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| Brand | Plasma-Therm |
|---|---|
| Origin | USA |
| Equipment Type | PECVD / HDPCVD / RIE / ICP / DSE |
| Wafer Size Support | 2″ to 12″ |
| Automation Levels | Manual / Semi-Automatic / Full Cassette-to-Cassette Automation |
| Installed Base | >1,600 Systems Worldwide |
| Uniformity (PECVD) | ≤3% (1σ, across wafer) |
| Chamber Heating | Fully Ceramic-Encapsulated Uniform Thermal Control |
| Endpoint Detection | Real-Time Optical Emission Spectroscopy (OES) with Sub-Second Response |
| Gas Switching Speed | <500 ms (Patented Rapid Valve Architecture) |
| Pressure Control Resolution | ±0.01 mTorr (Patented Closed-Loop Digital Manifold) |
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