Precision Geometric Measurement Instruments
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| Brand | KLA |
|---|---|
| Origin | USA |
| Model | HRP®-260 |
| Measurement Principle | Stylus-based contact profilometry with dual-stage scanning (macro-stage + high-resolution piezo stage) |
| Scan Range | 200 mm (macro), 90 µm (high-res piezo) |
| Step Height Range | 0.1 nm to 327 µm |
| Normal Force Range | 0.03–50 mg |
| Sample Diameter Support | 75–200 mm (opaque & transparent substrates) |
| Automation | Fully automated wafer handling, pattern recognition, SECS/GEM compliance |
| Software | Integrated metrology suite with ISO 4287/4288, ASME B46.1, and SEMI E10/E126 compliant analysis modules |
| Data Management | Audit-trail enabled, FDA 21 CFR Part 11 ready, GLP/GMP traceable reporting |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | HRP®-260 |
| Product Type | Contact Profilometer / Surface Roughness Tester |
| Operating Principle | Stylus-Based Profilometry |
| Horizontal Scan Range (Long-Range Stage) | 200 mm (no stitching required) |
| High-Resolution Stage Travel | 90 µm × 90 µm |
| Vertical Resolution | 1 nm |
| Stylus Normal Force Range | 0.03–50 mg |
| Step Height Measurement Range | <1 nm to 327 µm |
| Stylus Tip Radius Options | 20 nm – 50 µm |
| Stylus Included | DuraSharp® diamond stylus (40 nm radius) |
| Wafer Handling | Automatic robotic loading for 75–200 mm opaque (e.g., Si, GaAs) and transparent (e.g., sapphire) substrates |
| Compliance | SEMI E4, E5, E30, E37 |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | P-17 |
| Product Type | Contact Profilometer / Surface Roughness Tester |
| Operating Principle | Stylus-Based Profilometry |
| Scan Range | Up to 200 mm (no image stitching required) |
| Step Height Range | 1 nm to 1000 µm |
| Stylus Force Control | 0.03–50 mg |
| Camera Resolution | 5 MP color, optical zoom |
| Compliance | SEMI E4, E5, E30, E37 |
| Software Platform | Apex Analysis Software (ISO/ASME-compliant), Offline Analysis Module, SECS/GEM & HSMS support |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-170 |
| Pricing | Available Upon Request |
| Measurement Principle | Capacitive Sensing |
| Measurement Range | 0–1000 µm |
| Accuracy | ±0.5 nm |
| Probe Tip Radius | 2.0 µm |
| Probe Normal Force | 0.5–50 mg |
| Scan Length | Up to 200 mm (Seamless, No Stitching Required) |
| Step Height Repeatability | 0.4 nm |
| Vertical Resolution | 0.001 nm |
| Maximum Sample Size | 200 mm Diameter |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | P-170 |
| Product Category | Contact Stylus Profilometer / Surface Roughness Tester |
| Operating Principle | Stylus-based Contact Profilometry |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-7 |
| Price | USD 75,000 (FOB) |
| Measurement Principle | Capacitive Probe-Based Profilometry |
| Vertical Measurement Range | 0–1000 µm |
| Vertical Accuracy | ±0.5 Å |
| Tip Radius | 2.0 µm |
| Normal Force Range | 0.5–50 mg |
| Scan Length | 150 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤4 Å |
| Vertical Resolution | ≤0.01 Å |
| Maximum Sample Diameter | 150 mm |
| Platform Positioning Repeatability | 2 µm |
| Max Sample Height | ≥30 mm |
| Optical Zoom | 4× (motorized) |
| Camera | 5 MP color CCD |
| Digital Magnification | 4× |
| Vibration Isolation Requirement | ≤250 µin/sec (1–100 Hz) |
| Ambient Noise Limit | ≤80 dB(A) |
| Airflow Limit | ≤100 ft/min |
| Dimensions (W×D×H) | 430 × 570 × 670 mm |
| Weight | 80 kg |
| Brand | KLA |
|---|---|
| Model | Profilm 3D |
| Type | Non-contact Optical Profilometer / Surface Roughness Analyzer |
| Measurement Principle | White Light Interferometry (WLI) with Vertical Scanning Interferometry (VSI) and Phase-Shifting Interferometry (PSI) |
| Vertical Range | VSI: 50 nm – 100 mm |
| PSI | 0 – 3 µm |
