Electron Microscope
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| Brand | Oxford Instruments |
|---|---|
| Origin | Germany |
| Model | alpha300 A |
| Instrument Type | Materials-Focused AFM |
| Position Detection Noise | ≤0.5 nm |
| Maximum Sample Diameter | 120 mm |
| Piezo Scanner Travel Range (X/Y) | ≤100 µm |
| Integrated Microscopy | Research-Grade Optical Microscope with Brightfield, Darkfield, Polarization & Fluorescence Capabilities |
| Scanning Technology | TrueScan™ Capacitive Feedback-Controlled Stage |
| Brand | Yoke |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Manufacturer |
| Country of Origin | China |
| Model | XSP-1CA |
| Price | Upon Request |
| Total Magnification Range | 40×–1600× |
| Eyepiece | WF10×/Φ18 mm, WF16×/Φ11 mm |
| Objective Lenses | 4×/0.10, 10×/0.25, 40×(S)/0.65, 100×(S) oil/1.25 |
| Nosepiece | Quadruple revolving nosepiece |
| Mechanical Tube Length | 160 mm |
| Stage | Dual-layer mechanical stage (125 × 120 mm), travel range 70 × 30 mm |
| Condenser | N.A. 1.25 Abbe condenser with centering adjustment, iris diaphragm and filter holder |
| Focusing Mechanism | Coaxial coarse/fine focus (15 mm travel), fine focus graduation: 0.002 mm |
| Eyepiece Tube | Monocular, inclined at 45°, rotatable 360° |
| Illumination | Reflected natural light (no built-in lamp) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Crossbeam 330 DualBeam SEM/FIB |
| Configuration | Integrated electron column + gallium liquid metal ion source (LMIS) FIB column |
| Vacuum system | Differential pumping with cold trap and turbomolecular pumps |
| Stage | Motorized 5-axis precision stage with ±90° tilt, 360° rotation, sub-micron repeatability |
| Detector suite | In-lens SE, ETSE, STEM, BSE, EDS-compatible |
| Optional integration | X-ray tomography (XRM) correlation module |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Crossbeam 350 |
| Configuration | Standard Chamber (18 ports) |
| Electron Optics | Gemini I with Tandem Decel |
| FIB Source | Liquid Metal Ga⁺ |
| Max FIB Current | 100 nA |
| SEM Resolution | ≤1.4 nm @ 1 kV (Tandem Decel) |
| Chamber Dimensions | Ø220 mm × H220 mm |
| Stage Travel | X/Y = 100 mm, Z = 40 mm |
| Detector Options | Inlens SE, Inlens EsB, VPSE, Inlens Duo |
| Software Platform | ZEISS Atlas 5 (3D Tomography & EDS Integration) |
| Compliance | Fully compatible with ASTM E1558, ISO/IEC 17025 workflows, GLP/GMP audit-ready data traceability (via Atlas 5 metadata logging) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Crossbeam 550 |
| Configuration | Fully Integrated FIB-SEM Platform with Gemini II Electron Optics and High-Current Ga⁺ Focused Ion Beam |
| Maximum Ion Beam Current | 100 nA |
| Resolution (SE, 1 kV, Tandem Decel) | ≤1.4 nm |
| Sample Chamber Options | Standard (18 ports) or Extended (22 ports) |
| X/Y Stage Travel | 100 mm (standard chamber) or 153 mm (extended chamber) |
| Inlens EsB Detector Depth Sensitivity | <3 nm |
| EDS Integration | Full 3D Tomography-Compatible Energy-Dispersive Spectroscopy Module |
| Software Platform | ZEISS Atlas 5 for Automated 3D FIB-SEM Tomography and Correlative Analysis |
| Compliance | Designed for GLP/GMP environments |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Domestic (China) |
| Model | Crossbeam 550 Samplefab |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | Crossbeam |
| Instrument Type | Floor-Standing Dual-Beam System |
| Electron Source | Thermal Field-Emission Gun (TFEG) |
| Ion Source | Liquid Metal Gallium (Ga⁺) Focused Ion Beam (FIB) |
| Optional Add-on | Femtosecond Laser Ablation Module |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing DualBeam System |
| Electron Source | Thermal Field Emission Gun |
| Secondary Electron Resolution | 0.9 nm @ 15 kV (Crossbeam 550), 1.0 nm @ 15 kV (Crossbeam 340) |
| Magnification Range | 12× – 2,000,000× (SEM mode) |
| Acceleration Voltage | 0.02–30 kV (SEM), 0.5–30 kV (FIB) |
