- All
- Favorite
- Popular
- Most rated
| Brand | TMC |
|---|---|
| Origin | USA |
| Model | TMC Active Vibration Isolation Systems |
| Vibration Isolation Frequency Range | 0.6–250 Hz |
| Isolation Efficiency | >90% above 2 Hz |
| Application Scope | Semiconductor Metrology, Electron Microscopy, AFM, Optical Interferometry, Nanofabrication Tools |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Filmetrics F50 |
| Measurement Principle | Broadband Spectral Reflectometry |
| Maximum Sample Diameter | 450 mm |
| Stage Type | Motorized R-Theta Platform |
| Scan Patterns | Polar, Rectangular, Linear, and User-Defined |
| Wavelength Options | UV–NIR (model-dependent, e.g., F50-UV: 190–1100 nm |
| F50-NIR | 900–1700 nm) |
| Measurement Speed | Up to 2 points per second |
| Predefined Scan Templates | >30 built-in |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, supports audit-ready data logging per FDA 21 CFR Part 11 requirements when integrated with validated software configuration |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-170 |
| Pricing | Available Upon Request |
| Measurement Principle | Capacitive Sensing |
| Measurement Range | 0–1000 µm |
| Accuracy | ±0.5 nm |
| Probe Tip Radius | 2.0 µm |
| Probe Normal Force | 0.5–50 mg |
| Scan Length | Up to 200 mm (Seamless, No Stitching Required) |
| Step Height Repeatability | 0.4 nm |
| Vertical Resolution | 0.001 nm |
| Maximum Sample Size | 200 mm Diameter |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | CS10 / CS20 |
| Detection Sensitivity | 80 nm particles |
| Sample Size Support | 2–8 inch wafers (standard), customizable fixtures |
| Operation Modes | Manual (CS10) / Automated Transport (CS20) |
| Optical Channels | 4-channel detection (scattered light, reflected light, phase shift, Z-height) |
| Environmental Class | ISO Class 4 (10 cleanroom equivalent) |
| Compliance | Designed for semiconductor fab environments |
| Software | Integrated defect classification, statistical distribution mapping, root-cause traceability, and automated pass/fail reporting |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Fimetrics P3D |
| Measurement Principle | White-Light Interferometry |
| Type | Non-Contact 3D Surface Profilometer / Roughness Analyzer |
| Key Resolution | Sub-nanometer vertical resolution (≤0.1 nm typical) |
| Field-of-View Scalability | Multi-field stitching enabled |
| Optical Configuration | Phase-shifting and vertical-scanning interferometry (CSI) |
| Compliance Basis | Designed for ISO 25178-2, ISO 4287, ASTM E1392, and VDI/VDE 2634 Part 3 |
| Brand | Corial |
|---|---|
| Origin | France |
| Model | D250L |
| Heating Method | Hot-Wall |
| Deposition Rate | 520 nm/min |
| Process Gases | SiH₄, NH₃, N₂ |
| Deposited Films | SiO₂, Si₃N₄, SiOF, SiOCH, SiC |
| Base Vacuum | −300 to 50 mTorr |
| Operating Pressure | 0.2–2 Torr |
| Maximum Substrate Size | 200 mm (8-inch) wafers |
| Configuration | Load-Lock with Turbo-Molecular Pump (350 L/s) and Dry Scroll Pump (110 m³/h) |
| RF Power Supply | 300 W, 13.56 MHz |
| Integrated Controllers | TMP, Heater, HV/LV, Plasma Process Controller |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-7 |
| Price | USD 75,000 (FOB) |
| Measurement Principle | Capacitive Probe-Based Profilometry |
| Vertical Measurement Range | 0–1000 µm |
| Vertical Accuracy | ±0.5 Å |
| Tip Radius | 2.0 µm |
| Normal Force Range | 0.5–50 mg |
| Scan Length | 150 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤4 Å |
| Vertical Resolution | ≤0.01 Å |
| Maximum Sample Diameter | 150 mm |
| Platform Positioning Repeatability | 2 µm |
| Max Sample Height | ≥30 mm |
| Optical Zoom | 4× (motorized) |
| Camera | 5 MP color CCD |
| Digital Magnification | 4× |
| Vibration Isolation Requirement | ≤250 µin/sec (1–100 Hz) |
