X-ray Detection Devices
Filter
Showing 31–60 of 62 results
| Brand | KA Imaging |
|---|---|
| Origin | Canada |
| Model | Reveal 35C |
| Compliance | ASTM F792222-17 |
| Detector Architecture | Triple-layer stacked scintillator design |
| Imaging Modes | Single-exposure spectral DR (conventional DR, low-density image, high-density image) |
| Connectivity | Wireless (Wi-Fi 5/6), USB-C interface |
| Form Factor | Portable, battery-operated (optional), ruggedized enclosure for field NDT use |
| Software | SpectralDR® acquisition and material-separation suite with color-coded density mapping |
| Brand | KA Imaging |
|---|---|
| Origin | Canada |
| Model | REVEAL R 35C |
| Detection Principle | Spectral Digital Radiography (SpectralDR®) |
| Energy Discrimination | Triple-energy single-exposure acquisition |
| Connectivity | Wireless (Wi-Fi 6) |
| Compliance | ASTM F792–22 (formerly F792222-17) |
| Portability | Integrated battery-powered operation, ruggedized IP54 enclosure |
| Software Platform | Reveal™ Acquisition & Analysis Suite v4.2 |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | AXAS-A |
| Detector Type | Integrated SDD with Pulse Reset Preamp |
| Power Supply | ±12 V DC |
| FWHM (Mn Kα) | ≤133 eV (Premium Class) / ≤149 eV (Standard Class) |
| Finger Length Options | 50, 100 (standard), 160, 200, 300 mm |
| Upper Energy Limit | 20 keV (H7, H20, H30) or 30 keV (H50) |
| Low-Energy Window Options | H7LE*, H15LE* (with FWHM ≤136 eV & ≤144 eV) |
| Cooling | Integrated thermoelectric (Peltier) control |
| High-Count-Rate Capability | Enabled via pulse reset front-end architecture |
| Compliance | Designed for ASTM E1301, ISO 21389, and IEC 62596-compliant XRF and EPMA systems |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | AXAS-D |
| Detector Type | Integrated Digital Pulse Processing SDD System |
| Active Area Options | 7–50 mm² |
| Energy Resolution (FWHM @ Mn Kα) | ≤133 eV (Premium Class), ≤139 eV (Standard Class), ≤136/144 eV (H15LE variants) |
| Finger Length Options | 50, 100, 160, 200, 300 mm |
| Upper Energy Limit | 20 keV or 30 keV |
| Cooling | Integrated Thermoelectric Control |
| Signal Processing | Onboard Charge-Sensitive Preamplifier + Digital Pulse Processor (DPP) |
| Compliance | Designed for ASTM E1598, ISO 21397, and IEC 62495-compliant XRF and EPMA systems |
| Software Interface | KETEK DPP Software (shaping time adjustable from 0.5–16 µs) |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VIAMP |
| Detector Type | Silicon Drift Detector (SDD) Module with Flexible Cable Interface |
| Compatible Probes | VITUS H7–H50 Series |
| Operating Temperature Range | −35 °C (TEC-stabilized) |
| Bias Voltage | −140 V DC |
| Power Supply | +5 V / 25 mA, −5 V / 15 mA, TEC: 1.7 V / 280 mA @ −35 °C |
| Energy Resolution | <125 eV FWHM at Mn Kα (5.9 keV), typical for high-performance SDDs |
| Count Rate Capability | >100 kcps (with pulse pile-up rejection) |
| Signal Polarity | Positive |
| Ramp Threshold | +1.8 V (positive), −1.8 V (negative) |
| Preamp Gain | 3 mV/keV (±10%) |
| TEC ΔT | 70 K @ 20 °C heatsink temperature |
| Temperature Diode Slope | 2.35 mV/K @ 1 µA |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VITUS Series |
| Energy Resolution (FWHM @ 1 µs peaking time, Cube Class) | 129 eV (H7–H50), 136 eV (H80/R100), 133–136 eV (LE variants) |
