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| Brand | FSM |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | FA-2000 |
| Pricing | Available Upon Request |
| Brand | FSM |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | VIT |
| Pricing | Available Upon Request |
| Brand | Bruker |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CETR-UMT |
| Instrument Type | Nanoindentation and Scratch Tester |
| Maximum Indentation Depth | 75 mm |
| Effective Load Range | 1 mN to 1000 N |
| Load Resolution | 1 µN |
| Displacement Range | ±75 mm |
| Displacement Resolution | 0.1 nm |
| Maximum Friction Force | 1000 N |
| Indenter Types | Conical, Berkovich, Spherical, Cube-Corner, Flat Punch, Custom Tips |
| Thermal Drift | <0.1 nm/min (at 25 °C, stabilized) |
| Brand | FSM |
|---|---|
| Origin | USA |
| Model | FSM-413 EC |
| Measurement Principle | Infrared (IR) Interferometric EchoProbe™ Technology |
| Substrate Compatibility | Si, GaAs, InP, SiC, Sapphire, Quartz, Glass, Polymers |
| Configurations | Single-Probe (substrate thickness only) / Dual-Probe (total thickness + topography) |
| Optional Modules | Trench/Through-Silicon Via (TSV) Depth, Film Thickness, Bump Height, Surface Roughness (Rq/Ra), Sidewall Angle |
| Compliance | Designed for ISO 9001-certified semiconductor fabrication environments |
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