Electron Microscope
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| Origin | UK |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SC20 |
| Pricing | Upon Request |
| Brand | Shimadzu |
|---|---|
| Origin | Japan |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Origin | Imported |
| Model | SPM-8100FM |
| Instrument Type | Atomic Force Microscope (AFM) |
| Lateral Positioning Noise | 0.1 nm |
| Vertical Positioning Noise | 0.03 nm |
| Sample Diameter × Thickness | Φ24 mm × 8 mm |
| Sample Stage Travel Range | ±5 mm |
| Brand | Shimadzu |
|---|---|
| Origin | Japan |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Imported Instrument |
| Model | SPM-9700HT |
| Instrument Type | Atomic Force Microscope (AFM) |
| XY Positioning Noise | 0.1–0.2 nm (horizontal) |
| Z Positioning Noise | 0.03–0.05 nm (vertical) |
| Sample Size | Ø24 mm × 8 mm |
| Sample Stage Travel Range | ±6 mm |
| Brand | Shimadzu |
|---|---|
| Origin | Japan |
| Manufacturer | Shimadzu Corporation |
| Instrument Type | Atomic Force Microscope (AFM) |
| Category | Materials AFM |
| Position Detection Noise | < 0.02 nm RMS |
| Sample Dimensions | Ø50 mm × 8 mm max thickness |
| XY Stage Travel Range | 5 mm × 5 mm |
| Imaging Resolution | Up to 8192 × 8192 pixels |
| Automation Features | Auto-alignment ("Link On"), Auto-parameter optimization ("NanoAssist"), Fully automated tip exchange and fast 3D mapping |
| Brand | Shimadzu |
|---|---|
| Origin | Japan |
| Model | SPM-Nanoa |
| Instrument Type | Material-oriented AFM |
| Position Detection Noise | < 0.02 nm (RMS) |
| Sample Diameter | 50 mm |
| Sample Thickness | ≤ 8 mm |
| XY Stage Travel Range | 5 × 5 mm |
| Brand | SHNTI |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported |
| Model | SN-LDE |
| Pricing | Upon Request |
| Frame Dimensions | 5×5 mm, 7.5×7.5 mm, or 10×10 mm |
| Window Aperture | 1.0×1.0 mm to 5.0×5.0 mm (square) |
| Si₃N₄ Membrane Thickness | 50–200 nm (custom 30–500 nm, MOQ 100 pcs) |
| Frame Thickness | 200 µm, 381 µm, or 525 µm |
| Surface Roughness | <1 nm RMS |
| Max Operating Temperature | 1000 °C |
| Vacuum Rating | ≥1 atm differential pressure (dependent on membrane thickness & aperture size) |
| Chemical Stability | Inert, compatible with plasma, glow discharge, and mild chemical cleaning (no ultrasonication) |
| Brand | SHNTI (Shanghai NTI Instruments) |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | TEM-SN |
| Accelerating Voltage Compatibility | Up to 300 kV (compatible with standard TEMs operating at 70–300 kV) |
| Magnification Range | Optimized for high-resolution imaging ≥100× |
| Frame Dimensions | 3 mm × 3 mm |
| Window Aperture | 0.5 mm or 1.0 mm (square) |
| Si₃N₄ Membrane Thickness | 50 nm or 100 nm (customizable from 30–200 nm, MOQ 100 pcs) |
| Frame Thickness | 200 µm or 381 µm |
| Surface Roughness | 0.6–2 nm RMS |
| Thermal Stability | Stable up to 1000 °C in inert/vacuum environments |
| Chemical Resistance | Inert to most acids, bases, and organic solvents (except hot phosphoric acid and strong alkalis) |
| Hydrophobicity | Native hydrophobic surface |
| Cleaning Method | Compatible with O₂ plasma, Ar/O₂ glow discharge, and chemical etching (e.g., Piranha: H₂SO₄:H₂O₂ = 1:1 |
| RCA1 | H₂O:HCl:H₂O₂ = 5:3:3) |
| Brand | SPIP |
|---|---|
| Origin | USA |
| Model | 6.0.14 |
| Distribution Type | Authorized Distributor |
| Import Status | Imported |
| Pricing | Available Upon Request |
| Brand | SUNYOU |
|---|---|
| Origin | Japan |
| Model | ZONETEM II |
| Cleaning Principle | Vacuum-Enhanced 185/254 nm UV-Ozone Oxidation |
| Vacuum Range | 100–500 Torr (100-step adjustable) |
| Pump Type | Oil-Free Dry Scroll Vacuum Pump (3.8 L/min) |