| Peak-to-Background Ratio (P/B) | >15,000 (Cube Class H7–H50), >10,000 (H80), >400 (R100), >10,000 (LE variants) |
| Peak-to-Tail Ratio (P/T) | >2,000 (Cube Class), >1,000 (Standard Class) |
| Active Si Thickness | 450 µm |
| Maximum Count Rate | 1,000 kcps |
| Beryllium Window | 8 µm (standard), 12.5 µm (H50), 25 µm (H80/R100), AP3.3 low-energy polymer (H7LE/H18LE) |
| Cooling Performance | ΔT > 75 K (Cube/Premium), ΔT > 55 K (LE variants) |
| Operating Heat Sink Temperature | ≤30 °C |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VITUS |
| Active Area Options | 7–100 mm² |
| Window Material | 8 µm or 25 µm Beryllium (standard) / AP3.3 polymer (low-energy) |
| Cooling | Peltier, ΔT ≤ 75 °C @ 30 °C heatsink (standard class) / ≤ 55 °C @ 20 °C heatsink (low-energy class) |
| Energy Resolution (FWHM) | ≤133 eV @ Mn-Kα (5.9 keV), 8 µs peaking time |
| Count Rate Capability | >15,000 cps (standard), >10,000 cps (low-energy), dead time <50% at 100 kcps |
| Peak-to-Background Ratio (P/B) | >6,000 (guaranteed) |
| Brand | Laser Components |
|---|---|
| Model | IG26 Series |
| Detector Type | PIN Photodiode |
| Cutoff Wavelength | 2.6 µm |
| Spectral Range | 0.8–2.6 µm |
| Typical Responsivity @ 2.0 µm | 1.45 A/W |
| Operating Temperature | −40 °C to +85 °C (TE-cooled variants available) |
| Shunt Resistance | >10⁹ Ω (typ. at 0 V, 25 °C) |
| Dark Current | <10 nA (typ. at −5 V, 25 °C) |
| Capacitance | <20 pF (typ. at −5 V, 25 °C) |
| Active Area Options | 0.05–1.0 mm² |
| Package | TO-8, TO-46, or OEM hermetic ceramic |
| Brand | LND Inc. |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Custom-Configurable |
| Pricing | Available Upon Request |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | Monoblock |
| Tube Type | Metal-Ceramic |
| Target Materials | Ag, W, Pd, Rh |
| Operating Voltage Range | 10–50 kV |
| Current Range | 0–0.2 mA |
| Max Output Power | 10 W |
| Focal Spot Size | 400 µm |
| Stability | < 1.0% RSD |
| Beryllium Window Thickness | 0.25 mm |
| Max Input Power | 20 W |
| Operating Temperature | −10 °C to +50 °C |
| Storage Temperature | −40 °C to +60 °C |
| Weight | 500 g |
| Compliance | RoHS, CE (per IEC 61010-1), FDA 21 CFR Part 1020.40 (X-ray equipment) |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00045 |
| Voltage Range | −4 to 40 kV |
| Current Range | 0–100 µA |
| Max Output Power | 4 W |
| Optional Anode Materials | Ag, W, Pd, Rh, Ta, Au |
| Input Voltage | 7–12 VDC |
| Weight | 450 g |
| Warranty | 1 Year |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00046 |
| Voltage Range | ±4–40 kV |
| Current Range | 0–100 µA |
| Max Power Output | 4 W |
| Anode Target Options | Tungsten (W), Rhodium (Rh), Copper (Cu) |
| Focal Spot Size | 300 µm |
| HV Cable Length Options | 1–11.5 inches |
| Warranty | 12 months |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00050 |
| Voltage Range | 4–50 kV |
| Current Range | 0–200 µA |
| Max Output Power | 10 W |
| Optional Anode Materials | Ag, W, Pd, Rh, Ta, Au |
| Input Voltage | 6–12 VDC |
| Weight | 500 g |
| HV Cable Length Options | 1–11.5 in |
| Warranty | 1 year |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | TUB00082 |
| Tube Voltage | 4–50 kV |
| Tube Current | 0–200 µA |
| Max Output Power | 4 W |
| Anode Materials | Ag, W, Rh |
| Focal Spot Size | 400 µm |
| Input Voltage | 6–12 VDC |
| Weight | 350 g |
| Warranty | 1 year |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | TUB00083 |