| Reflectance Range | 0.05% – 100% |
| Piezo Scan Range | 500 µm |
| XY Stage Travel | 100 mm × 100 mm |
| Compliance | ISO 25178-604, ISO 4287, ISO 4288, ASME B46.1, ASTM E2923 |
| Software | ProfilmOnline™ Cloud-Based Analysis Platform |
| Data Export | CSV, TIFF, BMP, OBJ, STP, DXF |
| Roughness Parameters | 47 ISO/ASME/EUR-compliant parameters |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Profilm3D |
| Product Type | Non-contact 3D Optical Profilometer / Surface Roughness Analyzer |
| Operating Principle | White Light Interferometry |
| Measurement Modes | Vertical Scanning Interferometry (VSI) and Phase Shifting Interferometry (PSI) |
| Z-Stage Travel | 100 mm |
| Objective Turret | 5×–100× (Michelson 5×, Mirau 10×/20×/50×/100×) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-7 |
| Measurement Principle | Contact Stylus Profilometry |
| Vertical Measurement Range | 1 nm to 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Lateral Resolution | Determined by stylus tip radius (0.1–50 µm selectable) |
| Stylus Tip Radius | 0.7 µm (standard), down to 100 nm optional |
| Normal Force Range | 0.03–50 mg (force-controlled feedback) |
| Scan Length | Up to 150 mm (single-pass, no stitching required) |
| Wafer/Specimen Max Size | 150 mm diameter |
| Step Height Repeatability | < 0.2% of measured height (1σ) |
| Surface Flatness Calibration | Arc correction algorithm integrated |
| Imaging System | 5 MP color CCD with motorized zoom and focus |
| Software Platform | Apex™ v6.x with ISO/ASME-compliant analysis modules |
| Compliance | SEMI E4, E5, E30, E37 |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported |
| Model | Tencor® P-170 |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 0.5 nm – 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Probe Tip Radius | < 12 nm (standard diamond tip) |
| Normal Force Range | 0.03–15 mg (closed-loop force control) |
| Maximum Scan Length | 200 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤ 0.15 nm (1σ, over 24 h) |
| Maximum Sample Size | Ø200 mm × 25 mm thick |
| Optical System | 5 MP color camera with motorized zoom and dual-view (top + side) optics |
| Automation | Integrated robotic handler for opaque (e.g., Si) and transparent (e.g., sapphire) wafers (Ø75–200 mm) |
| Compliance | ASTM E1399, ISO 4287, ISO 25178-2, USP <1059>, FDA 21 CFR Part 11 (audit trail & electronic signature enabled) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ZETA-20 |
| Product Type | Non-contact Optical Profilometer / Surface Roughness Analyzer |
| Operating Principle | White-light Interferometry |
| Key Imaging Technology | ZDot™ 3D Imaging |
| Vertical Resolution | Sub-Ångström (≤0.1 nm) |
| Measurement Modes | Six Integrated Optical Modules |
| Surface Reflectivity Range | 0.5% – >85% |
| Output | True-color 2D/3D Images |
| Compliance | ASTM E2921, ISO 25178-2, ISO 4287, USP <1056>, FDA 21 CFR Part 11 Ready (via optional software module) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Zeta-20 |
| Product Type | Non-contact 3D Optical Profilometer / Surface Roughness Analyzer |
| Measurement Principles | ZDot™ Multi-Mode Imaging, White Light Interferometry (WLI), Nomarski Differential Interference Contrast (DIC), Shear Interference, Broadband Reflectometry, Automated Optical Inspection (AOI) |
| Vertical Resolution | Sub-nanometer (typical, dependent on mode) |
| Lateral Resolution | ~0.4 µm (optical diffraction-limited) |
| Step Height Range | 1 nm – 10 mm |
| Surface Roughness Range | Ra 0.01 nm – 50 µm |
| Film Thickness Range | 30 nm – 100 µm (transparent films) |
| Defect Detection Limit | ≥1 µm |
| Field of View | Up to 8 mm × 6 mm (configurable via objective lenses) |
| Objective Lenses | 2.5×, 5×, 10×, 20×, 50×, 100× (motorized turret) |
