KLA
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| Brand | KLA |
|---|---|
| Origin | USA |
| Model | K-T G200 / I-Nano / Insitu |
| Application | In-situ nanomechanical characterization with optical, electrical, and structural correlation |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Nano Indenter G200 |
| Force Range | 10 nN – 10 N (with modular transducers) |
| Displacement Resolution | < 0.01 nm |
| Maximum Indentation Depth | > 500 µm |
| Testing Speed | Up to 1 indentation point per second |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | G200 |
| Instrument Type | Integrated Nanoindentation and Scratch Tester |
| Maximum Load Capacity | 10 N |
| Displacement Resolution | < 0.01 nm (10 pm) |
| Load Resolution | < 50 nN |
| Compatible Modules | DCM II, XP Actuator, CSM, ProbeDMA™, AccuFilm™, Laser Heating, LFM, NanoVision, Survey Scanning, Express Test |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | G200X |
| Instrument Type | Integrated Nanoindentation and Scratch Tester |
| Maximum Load Capacity | 10 N |
| Load Resolution | <1 nN |
| Displacement Range | ±50 µm |
| Displacement Resolution | <0.01 nm |
| Indenter Types | Over 30 interchangeable tip geometries (Berkovich, cube-corner, spherical, flat-punch, etc.) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Instrument |
| Model | NanoFlip |
| Price Range | USD 260,000–390,000 (est.) |
| Instrument Type | In-Situ Nanomechanical Testing System |
| Max Indentation Depth | 50 µm |
| Effective Load Range | 50 mN |
| Load Resolution | 3 nN |
| Displacement Range (X/Y) | 20 mm, (Z): 25 mm |
| Displacement Resolution | 4 nm |
| Max Friction Force | 0.05 N |
| Indenter Tip | Diamond Berkovich or Cube-Corner |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | NanoFlip |
| Instrument Type | Integrated Nanoindentation and Scratch Tester |
| Environmental Operation | Vacuum and Controlled Atmosphere (including Glovebox-Compatible) |
| Actuator | InForce 50 Electromagnetic Force Actuator with Capacitive Displacement Sensing |
| Controller | InQuest High-Speed Digital Controller (100 kHz Data Acquisition, 20 µs Time Constant) |
| Motion System | Motorized XYZ Stage (X/Y: 21 mm Travel, Z: 25 mm Travel) |
| Sample Orientation | Flip Mechanism for SEM/FIB Imaging Alignment |
| FIB-to-Test Capability | 90° Sample Tilt for Seamless Transition from FIB Milling to Nanomechanical Testing |
| Software | InView™ v6.x (Windows® 10 Compatible), Includes ISO 14577 Compliance Module, User Method Development Toolkit, Real-Time SEM Video Synchronization, Integrated Tip Calibration Suite |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | P-17 |
| Product Type | Contact Profilometer / Surface Roughness Tester |
| Operating Principle | Stylus-Based Profilometry |
| Scan Range | Up to 200 mm (no image stitching required) |
| Step Height Range | 1 nm to 1000 µm |
| Stylus Force Control | 0.03–50 mg |
| Camera Resolution | 5 MP color, optical zoom |
| Compliance | SEMI E4, E5, E30, E37 |
| Software Platform | Apex Analysis Software (ISO/ASME-compliant), Offline Analysis Module, SECS/GEM & HSMS support |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-170 |
| Pricing | Available Upon Request |
| Measurement Principle | Capacitive Sensing |
| Measurement Range | 0–1000 µm |
| Accuracy | ±0.5 nm |
| Probe Tip Radius | 2.0 µm |
| Probe Normal Force | 0.5–50 mg |
| Scan Length | Up to 200 mm (Seamless, No Stitching Required) |
| Step Height Repeatability | 0.4 nm |
| Vertical Resolution | 0.001 nm |
| Maximum Sample Size | 200 mm Diameter |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | P-170 |
| Product Category | Contact Stylus Profilometer / Surface Roughness Tester |
| Operating Principle | Stylus-based Contact Profilometry |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-7 |
| Price | USD 75,000 (FOB) |
| Measurement Principle | Capacitive Probe-Based Profilometry |
| Vertical Measurement Range | 0–1000 µm |
| Vertical Accuracy | ±0.5 Å |
| Tip Radius | 2.0 µm |
| Normal Force Range | 0.5–50 mg |
| Scan Length | 150 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤4 Å |
| Vertical Resolution | ≤0.01 Å |
| Maximum Sample Diameter | 150 mm |
| Platform Positioning Repeatability | 2 µm |
| Max Sample Height | ≥30 mm |
| Optical Zoom | 4× (motorized) |
| Camera | 5 MP color CCD |
| Digital Magnification | 4× |
| Vibration Isolation Requirement | ≤250 µin/sec (1–100 Hz) |