| Backscattered Electron Resolution | Not specified |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Import Status | Imported |
| Model | ZEISS Cryo-Correlative Workflow Solution |
| Instrument Form Factor | Floor-standing / Conventional Large-scale |
| Electron Source | Cold Field Emission Gun |
| Secondary Electron Resolution | Not Specified |
| Magnification Range | Not Specified |
| Accelerating Voltage | Not Specified |
| Backscattered Electron Resolution | Not Specified |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Manufacturer |
| Regional Classification | Domestic |
| Model | EVO |
| Quotation | Upon Request |
| Instrument Form Factor | Floor-standing / Conventional Large-scale |
| Electron Source Type | Tungsten Filament |
| SEM Category | Entry-level Tungsten-Filament SEM |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EVO |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | EVO |
| Pricing | Available Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | EVO10 |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Tungsten Filament |
| Secondary Electron Resolution | 3 nm at 30 kV |
| Magnification Range | 10× to 1,000,000× |
| Accelerating Voltage | 0.2–30 kV |
| Maximum Sample Dimensions | Ø220 mm × 100 mm (H) |
| Stage Travel | X = 80 mm, Y = 100 mm, Z = 35 mm |
| Standard Detectors | Everhart-Thornley Secondary Electron Detector (SED), Solid-State Backscattered Electron Detector (BSE) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing / Conventional Large-format SEM |
| Model | Gemini |
| Key Features | High-efficiency in-lens detection |
| Sample compatibility | Conductive & non-conductive, magnetic & non-magnetic, bulk & coated specimens |
| Compliance | Designed for ISO/IEC 17025-compliant labs |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Instrument Type | Floor-standing SEM |
| Electron Gun | Cold Field Emission (CFEG) |
| Secondary Electron Resolution | 0.5 nm @ 15 kV, 0.8 nm @ 1 kV (with Tandem Decel) |
| Magnification Range | 50× – 2,000,000× |
| Accelerating Voltage | 0.02 – 30 kV |
| Backscattered Electron Resolution | 1.0 nm @ 1 kV (ESB detector) |
| Detector Configuration | In-lens SE, ET-SE, optional ESB, aSTEM-4, EDS, EBSD, CL |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Country of Origin | China |
| Model | GeminiSEM |
| Instrument Form Factor | Floor-standing |
| Electron Source | Thermal Field Emission Gun (TFEG) |
| Pricing | Upon Request |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | In Situ Liquid Electrochemistry Solution |
| Application | Real-time, high-resolution SEM imaging and multimodal analysis of electrochemical cells under operational conditions |
| Key Components | MEMS-based liquid cell chip, custom in situ battery stage, integrated electrical feedthroughs, 10 nm electron-transparent SiN window |
| Compatibility | Standard ZEISS GeminiSEM and SIGMA SEM platforms |
| Compliance | Designed for GLP-compliant workflows |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MultiSEM 706 |
| Beam Count | 91 parallel electron beams |
| Imaging Speed | ~1.5 s per 132 μm × 114 μm hexagonal field of view |
| Resolution | Nanoscale (sub-5 nm typical at 1–3 kV) |
| Sample Capacity | Up to 100 mm wafers or large biological tissue blocks (e.g., 1 mm³ human cortical tissue) |
| Application Scope | High-throughput volumetric EM for semiconductor metrology, connectomics, and materials science |
| Compliance | Designed for integration into GLP/GMP-adjacent workflows |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | MultiSEM |
| Electron Beam Configuration | Hexagonal array of 91 beams |
| Landing Energy Range | 1.0–3.0 kV |
| Average Resolution (all beams) | ≤ 3.5 nm @ 1.0 / 1.5 / 3.0 kV |
| Resolution Uniformity | ≤ ±1 nm @ 1.0 / 1.5 / 3.0 kV and 12 µm pitch |
| Beam Pitch Options | 12 µm (standard), 15 µm (optional) |