| Software Platform | ZetaWare™ v6.x (GLP/GMP-compliant, 21 CFR Part 11 ready) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Zeta-20 |
| Product Type | Non-contact Profilometer / Surface Roughness Analyzer |
| Measurement Principle | Multi-Mode Optical Interferometry (ZDot™, White-Light Interferometry, Nomarski DIC, Shear Interference), Spectral Reflectometry |
| Key Capabilities | 3D Topography, True-Color Imaging, Step Height (0.008 nm – 10 mm), Surface Roughness (Ra down to sub-Å), Film Thickness (30 nm – 100 µm), Automatic Defect Detection (>1 µm), Wafer-Scale Warpage & Stress Analysis |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Zeta-300 |
| Product Type | Non-contact profilometer / surface roughness analyzer |
| Measurement Principle | Multi-mode optical interferometry (ZDot™, white-light interferometry, Nomarski differential interference contrast, shear interferometry) |
| Optical Capabilities | Simultaneous high-resolution 3D topography and true-color surface imaging |
| Vertical Resolution | Sub-nanometer (ZIC/ZSI), <0.1 nm (PSI), ≤1 nm (VSI) |
| Step Height Range | 0.8 nm to 1 mm |
| Surface Roughness Range | <0.05 nm RMS to >100 µm Sa |
| Film Thickness Range (ZFT) | 30 nm – 100 µm (transparent films) |
| Defect Detection Limit | ≥1 µm lateral resolution |
| Maximum Sample Size | Up to 280 mm Z-height |
| Compliance | ISO 25178, ISO 4287/4288, ASME B46.1, NIST-traceable calibration standards |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CS1 |
| Pricing | Available Upon Request |
| Substrate Diameter Range | 2 in. – 200 mm |
| Substrate Thickness Range | 350 μm – 1,100 μm |
| Material Compatibility | Opaque or transparent polished surfaces with ≥10% light scattering efficiency |
| Defect Detection Sensitivity | 0.3 μm PSL sphere equivalent (≥95% capture rate on bare Si) |
| Minimum Detectable Features | Scratches (100 μm × 0.1 μm × 50 Å), Pits (20 μm Ø × 50 Å depth), Stains (20 μm Ø × 10 Å thickness) |
| Signal Threshold | Defect signal amplitude >3× peak-to-valley background noise |
| Brand | Klocke Nanotechnik |
|---|---|
| Origin | Germany |
| Product Type | Contact-Mode 3D Profilometer / Surface Topography & Roughness Measuring System |
| Measurement Range (X/Y/Z) | 10–50 mm / 10–50 mm / 10–20 mm |
| Extended XY Travel | 100 × 100 mm² or 350 × 350 mm² |
| Motion Resolution | 1 nm |
| Tip Resolution | 0.5 nm |
| Probe Types | Metallic wire tip (radius < 100 nm), hook-type wire tip (radius < 100 nm), spherical tip (Ø 0.12–0.3 mm), diamond tip (for indentation) |
| Sensor Configuration | Dual-axis (horizontal & vertical) capacitive displacement sensors |
| Software Features | Automated tip calibration & approach, 2D/3D visualization, quantitative surface analysis, optional sequence generator for automated measurement routines |
| Brand | Klocke Nanotechnik |
|---|---|
| Origin | Germany |
| Type | Precision Piezo-Based Nanopositioning Platform |
| Model | Klocke Nano Positioning |
| Compliance | Designed for UHV, Cryogenic, and High-Magnetic-Field Environments |
| Max Load Capacity | 2 kg |
| Travel Range | 5–70 mm |
| Velocity | < 2 mm/s |
| Open-Loop Motion Resolution | 2 nm |
| Sensor Resolution (Closed-Loop) | < 10 nm |
| Degrees of Freedom | XYZ linear, Θ/Φ rotation, XY/Z scanning, hybrid coarse/fine modes |
| Customization | Fully configurable mechanical design, material options (Invar, titanium, ceramics), vacuum-compatible variants, integrated metrology interfaces |
| Brand | Kosaka |
|---|---|
| Origin | Japan |
| Model | EC1550H |
| Bearing Type | Porous Air Hydrostatic Bearing |
| Radial Spindle Accuracy | (0.02 + 0.0004H) µm (H = height in mm from table surface) |
| Max Measuring Diameter | 368 mm |
| Max External Diameter | 420 mm |
| Max Internal Diameter | 270 mm |
| Max Table Load | 25 kg / Φ450 mm |
