- All
- Favorite
- Popular
- Most rated
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | FlipScribe |
| Maximum Scribing Speed | Manual Operation |
| Application Scope | Semiconductor Wafer Dicing, Backside Alignment Scribing, Brittle Substrate Preparation |
| Brand | Guangzhou Jingying |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Country of Origin | China |
| Model | JY-CM001 |
| Flow Rate Range | 0–39 mL/min (adjustable) |
| Input Voltage | AC 220 V |
| Operating Modes | Etchant Dispense / Deionized Water Rinse / Standby |
| Safety Design | Closed-loop reagent handling with no manual pipetting required |
| Compliance | Designed for ISO/IEC 17025-compliant metallography labs |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | LatticeAx 420 |
| Maximum Linear Scribing Speed | 600 µm/s |
| Application Scope | Semiconductor Wafers, MEMS, Compound Semiconductors (SiC, GaN), Optical Substrates, and Research-Scale Device Fabrication |
| Brand | Neocera |
|---|---|
| Origin | Finland |
| Model | PED-120 |
| Vacuum Chamber | 12" Ø |
| Base Pressure | <1×10⁻⁶ Torr |
| Substrate Heater | 2" diameter, 950 °C max, ±1 °C stability |
| Target Capacity | six 1" or three 2" targets |
| Target-to-Substrate Distance | 4" |
| Gas Flow Control | 100 sccm MFC (O₂-compatible) |
| Turbo Pump | 260 L/s with cryo-trap |
| Roughing Pump | 4 m³/hr oil-free rotary vane |
| Electron Source | PEBS-20, 8–20 kV, 0.1–0.8 J/pulse, ~100 ns pulse width, ≤15 Hz rep rate, beam spot ≥6×10⁻² cm², energy density up to 1.3×10⁸ W/cm² |
| Z-axis travel | 50 mm, XY-axis travel: ±20 mm |
| Operating Lifetime | ≥10⁷ pulses |
| Max PEBS Housing Temp | 85 °C |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Model | FlexScribe |
| Sample Size Range | 5 mm to 300 mm |
| Blade Options | Tungsten Carbide (#54346), Diamond (#54343), Deep-Cut Wheel (#54344) |
| Primary Application | Semiconductor Wafer and Brittle Material Scribing |
| Operation Mode | Manual Linear Scribing Only |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, compatible with GLP documentation workflows |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | LatticeAx 120 |
| Maximum Linear Scribing Speed | 100 mm/min |
| Application Scope | Semiconductor Wafers, Compound Semiconductors, Optical Substrates |
| Brand | Picosun |
|---|---|
| Origin | Finland |
| Model | R-Series |
| Substrate Size | 200 mm (8-inch) |
| Process Temperature | Up to 500 °C |
| Precursor Channels | 6 |
| Weight | 350 kg |
| Dimensions (W × H × D) | 146 cm × 146 cm × 84 cm |
| Thickness Uniformity | ±1% |
| Reactor Materials | 316 Stainless Steel, Titanium, Nickel, Aluminum, Quartz |
| Precursor States | Gas, Liquid, Solid |
| Load Lock | Picoloader™ Manual Transfer System with Pre-Vacuum Chamber and Gate Valve |
| Vacuum Pump Capacity | 30–80 m³/h |
| Carrier Gas | ≥99.999% N₂ or Ar, min. 2 slm |
| Power Supply | 100–240 V, 50/60 Hz, 1- or 3-phase, 3.7 kW |
| Cooling | Air-cooled (no external water required) |
| Exhaust | Dedicated for pump and precursor cabinets |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PLD |
| Pricing | Available Upon Request |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Type | Manual Cleaving Instrument |
| Model | Small Sample Cleaver |
| Sample Width Capacity | 3–15 mm |
| Sample Thickness Range | 200–900 µm |
| Cleave Platform Dimensions | ≤2 × 2 mm |
| Indent Length | 0.5 mm |
| Compatibility | Designed for use with PELCO® LatticeAx® (1 mm indent) |
| Mounting | Four magnetic fixation points |
| Portability | Handheld, volume ≈ 100 mm³ |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | LatticeAx 225 |
| Maximum Scribe Line Speed | 600 mm/min |
| Application Scope | Semiconductor Wafers, MEMS, Optoelectronics, and Thin-Film Devices |
| Positioning Accuracy | ±20 µm |
| Scribe Impression Length | <1 mm |
| Impression Width | ~10 µm |
| Imaging System | USB 2.0 Digital Microscope with Polarizing Filter and Real-Time Capture Software |
| Vacuum Fixation | Pneumatically Actuated Valve-Controlled Pump |
| Sample Compatibility | Si, SiC, GaAs, Sapphire, Glass, Quartz, and Thin-Film Substrates (Ø50–300 mm, Thickness 100–1000 µm) |
Show next