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| Brand | AXIS-TEC |
|---|---|
| Origin | Singapore |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | AX-LS1000 |
| Maximum Linear Cutting Speed | 200 mm/s |
| Maximum Dicing Speed (YAG variant) | 140 mm/s |
| Maximum Dicing Speed (Semiconductor Laser variant) | 220 mm/s |
| Kerf Width | 30 µm |
| Cooling | Integrated Air-Cooling System |
| Configuration | T-Stage Dual-Station Platform |
| Laser Source Type | Fiber Laser (Standard), Optional YAG or Diode-Pumped Semiconductor Laser |
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Wafer Size Support | Up to 200 mm |
| Maximum Bonding Temperature | 650 °C |
| Heating Control | Independent top/bottom platen |
| Vacuum Level | ≤10⁻⁵ mbar (with turbomolecular pump) |
| Bonding Processes Supported | Anodic, Thermocompression, Eutectic, Glass Frit, Direct Si–Si, Intermediate Layer Adhesive, SOI, and Plasma-Activated Bonding |
| Automation Level | Semi-automatic (manual load/unload, fully automated bonding cycle) |
| Nanopatterning Capability | Integrated nanoimprint functionality |
| Brand | Westech |
|---|---|
| Origin | USA |
| Model | 7476D |
| Bonding Angle Options | 45° & 90° (deep cavity) |
| Wire Diameter Range | 18–100 µm |
| Ribbon Dimensions | 0.0005 × 0.010 in or 0.001 × 0.010 in |
| Ultrasonic Power Output | 4 W |
| Bonding Force Control | Dual-range, programmable |
| Heating | Resistive tool heating |
| Motion Control | Direct-drive motor with programmable tail control |
| Platform | Adjustable height (0.625 in), 12 × 12 in |
| Display | LCD interface |
| ESD Protection | Standard |
| Deep Cavity Capability | ≥13 mm (1 in optional) |
| Software | Multi-device recipe storage |
| Compliance | ESD-safe architecture, designed for Class 100/ISO 5 cleanroom integration |
| Brand | Osiris |
|---|---|
| Origin | Germany |
| Model | AFIXX 30s |
| Maximum Wafer Size | 200 mm |
| Temperature Range | Up to 650 °C (Independent Top/Bottom Plate Control) |
| Bonding Processes Supported | Thermal Compression, Adhesive Bonding, Glass Frit Bonding, Anodic Bonding, Eutectic Bonding, Direct Si–Si Bonding, SOI Bonding |
| Compatibility | Silicon, Compound Semiconductors (GaAs, SiC, GaN), Glass, Quartz, and SOI Wafers |
| System Architecture | Modular Bonding Chamber with In-Situ Alignment & Activation |
| Nanopatterning Capability | Integrated Nanoimprint Functionality |
| Compliance | Designed for GLP/GMP-aligned R&D and low-volume production environments |
| Operating Interface | Windows 10-based GUI with 22" Touchscreen HMI |
| Safety | Transparent Viewport Door for Real-Time Process Monitoring |
| Brand | JFP |
|---|---|
| Origin | France |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | WB200e |
| Pricing | Upon Request |
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