| Vertical Travel (with B-type stylus arm) | 250 mm |
| Table Diameter | 160 mm |
| Filter Types | 2CR Standard, 2CR Phase-Compensated, Gaussian Phase-Compensated |
| Sensor Adjustment | One-Touch Multi-Axis Stylus Holder |
| Auto-Stop Function | R- and Z-axis Servo-Controlled Position Detection |
| Compliance | ISO 1101, ISO 12181, ISO 12180, ASME Y14.5, JIS B 0621 |
| Brand | KOSAKA |
|---|---|
| Origin | Japan |
| Model | EC3600A / EC3600B / EC3600C |
| Bearing Type | Porous Air-bearing Rotating Table |
| Rotational Accuracy | (0.06 + 0.0006H) µm (H = height in mm from table surface) |
| Max Measurable Diameter | Φ400–Φ650 mm (ID & OD) |
| Load Capacity | 150–250 kg |
| Vertical Travel Range | 400–1400 mm |
| Brand | KOSAKA |
|---|---|
| Origin | Japan |
| Model | EC4100H |
| Bearing Type | Porous Air Bearing |
| Radial Spindle Accuracy | (0.015 + 0.0003H) µm (H = height in mm from turntable surface) |
| Max Measurable Diameter | Ø450 mm (ID/OD) |
| Max Measurable Height | 570 mm (OD), 420 mm (ID) |
| Max Workpiece Diameter & Load Capacity | Ø600 mm / 60 kg |
| Vertical Travel | 400 mm (with B-type stylus arm) |
| Coaxiality Between Rotation Axis and Z-Axis | ≤0.4 µm / 200 mm |
| Brand | Kosaka Laboratory |
|---|---|
| Origin | Japan |
| Model | EC1850H |
| Bearing Type | Porous Air Bearing (Multi-Orifice, Hydrostatic) |
| Spindle Radial Accuracy | (0.02 + 0.00035H) µm (H = height in mm from turntable surface) |
| Max Measurable Diameter | Φ368 mm (internal/external), Φ470 mm (external only), Φ320 mm (internal only) |
| Max Workpiece Diameter/Load Capacity | Φ510 mm / 25 kg |
| Vertical Travel (Z-axis) | 300 mm (with extended stylus arm) |
| Automation Features | Auto-centering, Auto-tilt correction, One-touch multi-orientation probe holder, R/Z-axis servo-controlled auto-stop, Defect region annotation on polar/linear plots |
| Compliance | Designed for ISO 1101, ISO 12181 (Roundness), ISO 12180 (Cylindricity), and ASME Y14.5 geometric dimensioning and tolerancing (GD&T) workflows |
| Brand | Kosaka Laboratory |
|---|---|
| Origin | Japan |
| Model | EC2500H / EC2700H |
| Spindle Bearing Type | Porous Air Bearing |
| Radial Spindle Error (EC2500H) | (0.02 + 0.0003H) µm |
| Radial Spindle Error (EC2700H) | (0.015 + 0.0003H) µm |
| H | Height from Table Surface (mm) |
| Max. Measurable Diameter | Φ450 mm (OD/ID) |
| Max. OD Height | 570 mm |
| Max. ID Height | 420 mm |
| Max. Workpiece Diameter / Load Capacity | Φ600 mm / 60 kg |
| Vertical Stroke | 400 mm (with B-type stylus arm) |
| Parallelism Between Rotational Axis & Vertical Axis | 0.4 µm / 200 mm |
| Auto Centering & Tilt Compensation | Standard |
| Safety-Interlocked Stylus Probe | Standard |
| Origin | Germany |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Kosaka SE-500-59 |
| Price Range | USD 42,000 – 56,000 |
| Measurement Principle | Contact Stylus Profilometry (ISO 3274, ISO 4287, ISO 11562 compliant) |
| Vertical Measurement Range | ±400 µm (800 µm total) |
| Vertical Resolution | 0.08 nm |
| Horizontal Measurement Length | 55 mm (extendable to 81 mm via multi-trace stitching) |
| Straightness Accuracy | ≤0.3 µm over 55 mm |
| Stylus Tip Radius | 2 µm diamond |
| Stylus Force | 0.75 mN |
| Scan Speeds | 0.05–2.0 mm/s (6 discrete speeds + high-speed positioning) |
| Filter Types | Gaussian, 2RC, Special Gaussian |
| Cutoff Wavelengths (Roughness) | λc = 0.08, 0.25, 0.8, 2.5, 8.0 mm |
| Cutoff Wavelengths (Waviness) | λf = 0.8, 2.5, 8.0, 25.0 mm |
| Evaluation Parameters | 120+ standardized parameters per ISO, JIS, ANSI/ASME B46.1, and DIN 4768 |
| Display | 640×480 RGB TFT color LCD with capacitive touchscreen |
| Data Storage | USB flash drive (up to 8 GB) |
| Interface | RS-232 serial output |
| Power Supply | AC 90–240 V, 50/60 Hz, 200 VA |