| Ambient Noise Limit | ≤80 dB(A) |
| Airflow Limit | ≤100 ft/min |
| Dimensions (W×D×H) | 430 × 570 × 670 mm |
| Weight | 80 kg |
| Brand | Scientech |
|---|---|
| Origin | Taiwan |
| Model | Wet Bench |
| Type | Manual / Semi-Automatic / Fully Automatic Wet Process Station |
| Wafer Compatibility | 2" to 12" |
| Transport Options | Cassette-Type, Boat-Type, Cassette-Less |
| Process Capabilities | Cleaning, Etching, Photoresist Stripping, Solvent Treatment, Development, Reclaim, Electroless Plating, High-Temperature Phosphoric Acid Etching, De-waxing, CDU (Chemical Development Unit) |
| Compliance | Designed for GLP/GMP-aligned lab environments |
| Software | Proprietary real-time process control with recipe management, event logging, and user-access-level configuration |
| Service | Local hardware/software co-development, firmware updates, and full lifecycle technical support |
| Brand | Genmark |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | Sort-Max Wafer Sorter |
| Pricing | Available Upon Request |
| Brand | Verity |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Verity EPD Spectrometer |
| Pricing | Upon Request |
| Brand | KLA |
|---|---|
| Origin | Germany |
| Distributor Type | Authorized Distributor |
| Origin Category | Imported Instrument |
| Model | F20 |
| Price | USD 27,500 (FOB Hamburg) |
| Brand | KLA |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | P7 |
| Price | USD 70,000 (FOB Shenzhen) |
| Brand | KLA |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Candela 8420 |
| Pricing | Available Upon Request |
| Instrument Category | Optical Non-Patterned Wafer Defect Inspection System |
| Primary Application | Surface Defect Detection on Unpatterned Wafers |
| Wafer Diameter | 2–8 inches |
| Throughput | 30 WPH |
| Resolution | 83 nm |
| Brand | Rigaku |
|---|---|
| Origin | Japan |
| Model | AZX 400 |
| Sample Capacity | Ø400 mm × 50 mm thickness × 30 kg max |
| Elemental Range | Ta, Cu, Ru, Pt, Mn |
| Repeatability | 0.12% RSD |
| Configuration | Floor-standing WD-XRF system |
| Application Focus | Semiconductor metrology, sputtering target QC, magnetic disk analysis, multilayer thin-film characterization |
| Compliance | Designed for ISO/IEC 17025-compliant labs |
| Brand | Toho |
|---|---|
| Origin | Japan |
| Model | FLX-2320-S |
| Application | In-situ and ex-situ thin-film stress measurement on semiconductor wafers up to 8 inches (200 mm) |
| Temperature Control Range | −65 °C to +500 °C |
| Dual-Laser Source | Visible (e.g., 635 nm) and Near-Infrared (e.g., 785 nm) |
| Data Export | CSV, Excel (.xlsx), XML |
| Software Compliance | Audit trail-ready configuration supporting GLP/GMP-aligned documentation workflows |
| Brand | FRT |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Instrument |
| Model | FRT Optical Surface Metrology System |
| Pricing | Available Upon Request |
| Origin | South Korea |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | NX20 |
| Price Range | USD 195,000 – 260,000 (FOB) |
| Instrument Type | Atomic Force Microscope |
| Application Class | Materials Science AFM |
| XY Positional Noise | < 0.25 nm (over 80 µm scan range) |
| Z-Noise Floor | < 0.03 nm |
| Feedback Loop Bandwidth | > 9 kHz |
| Maximum Sample Diameter | 200 mm |
| XY Scan Range | 100 µm × 100 µm |
| Z Scan Range | 15 µm (extendable to 30 µm) |
| Control Software | Park SmartScan™ Automation Suite |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | Filmetrics R50 |
| Automation Level | Manual |
| Sheet Resistance Range | 1 mΩ/□ – 200 MΩ/□ |
| Sheet Resistance Accuracy | ±1% |
| Substrate Size Compatibility | 4-inch to 12-inch wafers |
| Software | RSMapper™ |
| Probe Compatibility | Fully compatible with KLA’s full suite of four-point probe sensors |