| Ambient Noise Limit | ≤80 dB(A) |
| Airflow Limit | ≤100 ft/min |
| Dimensions (W×D×H) | 430 × 570 × 670 mm |
| Weight | 80 kg |
| Brand | KLA |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | P7 |
| Price | USD 70,000 (FOB Shenzhen) |
| Brand | KLA |
|---|---|
| Model | Profilm 3D |
| Type | Non-contact Optical Profilometer / Surface Roughness Analyzer |
| Measurement Principle | White Light Interferometry (WLI) with Vertical Scanning Interferometry (VSI) and Phase-Shifting Interferometry (PSI) |
| Vertical Range | VSI: 50 nm – 100 mm |
| PSI | 0 – 3 µm |
| Reflectance Range | 0.05% – 100% |
| Piezo Scan Range | 500 µm |
| XY Stage Travel | 100 mm × 100 mm |
| Compliance | ISO 25178-604, ISO 4287, ISO 4288, ASME B46.1, ASTM E2923 |
| Software | ProfilmOnline™ Cloud-Based Analysis Platform |
| Data Export | CSV, TIFF, BMP, OBJ, STP, DXF |
| Roughness Parameters | 47 ISO/ASME/EUR-compliant parameters |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Profilm 3D |
| Measurement Principle | Vertical Scanning Interferometry (VSI) & Phase-Shifting Interferometry (PSI) |
| Thickness Range (VSI) | 50 nm – 100 mm |
| Thickness Range (PSI) | 0 – 3 µm |
| Reflectance Range | 0.05% – 100% |
| Piezo Scan Range | 500 µm |
| XY Stage Options | 100 mm × 100 mm or 200 mm × 200 mm |
| Compliance | ISO 25178-604, ISO 9000, ASME B46.1 |
| Roughness Parameters | 47 standardized (ASME Y14.36M, ISO 4287, ISO 25178-2) |
| Software | ProfilmOnline cloud-based analysis platform |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Profilm3D |
| Product Type | Non-contact 3D Optical Profilometer / Surface Roughness Analyzer |
| Operating Principle | White Light Interferometry |
| Measurement Modes | Vertical Scanning Interferometry (VSI) and Phase Shifting Interferometry (PSI) |
| Z-Stage Travel | 100 mm |
| Objective Turret | 5×–100× (Michelson 5×, Mirau 10×/20×/50×/100×) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | R50-4PP / R50-EC |
| Type | Imported Instrument |
| Distribution Channel | Authorized Distributor |
| Pricing | Available Upon Request |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | R54 |
| Automation Level | Semi-Automatic |
| Resistivity Measurement Range | 1 mΩ/□ to 200 Ω/□ |
| Resistivity Measurement Accuracy | < 0.02% |
| Z-Travel Range | 15 mm |
| XY Stage Type | Motorized |
| Max Sample Height | 15 mm |
| Max Sample Weight | 2.5 kg |
| 4PP Measurement Repeatability | < 0.02% |
| EC Measurement Repeatability | < 0.2% |
| Compatible Sample Sizes | Up to 300 mm Ø or A4 (210 × 297 mm) |
| Probe Configurations | Customizable rectangular, linear, polar, and user-defined mapping patterns |
| Dual-Mode Operation | Four-Point Probe (4PP) and Non-Contact Eddy Current (EC) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | UTM T150 |
| Instrument Type | Nanoindentation and Scratch Tester |
| Application Category | Surface & Interface Property Testing |
| Compliance | ASTM-compliant |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | P-7 |
| Measurement Principle | Contact Stylus Profilometry |
| Vertical Measurement Range | 1 nm to 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Lateral Resolution | Determined by stylus tip radius (0.1–50 µm selectable) |
| Stylus Tip Radius | 0.7 µm (standard), down to 100 nm optional |
| Normal Force Range | 0.03–50 mg (force-controlled feedback) |
| Scan Length | Up to 150 mm (single-pass, no stitching required) |
| Wafer/Specimen Max Size | 150 mm diameter |
| Step Height Repeatability | < 0.2% of measured height (1σ) |
| Surface Flatness Calibration | Arc correction algorithm integrated |
| Imaging System | 5 MP color CCD with motorized zoom and focus |
| Software Platform | Apex™ v6.x with ISO/ASME-compliant analysis modules |
| Compliance | SEMI E4, E5, E30, E37 |
| Brand | KLA |
|---|---|
| Origin | USA |
| Manufacturer | KLA Corporation |
| Product Type | Imported |
| Model | Tencor® P-170 |
| Measurement Principle | Inductive |
| Vertical Measurement Range | 0.5 nm – 1000 µm |
| Vertical Resolution | Sub-nanometer (typical) |
| Probe Tip Radius | < 12 nm (standard diamond tip) |
| Normal Force Range | 0.03–15 mg (closed-loop force control) |
| Maximum Scan Length | 200 mm (single-pass, no stitching required) |
| Step Height Repeatability | ≤ 0.15 nm (1σ, over 24 h) |
| Maximum Sample Size | Ø200 mm × 25 mm thick |
