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Hefei Kejing Materials Technology Co., Ltd.

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BrandHefei Kejing
Substrate Diameter50.8 mm ±1 mm
Substrate Orientationc-plane (0001) ±1.0°
Substrate MaterialAl₂O₃ (sapphire)
Film Thickness10–5000 nm
Conductivity TypeSemi-insulating
Threading Dislocation Density (TDD)XRD FWHM (0002) < 500 arcsec, XRD FWHM (10–12) < 1500 arcsec
Effective Area>80%
Surface FinishSingle-side polished
CustomizationAvailable for non-standard orientations and dimensions
PackagingClass 1000 cleanroom environment
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KeyPurity: 99.95%
Cu Thickness50 µm
Sheet Resistance300–500 Ω/□
Monolayer Coverage≥90–96% (size-dependent)
Layer CountSingle-layer or 2–4 layers
Substrate DimensionsCustom up to 45 cm × 50 cm
StorageDry, oxygen-free environment, <30°C, use within 30 days
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BrandHefei Kejing
OriginAnhui, China
Manufacturer TypeAuthorized Distributor
Country of OriginChina
ModelQuartz-Substrate Graphene Film
Thickness1 mm / 2 mm
Quartz Transmittance>93% (at 550 nm)
Sheet Resistance300–500 Ω/□ (monolayer), 200–300 Ω/□ (bilayer)
Monolayer Coverage≥95%
Available Sizes1 cm × 1 cm, 2 cm × 2 cm, 5 cm × 5 cm
Storage ConditionDry, oxygen-free environment at <30 °C
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BrandHefei Kejing
OriginAnhui, China
Manufacturer TypeAuthorized Distributor
Origin CategoryDomestic
ModelInP/InGaAs:Zn Epi-Wafer
PricingUpon Request
Substrate Diameter2 inch (50.8 mm)
Substrate Thickness350 µm ± 25 µm
Substrate Orientation<100> ± 0.5° with Primary Flat
Substrate DopingUndoped
Substrate Carrier Concentration (Nc)< 1 × 10¹⁶ cm⁻³
Substrate Etch Pit Density (EPD)< 1 × 10⁴ cm⁻²
Epilayer CompositionLattice-Matched p-Type InGaAs:Zn (100)
Epilayer DopingZn (p-type)
Epilayer Carrier Concentration1 × 10¹⁷ – 1 × 10¹⁸ cm⁻³
Epilayer Thickness1.0 µm ± 5%
Surface FinishSingle-Side Polished
Epilayer RMS Roughness≤ 0.2 nm (≈1 monolayer)
PackagingClass 100 cleanroom bag under vacuum or individual cassette in Class 1000 cleanroom environment
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BrandHefei Kejing
OriginAnhui, China
Manufacturer TypeAuthorized Distributor
Origin ClassificationDomestic (PRC)
ModelCo Foil
PricingUpon Request
Standard Dimensions10 mm × 10 mm × 1.0 mm
PackagingVacuum-sealed in Class 100 cleanroom bags, processed in Class 1000 cleanroom environment
Storage RequirementMaintain under inert atmosphere or high-vacuum conditions to prevent surface oxidation
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Brand合肥科晶
OriginUSA
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelVGF-GaAs-2INCH-N-TE
PriceUpon Request
Growth MethodVertical Gradient Freeze (VGF)
Crystal Orientation<100> ±0.5°, 2° off toward <101>
Diameter × Thickness2 inch (50.8 mm) × 0.5 mm
Surface FinishSingle-side polished (SSP)
Doping TypeN-type, Tellurium (Te)
Carrier Concentration(1.5–26) × 10¹⁷ cm⁻³
Electron Mobility2700–3600 cm²/V·s
Resistivity9 × 10⁻⁴ – 1.1 × 10⁻² Ω·cm
Etch Pit Density (EPD)< 8 × 10³ cm⁻²
PackagingVacuum-sealed in Class 100 cleanroom bags within Class 1000 cleanroom environment, or individual wafer cassettes
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