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| Brand | AXIC |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | BenchMark 800 |
| Etching Principle | Reactive Ion Etching (RIE) |
| Deposition Principle | Plasma-Enhanced Chemical Vapor Deposition (PECVD) |
| Substrate Compatibility | Up to 200 mm (8-inch) wafers |
| Operation Modes | Single-wafer and batch processing |
| Chamber Configuration | Modular single-chamber and dual-chamber options |
| RF Matching | Automatic impedance matching |
| Pressure Control | Downstream capacitance manometer with optional closed-loop regulation |
| Vacuum Options | Mechanical pump, mechanical + roots blower, or turbomolecular pump |
| Endpoint Detection | Optional optical emission spectroscopy (OES)-based endpoint detection |
| Gas Delivery | Replaceable showerhead with multi-gas capability |
| Electrode Configurations | Planar, RIE, and PECVD-specific electrode modules |
| Software Interface | Windows-based control with recipe management and audit trail logging |
| Brand | Appsilon |
|---|---|
| Origin | Germany |
| Model | Appsilon MP |
| Deposition Principle | Microwave Plasma Chemical Vapor Deposition (MPCVD) |
| Substrate Compatibility | Ir / YSZ / Si (100 mm diameter) |
| Output Material | Free-standing single-crystal diamond wafers (Ø92 mm, 155 ct) |
| Crystal Orientations Available | 4p Geo A, 4p Geo B, 2p Type I, 2p Type II, seed crystals, custom geometries |
| Optical Tolerance | ±0.25 / –0.00 mm (standard), ±0.05 / –0.00 mm (optional) |
| Application Domain | Fourth-generation semiconductor development, optical components (ATR prisms), precision cutting tools, biomedical instruments |
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