeAx 225 |
| Maximum Scribe Line Speed | 600 mm/min |
| Application Scope | Semiconductor Wafers, MEMS, Optoelectronics, and Thin-Film Devices |
| Positioning Accuracy | ±20 µm |
| Scribe Impression Length | <1 mm |
| Impression Width | ~10 µm |
| Imaging System | USB 2.0 Digital Microscope with Polarizing Filter and Real-Time Capture Software |
| Vacuum Fixation | Pneumatically Actuated Valve-Controlled Pump |
| Sample Compatibility | Si, SiC, GaAs, Sapphire, Glass, Quartz, and Thin-Film Substrates (Ø50–300 mm, Thickness 100–1000 µm) |
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