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| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | PlasmaPro 100 ALE |
| Pricing | Available Upon Request |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | Ionfab 300 |
| Configuration Options | Direct-Load, Single-Wafer Transfer, Cassette-to-Cassette Transfer |
| Process Modes | Ion Beam Deposition (IBD), Ion Beam Etching (IBE), Co-deposition & Reactive IBE |
| Wafer Handling | 300 mm single-wafer or cluster-integrated |
| Surface Roughness | Sub-nanometer RMS (typical for IBD films) |
| Uniformity | ≤±1.5% across 300 mm wafer (process-dependent) |
| Reproducibility | CV < 2% for etch/deposition rate (run-to-run) |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | PlasmaPro 100 Polaris |
| Wafer Size | 100 mm (4-inch) |
| Plasma Source | Inductively Coupled Plasma (ICP) with Magnetic Confinement |
| Electrode Configuration | Actively Cooled Bottom Electrode |
| Chuck Type | Electrostatic Chuck (ESC) with DC Bias Control |
| Chamber Liner | Heated, Anodized Aluminum |
| Pumping System | High-Capacity Turbomolecular Pump with Cryo-Assisted Roughing |
| Process Gas Compatibility | Cl₂, BCl₃, SF₆, CHF₃, O₂, Ar, N₂, and custom gas mixtures |
| Control Architecture | PLC-based real-time process control with Ethernet-enabled SECS/GEM interface |
| Compliance | CE-marked |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | NGP80 |
| Configuration Options | RIE, PECVD, RIE/PECVD |
| Wafer Handling | Up to 200 mm diameter wafers |
| Footprint | Compact (Small-Footprint) Design |
| Safety Compliance | SEMI S2/S8 |
| Control Architecture | Next-Generation Bus-Based Control System |
| User Interface | Enhanced Front-End Software with Integrated Diagnostics and Auto-Cleaning Protocol |
| Process Capabilities | Thin-film deposition (e.g., SiNₓ, SiO₂, a-Si:H), reactive ion etching, in-situ chamber conditioning |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Etch |
| Pricing | Upon Request |
| Brand | Oxford Instruments |
|---|---|
| Origin | United Kingdom |
| Model | PlasmaPro 100 Estrelas |
| Substrate Size | 50–200 mm |
| Application Scope | Deep Silicon Etching (DSiE), MEMS, Advanced Packaging, Nanotechnology |
| Chamber Configuration | Single-chamber dual-mode (Bosch™ and cryogenic etching) |
| Process Flexibility | In-situ switchable between smooth sidewall, high-aspect-ratio, tapered via, and high-rate cavity etching |
| Key Hardware | Electrostatic/Heated chuck, optimized chamber liner, high-efficiency turbomolecular pump, fast-response mass flow controllers (MFCs), close-coupled RF delivery |
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