| Pitch Uniformity | ≤ ±1% |
| Field of View (hexagonal long axis) | 132 µm (12 µm pitch) or 165 µm (15 µm pitch) |
| Per-Beam Current | ≥ 570 pA |
| Total Probe Current | ≥ 52 nA |
| Current Uniformity | ≤ +10% |
| Electron Source | Schottky field-emission gun |
| Filament Current Stability | ≤ 1% per hour |
| Beam Blanking | Electrostatic |
| Working Distance | 1.4 mm |
| Detector System | High-efficiency multi-channel secondary electron detection with projection optics |
| Maximum Scan Rate per Beam | 20 MHz |
| Pixel Size Range | 2–20 nm (12 µm pitch) |
| Image Stitching | Fully automated, 91-subimage hexagonal tiling with adjustable overlap |
| Stage Type | Precision stepper stage |
| Stage Travel (X/Y/Z) | 100 / 100 / 30 mm |
| Stage Repeatability (XY) | ≤ ±3 µm |
| Sample Exchange Time (with exchange chamber) | ≤ 5 min |
| Sample Dimensions (max) | 100 × 100 mm² (XY), ≤ 30 mm height, ≤ 0.2 kg mass, surface flatness ≤ 500 nm P–P over 100 µm |
| Vacuum System | Turbo-molecular pump (>260 L/s) + oil-free scroll pump |
| Control Hardware | ≥4-core 64-bit CPU, ≥32 GB DDR RAM, ≥1 TB HDD, dual 1 Gbit Ethernet |
| OS | Windows 10 (64-bit) |
| Image Acquisition Nodes | 12 rack-mounted computers (≥4-core 64-bit CPU, ≥32 GB DDR3, 1 Gbit + 10 Gbit Ethernet) |
| Software Platform | ZEN core interface with Shuttle & Find, API for custom workflow integration, distributed acquisition database, automated focus/astigmatism/detector balancing, ROI-driven auto-sectioning, continuous serial sectioning workflows, real-time system health monitoring (vacuum, alignment, beam stability) |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Sigma 360 |
| Instrument Type | Floor-standing High-Resolution FE-SEM |
| Electron Source | Thermal Field Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV, 1.3 nm @ 1 kV |
| Magnification Range | 10× – 1,000,000× |
| Accelerating Voltage | 0.02 – 30 kV |
| Maximum Sample Diameter | ≤ 179 mm |
| Stage | 5-Axis Motorized Eucentric Stage |
| Standard Detectors | In-Lens SE Detector, Everhart-Thornley SE Detector, Solid-State Backscattered Electron (BSE) Detector |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model Series | SIGMA |
| Instrument Type | Desktop SEM |
| Electron Gun Type | Cold Field Emission |
| Microscope Class | High-Resolution Field Emission SEM |
| Secondary Electron (SE) Image Resolution | 1.0 nm @ 1 kV, 0.8 nm @ 3 kV |
| Maximum Magnification | 1,000,000× |
| Accelerating Voltage Range | 0.02–30 kV |
| Backscattered Electron (BSE) Image Resolution | 3.0 nm @ 30 kV |
| Working Distance for Analysis | 8.5 mm |
| Tilt Angle for EDS Collection | 35° |
| Variable Pressure Mode | Yes (C2D & VP-SE Detectors) |
| In-Lens SE/BSE Dual Detection | Yes |
| STEM-in-SEM Capability | Yes (aSTEM Detector Optional) |
| EDS Integration | SmartEDX (Si(Li)/SDD, Nitride Window Optimized for Light Elements) |
| RISE Integration | Yes (Fully Integrated Confocal Raman Imaging) |
| Brand | ZEISS |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Regional Classification | Domestic (China-made) |
| Model | Sigma |
| Pricing | Available Upon Request |
| Instrument Form Factor | Floor-standing / Conventional Large-Format SEM |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | SIGMA |
| Detector Options | InLens SE, ETSE, aBSD, Sense BSD |
| EDS Geometry | Optimized for High-Solid-Angle Collection |
| Operating Modes | NanoVP Lite, High-Resolution SEM, Low-Voltage Imaging, In-Situ Compatible |
| Vacuum System | Differential Pumping with Dual-Stage Turbo-Molecular Pumps |
| Stage | Motorized 5-Axis Precision Stage (±0.1 µm repeatability) |
| Beam Control | Gemini II Electron Optics with Active Stigmator and Auto-Alignment |
| Software Platform | SmartSEM with GLP/GMP-Compliant Audit Trail (21 CFR Part 11 Ready) |
| Compliance | ISO 14644-1 Class 5 Cleanroom-Compatible Design, CE Marked, RoHS Compliant |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Volutome |
