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| Brand | NILT |
|---|---|
| Origin | Denmark |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | BEAM |
| Exposure Mode | Proximity-style Direct Write |
| Resolution | ≤500 nm (line width) |
| Light Source | UV Diode Lasers |
| Wavelengths | 365 nm, 385 nm, 405 nm |
| Illumination Uniformity | Optimized via Dynamic Beam Shaping & Real-time Power Calibration |
| Exposure Field | 106 mm × 106 mm or 150 mm × 150 mm (tileable) |
| Autofocus Speed | <1 s (piezo-driven closed-loop Z-control) |
| Pattern Writing Speed | <2 s per 10 mm × 10 mm field (at 500 nm resolution, AZ5214E resist) |
| Maximum Substrate Size | 6-inch (150 mm) wafers or square substrates up to 150 mm × 150 mm |
| Alignment Accuracy | <±200 nm (multi-layer, vision-based auto-alignment) |
| Software Interface | GDSII-native workflow with real-time pattern preview, tile stitching, and wafer-level navigation |
| Brand | NILT |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Exposure Mode | Proximity |
| Resolution | 500 nm |
| Light Source | UV Laser |
| Wavelengths | 405 nm, 365 nm, 385 nm |
| Illumination Uniformity | Direct-write scanning mode |
| Maximum Exposure Area | 150 mm × 150 mm |
| Compatible Substrate Sizes | Up to 6-inch wafers |
| Autofocus Speed | <1 s (piezo-driven closed-loop optical focus control) |
| Pattern Writing Speed | <2 s per defined exposure field |
| Alignment Method | Semi-automated multi-layer alignment with real-time image recognition |
| Software Interface | GDSII-compatible, CNC-style navigation (WASD), on-the-fly pattern placement, wafer-level map visualization |
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