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BrandKLA
OriginUSA
ModelFimetrics P3D
Measurement PrincipleWhite-Light Interferometry
TypeNon-Contact 3D Surface Profilometer / Roughness Analyzer
Key ResolutionSub-nanometer vertical resolution (≤0.1 nm typical)
Field-of-View ScalabilityMulti-field stitching enabled
Optical ConfigurationPhase-shifting and vertical-scanning interferometry (CSI)
Compliance BasisDesigned for ISO 25178-2, ISO 4287, ASTM E1392, and VDI/VDE 2634 Part 3
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OriginUSA
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelCS1
PricingAvailable Upon Request
Substrate Diameter Range2 in. – 200 mm
Substrate Thickness Range350 μm – 1,100 μm
Material CompatibilityOpaque or transparent polished surfaces with ≥10% light scattering efficiency
Defect Detection Sensitivity0.3 μm PSL sphere equivalent (≥95% capture rate on bare Si)
Minimum Detectable FeaturesScratches (100 μm × 0.1 μm × 50 Å), Pits (20 μm Ø × 50 Å depth), Stains (20 μm Ø × 10 Å thickness)
Signal ThresholdDefect signal amplitude >3× peak-to-valley background noise
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