| Application | Integrated in-chamber ultramicrotome for serial block-face imaging in field-emission scanning electron microscopy (FE-SEM) |
| Detector | Volume BSD (Backscattered Electron Detector optimized for volumetric surface imaging) |
| Charge Compensation | Patented localized charge compensation system |
| Automation | Unattended operation up to 72 hours |
| Workflow Integration | End-to-end solution from sectioning and imaging to 3D reconstruction and visualization |
| Brand | ZEISS |
|---|---|
| Origin | Germany |
| Model | Xradia 515 Versa |
| Spatial Resolution | ≤500 nm (true native resolution) |
| Imaging Modes | Absorption Contrast, Propagation-Based Phase Contrast |
| Software Platform | Scout-and-Scan Control System with ART 3.0 Advanced Reconstruction Toolbox |
| Compatibility | In Situ Mechanical & Thermal Stages, Automated Sample Handling, Flat-Panel Detector Options |
| Regulatory Compliance | Designed for GLP/GMP-aligned workflows |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Anhui, China |
| Manufacturer Type | Direct Manufacturer |
| Product Origin | Domestic (China) |
| Model | Custom-Integrated SEM-EDS Platform |
| Price Range | USD 17,000 – 25,500 |
| Magnification Range | 10× – 360,000× (continuously adjustable, user-definable setpoints) |
| Best Imaging Resolution | 3 nm (at 30 kV, SE mode) |
| EDS Detector | Silicon Drift Detector (SDD), ≥10 eV energy resolution (Mn-Kα) |
| Stage Dimensions | 540 mm × 760 mm |
| Motion Axes | 4-axis (X, Y, U, V) motorized precision stage |
| Minimum Positioning Increment | 0.001 mm |
| EDS Quantification Accuracy | ±2–5 wt% (matrix-dependent, per ISO 16529:2014 and ASTM E1508) |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | OEM Manufacturer |
| Product Category | Domestic |
| Model Series | PicoFemto In Situ Cryo Sample Holder |
| Instrument Classification | In Situ Cryogenic TEM Holder |
| Application Field | Materials Science |
| Cooling Medium | Liquid Nitrogen |
| Minimum Temperature | ≤ –170 °C (≤ 103 K) |
| Temperature Stability | < ±0.1 K |
| Cool-down Time to Minimum Temperature | ≤ 45 min |
| Dewar Capacity | 180 mL |
| Cryo Hold Time | ≥ 4 h |
| Resolution Compatibility | < 0.3 nm TEM Imaging |
| Dual-Tilt Range (β) | ±25° |
| Vacuum Bake Temperature | 120 °C |
| Base Vacuum (with Pre-pump System) | 6×10⁻⁵ Pa |
| Integrated Plasma Cleaning Power | 5–50 W (ICP mode) |
| Modular Interface Slots | 4 |
| Compatible TEM Platforms | Thermo Fisher Scientific (TFS), JEOL, Hitachi |
| Optional Functional Modules | Heating, Electrical Biasing, Mechanical Actuation (MEMS), STM Integration, High-Angle Tilt, Porous-Sample Support |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | PicoFemto In Situ MEMS Gas/Liquid TEM Sample Holder Series |
| Pricing | Upon Request |
| Instrument Classification | In Situ Gas Holder |
| Application Domain | Materials Science |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Origin Category | Domestic (China) |
| Model | PicoFemto In Situ MEMS Heating & Electrical Sample Holder Series |
| Application Field | Materials Science |
| Instrument Classification | In Situ Heating Holder |
| Pricing | Upon Request |
| Compatibility | Compatible with Standard TEM Goniometer Stages and Specified Pole Pieces |
| Brand | ZEPTOOLS |
|---|---|
| Origin | Guangdong, China |
| Manufacturer Type | Direct Manufacturer |
| Product Category | Domestic |
| Model | PicoFemto In Situ TEM Sample Holder Series |
| Instrument Classification | In Situ Tensile Holder |
| Application Field | Materials Science |
| Electrical Measurement Range | 1 nA – 30 mA |
| Current Resolution | < 100 fA |
| Voltage Output | ±10 V (Standard Mode), ±150 V (High-Voltage Mode) |
| Coarse Positioning Range (XY/Z) | 2.5 mm / 1.5 mm |
| Fine Positioning Range (XY/Z) | 15 µm / 1.5 µm |
| Fine Positioning Resolution (XY/Z) | 0.4 nm / 0.04 nm |