| Optical System | 5 MP color camera with motorized zoom and dual-view (top + side) optics |
| Automation | Integrated robotic handler for opaque (e.g., Si) and transparent (e.g., sapphire) wafers (Ø75–200 mm) |
| Compliance | ASTM E1399, ISO 4287, ISO 25178-2, USP <1059>, FDA 21 CFR Part 11 (audit trail & electronic signature enabled) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | ZETA-20 |
| Product Type | Non-contact Optical Profilometer / Surface Roughness Analyzer |
| Operating Principle | White-light Interferometry |
| Key Imaging Technology | ZDot™ 3D Imaging |
| Vertical Resolution | Sub-Ångström (≤0.1 nm) |
| Measurement Modes | Six Integrated Optical Modules |
| Surface Reflectivity Range | 0.5% – >85% |
| Output | True-color 2D/3D Images |
| Compliance | ASTM E2921, ISO 25178-2, ISO 4287, USP <1056>, FDA 21 CFR Part 11 Ready (via optional software module) |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | Zeta-20 |
| Product Type | Non-contact 3D Optical Profilometer / Surface Roughness Analyzer |
| Measurement Principles | ZDot™ Multi-Mode Imaging, White Light Interferometry (WLI), Nomarski Differential Interference Contrast (DIC), Shear Interference, Broadband Reflectometry, Automated Optical Inspection (AOI) |
| Vertical Resolution | Sub-nanometer (typical, dependent on mode) |
| Lateral Resolution | ~0.4 µm (optical diffraction-limited) |
| Step Height Range | 1 nm – 10 mm |
| Surface Roughness Range | Ra 0.01 nm – 50 µm |
| Film Thickness Range | 30 nm – 100 µm (transparent films) |
| Defect Detection Limit | ≥1 µm |
| Field of View | Up to 8 mm × 6 mm (configurable via objective lenses) |
| Objective Lenses | 2.5×, 5×, 10×, 20×, 50×, 100× (motorized turret) |
| Software Platform | ZetaWare™ v6.x (GLP/GMP-compliant, 21 CFR Part 11 ready) |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Zeta-20 |
| Product Type | Non-contact Profilometer / Surface Roughness Analyzer |
| Measurement Principle | Multi-Mode Optical Interferometry (ZDot™, White-Light Interferometry, Nomarski DIC, Shear Interference), Spectral Reflectometry |
| Key Capabilities | 3D Topography, True-Color Imaging, Step Height (0.008 nm – 10 mm), Surface Roughness (Ra down to sub-Å), Film Thickness (30 nm – 100 µm), Automatic Defect Detection (>1 µm), Wafer-Scale Warpage & Stress Analysis |
| Brand | KLA |
|---|---|
| Origin | Malaysia |
| Model | Zeta-300 |
| Product Type | Non-contact profilometer / surface roughness analyzer |
| Measurement Principle | Multi-mode optical interferometry (ZDot™, white-light interferometry, Nomarski differential interference contrast, shear interferometry) |
| Optical Capabilities | Simultaneous high-resolution 3D topography and true-color surface imaging |
| Vertical Resolution | Sub-nanometer (ZIC/ZSI), <0.1 nm (PSI), ≤1 nm (VSI) |
| Step Height Range | 0.8 nm to 1 mm |
| Surface Roughness Range | <0.05 nm RMS to >100 µm Sa |
| Film Thickness Range (ZFT) | 30 nm – 100 µm (transparent films) |
| Defect Detection Limit | ≥1 µm lateral resolution |
| Maximum Sample Size | Up to 280 mm Z-height |
| Compliance | ISO 25178, ISO 4287/4288, ASME B46.1, NIST-traceable calibration standards |
| Brand | KLA |
|---|---|
| Model | Zeta 20 |
| Origin | China (Guangdong) |
| Manufacturer Type | Authorized Distributor |
| Product Origin Classification | Domestic |
| Price | USD 98,000 (FOB Guangdong) |
| Measurement Principle | Multi-Mode Optical Interferometry & ZDot™ Confocal Imaging |
| Max. Vertical Range | >10 mm |
| Vertical Resolution | Sub-nanometer (typ.) |
| Lateral Resolution | ≤ 0.4 µm |
| Film Thickness Range | 1 nm – 50 µm (with integrated broadband reflectometry) |
| Sample Stage | Motorized XYZ with 100 mm × 100 mm travel |
| Software Platform | ZetaWare v6.x |
| Compliance | ISO 25178-2, ASTM E2981, SEMI S2/S8, GLP/GMP-ready audit trail |
| Brand | KLA |
|---|---|
| Origin | USA |
| Model | CS10 / CS20 |
| Detection Sensitivity | 80 nm particles |
| Sample Size Support | 2–8 inch wafers (standard), customizable fixtures |
| Operation Modes | Manual (CS10) / Automated Transport (CS20) |
| Optical Channels | 4-channel detection (scattered light, reflected light, phase shift, Z-height) |
| Environmental Class | ISO Class 4 (10 cleanroom equivalent) |
| Compliance | Designed for semiconductor fab environments |
| Software | Integrated defect classification, statistical distribution mapping, root-cause traceability, and automated pass/fail reporting |