| Tube Voltage | 4–50 kV |
| Tube Current | 0–200 µA |
| Max Output Power | 4 W |
| Anode Materials | Ag, W, Rh |
| Focal Spot Size | 400 µm |
| Input Voltage | 6–12 VDC |
| Weight | 350 g |
| Warranty | 1 year |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-BT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM) | < 170 eV (6 mm²), < 230 eV (13 mm²) |
| Peak-to-Background Ratio | 3600:1 @ 1 keV (6 mm², typical), 3000:1 @ 1 keV (13 mm², typical) |
| Key | Origin: UK |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Neutron ICCD |
| Pricing | Available Upon Request |
| Brand | Semicircle-Instrument |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | OEM/ODM Producer |
| Model | DPAE-VSDD-Pro |
| Detection Area | 20 mm² / 30 mm² / 50 mm² (selectable) |
| Thickness | 450 µm |
| Energy Resolution | 125–140 eV FWHM @ 5.9 keV (⁵⁵Fe) |
| Peak Time | 1 µs (max cooling) |
| Count Rate Capability | up to 2,000 kcps |
| Peak-to-Background Ratio | 15,000:1 |
| Window Options | 1 µm graphene or 8 µm beryllium |
| Ultimate Vacuum | 10⁻⁷ Torr |
| Operating Temperature Range | 0–50 °C |
| Storage Conditions | –10–30 °C, 10–90% RH (non-condensing) |
| Power Supply | 4.5–9 VDC |
| Gain Stability | <20 ppm/°C |
| Interface Options | USB 2.0, RS-232, Ethernet |
| Cooling | Peltier-based, cryogen-free |
| Warranty | 12 months |
| Expected Service Life | 5–10 years under standard lab use |
| Brand | Semicircle-Instrument |
|---|---|
| Origin | Jiangsu, China |
| Manufacturer Type | OEM Manufacturer |
| Model | TUB0011-CS1B/2B |
| Max Anode Voltage | 50 kV |
| Max Anode Current | 1 mA |
| Max Power | 50 W |
| Focal Spot Size | 1.0 × 1.0 mm (CS1B) / 0.1 × 0.1 mm (CS2B) |
| Filament Current | ≈1.7 A @ 50 kV/1 mA |
| Filament Voltage | ≈2.0 V |
| X-ray Exit Angle | 17° |
| Anode Target Materials | W, Rh, Mo, Ag, Cu (customizable) |
| Beryllium Window Thickness | 125 µm or 200 µm (selectable) |
| Electrical Configuration | Anode at positive high voltage, cathode grounded |
| Cooling Method | Forced-air cooling (>150 CFM), max housing temperature ≤55 °C |
| Weight | 2.5 kg |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-BT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 450 µm or 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM @ Mn Kα) | ≤170 eV (6 mm²), ≤230 eV (13 mm²) |
| Peak-to-Background Ratio @ 1 keV | 3600:1 (6 mm², typical), 3000:1 (13 mm², typical) |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-XT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 450 µm or 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM @ Mn Kα) | < 170 eV (6 mm²), < 230 eV (13 mm²) |
| Peak-to-Background Ratio @ 1 keV | 3600:1 (6 mm², typical), 3000:1 (13 mm², typical) |
| Origin | USA |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | XR-100CR |
| Pricing | Available Upon Request |
| Brand | YXLON International GmbH |
|---|---|
| Origin | Germany |
| Model | FF35 CT + ZoomScan |
| Max. Sample Rotation Radius | 260 mm |
| Max. Sample Height | 800 mm |
| Max. CT Scan Volume | 510 mm × 600 mm |
| Max. Payload | 27 kg |
| Motion Axes | 7 (standard), 8 (optional) |
| X-ray Source | 190 kV water-cooled microfocus tube, 225 kV refraction tube (dual-source optional) |
| Detector | CsI scintillator-based, multiple configurations available |
| Minimum Detectable Feature Size | 150 nm |