| XY Stage | 200 mm motorized |
| Z-Travel | 100 mm precision-controlled |
| Measurement Configurations | Customizable grid, linear, radial, and user-defined point patterns |
| Application Scope | Conductive & semiconducting thin films on Si, GaAs, SiC, sapphire, glass, and flexible substrates |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | iNano |
| Load Resolution | <100 nN |
| Displacement Resolution | <0.01 nm |
| Maximum Load Capacity | 500 mN |
| Thermal Drift | <0.05 nm/s (typical) |
| Compliance | ASTM E2546, ISO 14577, ISO 20513, USP <1062>, FDA 21 CFR Part 11 compliant software options available |
| Brand | Plasma-Therm |
|---|---|
| Origin | USA |
| Model | Takachi |
| Etch Principle | Inductively Coupled Plasma (ICP) |
| Etch Rate | SiO₂ ≥ 1500 Å/min |
| Selectivity | SiO₂ to Photoresist = 1.0–1.5:1 |
| Si₃N₄ to Photoresist = 1.0–1.2 | 1 |
| Uniformity | ≤ ±2% |
| Application Scope | Dielectrics (SiO₂, Si₃N₄, metal oxides), Polymers (photoresists, polyimides, BCB, SU-8), Semiconductors (Si, Ge, III–V compounds including GaAs, AlGaAs, GaN, InP), SiC |
| Brand | Plasma-Therm |
|---|---|
| Origin | USA |
| Equipment Type | PECVD / HDPCVD / RIE / ICP / DSE |
| Wafer Size Support | 2″ to 12″ |
| Automation Levels | Manual / Semi-Automatic / Full Cassette-to-Cassette Automation |
| Installed Base | >1,600 Systems Worldwide |
| Uniformity (PECVD) | ≤3% (1σ, across wafer) |
| Chamber Heating | Fully Ceramic-Encapsulated Uniform Thermal Control |
| Endpoint Detection | Real-Time Optical Emission Spectroscopy (OES) with Sub-Second Response |
| Gas Switching Speed | <500 ms (Patented Rapid Valve Architecture) |
| Pressure Control Resolution | ±0.01 mTorr (Patented Closed-Loop Digital Manifold) |
| Brand | KLA |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | CS20 |
| Quotation | Upon Request |
| Instrument Category | Optical Non-Patterned Wafer Defect Inspection System |
| Primary Application | Bare (Non-Patterned) Silicon Wafer Surface Defect Detection |
| Throughput | 30 WPH for 150 mm (6″) wafers, 27 WPH for 200 mm (8″) wafers |
| Resolution | 83 nm |
| Substrate Diameter Range | 50.8 mm – 200 mm (2″ – 8″) |
| Thickness Range | 350 µm – 1,100 µm |
| Minimum Detectable Defect Size | 0.3 µm (PSL sphere equivalent, ≥95% capture rate on bare Si) |
| Defect Types | Particles, scratches (≥100 µm × 0.1 µm × 50 Å), pits (≥20 µm Ø × 50 Å depth), stains (≥20 µm Ø × 10 Å thickness), bumps |
| Detection Threshold | Signal amplitude > 3× peak-to-valley background noise |
| Brand | KLA |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | D500 |
| Price Range | USD 42,000 – 56,000 (FOB) |
| Measurement Principle | Optical Lever-Based Contact Profilometry |
| Vertical Measurement Range | 10 nm – 1000 µm |
| Vertical Accuracy | ±0.01% of full-scale range |
| Probe Tip Radius | 2 µm |
| Adjustable Normal Force | 0.03–15 mg |
| Maximum Single-Scan Length | 30 mm |
| Step Height Repeatability | 0.5 nm (RMS, measured on 1 µm SiO₂ step standard over 15 repeated scans) |
| Vertical Resolution | 0.038 nm |
| Maximum Sample Size | 140 mm diameter circular stage |
| Brand | KLA |
|---|---|
| Model | Zeta 20 |
| Origin | China (Guangdong) |
| Manufacturer Type | Authorized Distributor |
| Product Origin Classification | Domestic |
| Price | USD 98,000 (FOB Guangdong) |
| Measurement Principle | Multi-Mode Optical Interferometry & ZDot™ Confocal Imaging |
| Max. Vertical Range | >10 mm |
| Vertical Resolution | Sub-nanometer (typ.) |
| Lateral Resolution | ≤ 0.4 µm |
| Film Thickness Range | 1 nm – 50 µm (with integrated broadband reflectometry) |
| Sample Stage | Motorized XYZ with 100 mm × 100 mm travel |
| Software Platform | ZetaWare v6.x |
| Compliance | ISO 25178-2, ASTM E2981, SEMI S2/S8, GLP/GMP-ready audit trail |
Show next