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| Brand | Pfeiffer Vacuum |
|---|---|
| Model | ADPC 302 |
| Origin | France |
| Type | In-line Dry Particle Counter for Semiconductor Front-Opening Unified Pod (FOUP) and Front-Opening Shipping Box (FOSB) |
| Measurement Range | 0.1 µm – 5.0 µm |
| Counting Principle | Laser Light Scattering (LLS) with Automated Surface Scanning |
| Cycle Time | ≤7 min per FOUP/FOSB |
| Throughput | Up to 8 carriers/hour |
| Compliance | SEMI S2/S8, ISO 14644-1 Class 1–ISO Class 3 environments |
| Interface | Ethernet/IP, SECS/GEM compatible |
| Operating Mode | Fully Automated, Unattended, Integrated into 300 mm Fab Automation |
| Brand | MCC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | LC-2 |
| Pricing | Upon Request |
| Board Dimensions | 317 mm × 609 mm (12.5″ × 24″) |
| Max Boards per System | 64 |
| Power per Board | Up to 400 W |
| Current per Board | Up to 240 A |
| I/O Channels | 128 independent |
| Vector Depth | Up to 4 M (upgradable) |
| Clock Resolution | 10 ns |
| Maximum Clock Frequency | 200 MHz |
| Max Device Power per Socket | 20 W |
| Concurrent Device Capacity | 1,536 devices |
| Thermal Control | Individual Chip Temperature Control (ICTC) via Pneumatic Cooling Valves and Heatsink-Based Resistive Heating |
| Brand | Thermo Fisher Scientific |
|---|---|
| Origin | Czech Republic |
| Model | ELITE |
| Type | Lock-in Thermography Inspection System for Semiconductor Failure Analysis |
| Compliance | Designed for ISO/IEC 17025-aligned lab environments, compatible with GLP/GMP documentation workflows |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported |
| Model | OmniEtch |
| Pricing | Available Upon Request |
| Brand | WEB |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 6000 |
| Pricing | Upon Request |
| Test Principle | Fluorinated Oil Immersion with Visual Bubble Detection |
| Compliance | MIL-STD-883C, MIL-STD-750 Method 202 |
| Max Operating Temperature | 165 °C |
| Fluorocarbon Oil Reservoir Capacity | 1.5 US gallons |
| Test Tray Dimensions | 10 in × 4 in |
| Magnification Options | Standard adjustable 1× or optional 3× lens |
| Illumination | Dual-source, >15,000 foot-candles |
| Evaporation Control | Integrated cooling ring |
| Key | Brand: DJ MicroLaminates |
|---|---|
| Origin | USA |
| Product Type | Dry Film Photoresist (DFR) |
| Chemistry | Cationic UV-Curable Modified Epoxy |
| Tone | Negative |
| Exposure Range | 350–400 nm UV |
| Thickness Options | 5 µm to >1 mm (standard: 100, 150, 200, 250, 350, 500, 650, 750 µm, 1 mm) |
| Substrate Compatibility | Si, SiNₓ, Cu, Au, glass, polymers, oxides |
| Storage Condition | Acclimate 15–18 h at 21–25 °C prior to lamination |
| Processing Time | <5 min total |
| Brand | MCC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | HPB-5B |
| Pricing | Available Upon Request |
| Cooling Method | Forced Air with Precision Thermal Valves |
| Heating Mechanism | Integrated Heat-Sink Heaters |
| Max Power per DUT | 150 W |
| I/O Channels | 128 Independent |
| Vector Depth | Up to 32 M |
| Scan Memory | >1 GB |
| Repetition Rate | 10 MHz |
| Clock Speed | 400 MHz |
| Timing Resolution | 1 ns |
| Temperature Control | Per-DUT, Real-Time Monitoring & Closed-Loop Adjustment |
| Brand | BNC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 575 |
| Pricing | Upon Request |
| Output Channels | 2 / 4 / 8 |
| Timing Resolution | 50 ps |
| Internal Trigger Jitter | 200 ps |
| External Trigger Jitter | 800 ps |
| Output Types | Electrical (TTL, ECL, NIM, LVDS) and Optical (LED or Laser Diode) |
| Trigger Inputs | Dual-mode — 2-gate, gate+trigger, or 2-trigger configurations |
| Brand | WEB |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | 4800 |
| Pricing | Upon Request |
| Brand | Nisene |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PlasmaEtch |
| Pricing | Available Upon Request |
| Brand | OAI |
|---|---|
| Origin | USA |
| Model | MODEL 800MBA |
| Exposure Modes | Proximity, Soft Contact, Hard Contact, Vacuum Contact |
| Maximum Mask Size | 9" × 9" (228.6 mm × 228.6 mm) |
| Maximum Wafer Size | 200 mm (8-inch) |
| Light Source Type | High-Uniformity Broadband UV Lamp System |
| Alignment Accuracy | ≤ ±0.5 µm (typical, with optional auto-alignment upgrade) |
| Baseplate Thermal Stability | < ±0.1 °C over 4 hours |
| Compliance | ASTM F39–22 (Photolithography Equipment), ISO 14644–1 Class 5 Cleanroom Compatible |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Variants | gL2000-L, gL2000-M, gL2000-H |
| Developer Options | gL Developer, gL Developer HR |
| Rinse Agent | gL Rinse |
| Stripper | gL Remover |
| Etch Resistance | Superior to PMMA |
| Resolution Capability | Sub-10 nm (under optimized e-beam conditions) |
| Tone | Negative |
| Processing | Aqueous-based development |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Type | Inkjet-Compatible Negative Tone Photoresist |
| Model | PriElex® SU-8 1.0 |
| Curing Temperature | <150 °C |
| Optical Transparency | High (UV–Visible Range) |
| Chemical Resistance | Excellent (against common acids, bases, and solvents) |
| Young’s Modulus | Low (~2–4 GPa, typical for flexible SU-8 derivatives) |
| Layer Compatibility | Single- and multi-layer stackable |
| Developer Compatibility | Standard SU-8 aqueous alkaline developers (e.g., Microposit®显影液 equivalents) |
| Printer Compatibility | Fujifilm Dimatix DMP-series inkjet platforms (e.g., DMP-2831, DMP-3000) |
| Brand | MicroChem Corp |
|---|---|
| Origin | USA |
| Product Type | Photoimageable epoxy-based wafer bonding adhesive |
| Series | PermiNex™ 1000 and 2000 |
| Temperature Resistance | <200 °C cure |
| Resolution | High-resolution patterning |
| Aspect Ratio | Up to 3:1 |
| Developer Compatibility | Aqueous alkaline solutions |
| Substrate Adhesion | Silicon, glass, quartz, SiO₂, SiNₓ |
| Shelf Life Storage | 4–21 °C |
| Corrosivity | Low metal ion contamination |
| Conformality | Void-free, conformal interface |
| Edge Acuity | Sharp, crack-free pattern edges |
| Reliability | Qualified for HAST (JESD22-A110) and TCT (JESD22-A104) |
| Seal Integrity | High hermeticity post-bond |
| Process Compatibility | Compatible with dicing, laser welding, and backend packaging steps |
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