| ZoomScan Resolution Enhancement | 5×–10× vs. conventional CT |
| Scanning Modes | Full-volume CT, ROI-CT, FlexCenter + ZoomScan hybrid |
| Calibration Features | Focus drift auto-correction, ring artifact correction, noise calibration, beam hardening correction (material-specific), metal scatter correction, ScatterFix 2.0, automatic voxel segmentation |
| Brand | YXLON International GmbH |
|---|---|
| Country of Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | FF35 CT |
| Pricing | Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Regional Classification | Domestic (PRC) |
| Model | ASIDAXG5000 |
| Pricing | Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | ZXI-3000 Series |
| Price Range | USD 70,000 – 140,000 |
| Detection Principle | X-ray Transmission Imaging |
| Measurement Capability | 2.5D Geometric Metrology |
| Motion Control | CNC-programmable Stage with Path Memory |
| Navigation | Real-time Click-to-Go Image Navigation |
| Image Format Support | DICOM, TIFF, PNG, BMP |
| Data Output | CSV, XML, PDF Reports |
| Software Compliance | Audit Trail Enabled, User Access Levels, GLP-Ready Logging |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Manufacturer |
| Country of Origin | China |
| Model | XG5000 |
| Price | Upon Request |
| X-ray Tube | Sealed microfocus tube, integrated high-voltage power supply |
| Tube Voltage | 90 kV |
| Tube Current | 200 µA (software-limited to 89 µA) |
| Cooling Mode | Forced air cooling |
| Geometric Magnification | 12×–48× |
| X-Axis Travel | 400 mm |
| Y-Axis Travel | 450 mm |
| Z-Axis Travel | 150 mm |
| Image Intensifier Field of View | 2″ / 4″ |
| Resolution | 75 / 110 lp/cm |
| System Dimensions (W×D×H) | 1028 × 1025 × 1840 mm |
| Weight | ~760 kg |
| Power Supply | AC 250 V, 10 A |
| Radiation Leakage | ≤1 µSv/hr (per IEC 61331-1 and FDA 21 CFR 1020.40) |
| Operating Temperature | 22 ± 3 °C |
| Computer | HP Elite 8200 CMT, Intel Core i3-2100 (3.1 GHz), 2 GB DDR3 RAM, 500 GB SATA HDD, Windows XP, 22″ widescreen LCD |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Regional Classification | Domestic (China) |
| Model | XG5000 Series |
| Pricing | Available Upon Request |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Origin Category | Domestic (China) |
| Model | XG5000 Series |
| Quotation | Upon Request |
| X-ray Tube Voltage | 90–130 kV |
| X-ray Tube Current | 89–455 µA |
| Focal Spot Size | 5–15 µm |
| Cooling Method | Forced Air Cooling |
| Detector Type | Image Intensifier / Flat Panel Detector |
| Field of View | Φ100 mm / 114.9 mm × 64.6 mm |
| Spatial Resolution | 1392 × 1040 / 1536 × 864 pixels |
| Geometric Magnification | 12×–48× |
| Repeatability Accuracy | ±60 µm |
| Inspection Speed | ≥1.5 points/sec (excluding loading/unloading and motion time) |
| Stage Dimensions | 515 mm × 460 mm |
| Effective Inspection Area | 450 mm × 410 mm |
| Max Load Capacity | ≤5 kg |
| Radiation Safety | ≤1 µSv/hr (measured at 5 cm from enclosure surface) |
| Computer Configuration | 22" widescreen LCD/touch display, Intel Core i5, 4 GB RAM, 500 GB HDD |
| System Dimensions | 1136 mm × 1076 mm × 1730 mm |
| Weight | ~750 kg |
| Power Supply | AC 220 V, 10 A |
| Operating Environment | 25 °C ± 3 °C, RH 50% ± 10% |
| Brand | Zhengye |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | OEM/ODM Manufacturer |
| Country of Origin | China |
| Model | XG5010 |
| Pricing | Upon Request |