| Brand | Kulite |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | RDD |
| Pricing | Upon Request |
| Brand | LEI-TECH |
|---|---|
| Origin | Tianjin, China |
| Manufacturer Type | Direct Manufacturer |
| Regional Classification | Domestic (China) |
| Model | LK-SZB564 |
| Configuration | Bridge-Type |
| Operation Mode | Fully Automatic |
| Instrument Orientation | Vertical |
| Measurement Principle | Contact-Based Tactile Probing |
| Measurement Volume (X×Y×Z) | 500 mm × 600 mm × 400 mm |
| Volumetric Accuracy | E ≤ (2.8 + L/300) µm |
| Probe System | YF1 + RA20 + RA13 (TELES), with Standard Force Module and M2 Interface |
| Probe Tip Mass | 22 g |
| Length Measurement System | Reflective Metallic Tape Encoder Scale |
| Maximum Permissible Temperature Deviation | ±1 °C (Standard Environment: 18–22 °C) |
| Relative Humidity Range | 40–70 % RH |
| Power Supply | 220 V ±10 %, 50–60 Hz |
| Minimum Air Supply Pressure | ≥0.55 MPa |
| Maximum Workpiece Load | 100 kg |
| Structural Material | Granite (All Three Axes) |
| Y-Axis Guideway | P-Class Precision Linear Rail |
| Drive System | High-Performance DC Servo Motor with Timing Belt Transmission |
| Control Architecture | Dual-Computer Embedded CMM Controller |
| Software Platform | MSU3D PRO v5.x (Proprietary 3D Metrology Suite) |
| Brand | Hexagon |
|---|---|
| Origin | Sweden |
| Model | AT500 |
| Protection Rating | IP54 |
| Operating Temperature Range | −15 °C to +50 °C |
| Battery Runtime | Up to 6 h (dual IATA-compliant hot-swappable batteries) |
| PowerLock Field of View | Wide-angle automatic beam reacquisition |
| B-Probeplus | Wireless 6DoF probe, 16° angular reception at 12 m, ISO 10360-10 compliant |
| Calibration & Traceability | ISO/IEC 17025 accredited |
| Key | Brand: Leica |
|---|---|
| Model | AT500 |
| Max Measurement Range | 320 m |
| Angular Resolution | 0.07 arcsec |
| Positional Accuracy | ±0.1 mm |
| Horizontal Rotation | 360° |
| Vertical Pitch | ±145° |
| Tilt Capability | ±145° |
| IP Rating | IP54 |
| Operating Temperature | −15 °C to +50 °C |
| Laser Class | IEC 60825-1:2014 Class 2 |
| Compliance | ISO/IEC 17025, ISO 10360-10 |
| Brand | Leica |
|---|---|
| Origin | Switzerland |
| Model | Leica AT930 |
| Max Measurement Range | 160 m (diameter) |
| Horizontal Rotation | 360° |
| Vertical Pitch | ±145° |
| IP Rating | IP54 (IEC 60529) |
| Operating Temperature | 0 °C to 40 °C |
| Relative Humidity | Up to 95% (non-condensing) |
| Laser Class | Class 2, compliant with IEC 60825-1:2014 |
| Data Output Rate | 1000 Hz |
| Integrated Environmental Monitoring | Temperature, Pressure, Humidity |
| Power Options | Hot-swappable rechargeable battery & AC supply |
| Wireless Connectivity | Built-in Wi-Fi (IEEE 802.11 a/b/g/n/ac) |
| Onboard Imaging | High-resolution color panoramic camera (OVC) |
| Target Acquisition | PowerLock™ automatic target reacquisition |
| Measurement Principle | Absolute Interferometric Distance Measurement (AIFM) |
| Brand | Hexagon |
|---|---|
| Origin | Sweden |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | AT930 |
| Pricing | Upon Request |
| Brand | Hexagon |
|---|---|
| Origin | Sweden |
| Model | AT960 |
| Protection Rating | IP54 (IEC 60529) |
| Operating Temperature | 0 °C to 40 °C |
| Relative Humidity | Up to 95% non-condensing |
| Laser Class | Class 2, compliant with IEC 60825-1:2014 |
| Measurement Range Diameter | Up to 160 m |
| Data Output Rate | Up to 1000 Hz (7-DOF) |
| Power | Hot-swappable rechargeable battery pack |
| Wireless Connectivity | Integrated Wi-Fi (IEEE 802.11 a/b/g/n) |
| Environmental Compensation | Integrated temperature, pressure, and humidity sensors |
| Optical View Camera | High-resolution color OVC for remote target acquisition |
| Alignment Mode | Origin-to-Gravity (OTG) for Z-axis gravity-referenced alignment |