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| Brand | Amptek |
|---|---|
| Origin | USA |
| Model | Mini-X-OEM |
| X-ray Tube Type | Metal-Ceramic |
| Operating Voltage Range | 5–50 kV |
| Tube Current Range | 0–200 µA |
| Max Power | 4 W |
| Anode Material (Standard) | Au, Ag, or Rh |
| Anode Material (Optional) | W |
| Window Material | Be (125 µm) |
| Beam Spot Size | ~2 mm |
| Output Divergence Angle | 120° (5° with 2 mm collimator) |
| Input Voltage | 6–12 VDC |
| Input Current | 1.35 A (typ. @6 V), 0.70 A (typ. @12 V) |
| HV Stability | <0.1% |
| Cooling | Conductive (user-supplied heatsink required) |
| Operating Temperature | −10 °C to +60 °C (housing) |
| Humidity | 30–90% RH (non-condensing) |
| Weight | 340 g |
| Radiation Shielding | Integrated self-shielding (except output window) |
| Control Interface | Analog voltage inputs (0–4 V for kV/µA) and TTL logic outputs |
| Brand | Amptek |
|---|---|
| Origin | USA |
| Model | MCA8000D |
| ADC | 100 MHz, 16-bit |
| Channel Count | 8,192 (8K) |
| Pulse Peaking Time | ≥500 ns (200 ns shaping) |
| Conversion Time | 10 ns |
| Differential Nonlinearity | <±0.6% |
| Integral Nonlinearity | <±0.02% |
| Input Range | 0–1 V or 0–10 V (software-selectable) |
| Interfaces | USB 2.0 Full-Speed, RS-232 (115 kbps), Ethernet (10BASE-T) |
| Dimensions | 125 × 71 × 20 mm |
| Weight | 165 g |
| Operating Temperature | −20 to +60 °C |
| Power | +4 to +5.5 V DC, ≤2 W |
| Brand | Amptek |
|---|---|
| Origin | USA |
| Model | C1/C2 |
| Window Substrate | Silicon Nitride (Si₃N₄) |
| Top Layer | Aluminum Coating |
| Thickness | C1 ≈ 80 nm, C2 ≈ 150 nm |
| Compatible Detectors | SuperSDD™ Series, 25 mm² / 500 µm thick silicon drift detectors |
| Energy Range Extension | Down to Boron (B, Z=5) and Carbon (C, Z=6) |
| Compliance | ASTM E135 – Standard Terminology Relating to Analytical Chemistry |
| Brand | Amptek |
|---|---|
| Origin | USA |
| Model | PA-210/PA-230 |
| Power Supply Requirements | +5 VDC @ 15 mA, −5 VDC @ 15 mA |
| HV Input Range | +100 to +200 V (Si-PIN), −90 to −260 V (SDD/CdTe) |
| TEC Drive | +3.5 VDC @ 350 mA |
| Temperature Monitoring | 160 µA-biased silicon diode output |
| Signal Output | Negative pulse (Si-PIN), Positive pulse (SDD/CdTe) |
| Connector | 10-pin micro-DIN (1.0 mm pitch) |
| Thermal Control Capability | Closed-loop stabilization down to 230 K (−43 °C) |
| Compliance | Designed for integration into ISO/IEC 17025-compliant XRF, XRD, and EDX systems |
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