| Pump-Down Time | ≤3 min to operational vacuum |
| Cleaning Duration | 1–30 min (1-min increments) |
| Sample Holder Compatibility | 3-hole or 5-hole TEM specimen holders |
| Effective Cleaning Area | Ø3 mm per position |
| Regulatory Compliance | Designed for ISO/IEC 17025-compliant labs |
| Brand | SWIFT |
|---|---|
| Origin | United Kingdom |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | SWIFT In Situ Tensile Stage |
| Instrument Classification | In Situ Mechanical Testing Stage |
| Application Field | Materials Science |
| Maximum Load Capacity | 10 kN |
| Temperature Range | 0–1200 °C |
| Tensile Load Capacity | 10 kN |
| Stroke | 26 mm |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | Gentle Mill |
| Ion Energy | 100–2000 eV (continuously adjustable) |
| Ion Beam Current | 7–80 µA |
| Ion Current Density | up to 10 mA/cm² |
| Beam Diameter (FWHM) | 750–1200 µm |
| Sample Tilt Range | 0°–40° (0.1° increments) |
| In-Plane Rotation & Swing | ±10° to ±120° (10° increments) |
| Si Etch Rate at 2000 eV / 30° | 28 µm/h |
| TEM Sample Thickness Compatibility | 30–200 µm |
| Imaging | High-resolution color CMOS camera with 50×–400× manual zoom |
| Vacuum System | Pfeiffer dry diaphragm + turbomolecular pump, full-range Pirani/Penning gauge |
| Process Gas | 99.999% Ar, regulated at 1.3–1.7 bar absolute pressure with electronic outlet pressure monitoring |
| Power Supply | 100–120 V/3.0 A/60 Hz or 220–240 V/1.5 A/50 Hz, single-phase |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | GIB |
| Ion Energy Range | 100 eV – 2 kV |
| Max Beam Current at 2 kV | 70 µA |
| Beam Diameter (FWHM) | 2 mm |
| Source Dimensions | Ø50 mm × 50 mm |
| Working Distance | 15–30 mm |
| Integration Interface | SEM/FIB-compatible flanged connection with bellows transmission system |
| Mounting | Semi-cylindrical support bracket |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | SEMPREP SMART |
| Ion Gun Energy | up to 16 keV |
| Sample Stage Tilt | 0°–30° (0.1° increments) |
| Rotation | 360° continuous variable speed |
| Oscillation Angle | ±10° to ±120° (5° increments) |
| Sample Dimensions (90° cross-section stage) | max 18.6 × 16 × 6 mm |
| EBSD Planar Stage Options | flat-head (Ø50 × 4 mm), standard (Ø32 × 15 mm), hollow-head (Ø25 × 23 mm) |
| Vacuum System | oil-free diaphragm pump + HiPace 80 Neo turbomolecular pump |
| Gas Supply | 99.999% pure argon, precision needle-valve flow control |
| Imaging | 5 MP CMOS camera with in-image measurement |
| Optional | Low-Energy Gun (LEG), LN₂ cooling, Vacuum Transfer Unit (VTU), Peltier cooling |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | SEMPREP SMART |
| Ion Gun Energy | Up to 16 keV |
| Sample Stage Options | Cross-section (30°/90°), Planar (Flat/Standard/Hollow Heads) |
| Sample Dimensions | Up to 50 mm Ø × 4 mm (flat) |
| Tilt Range | 0–30°, adjustable in 0.1° increments |
| Rotation | 360° continuous, variable speed |
| Swing Angle | ±10° to ±120°, adjustable in 5° steps |
| Cooling Options | LN₂ or Peltier |
| Vacuum System | Oil-free diaphragm pump + HiPace 80 Neo turbomolecular pump |
| Imaging | 5 MP CMOS camera with on-image measurement |
| Gas Supply | 99.999% pure Ar, precision needle-valve flow control |
| Software | Automated gun operation, stage calibration, beam-assisted positioning |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | SEMPREP-SMART |
| Ion Gun Energy | Up to 16 keV (High-Energy) + Optional Low-Energy Gun (LEG) |
| Sample Stage Types | 30° Cross-section, 90° Cross-section, Planar (EBSD), with Three Head Options (Flat, Standard, Hollow) |
| Max Sample Dimensions | 18.6 × 16 × 6 mm (90° stage) |
| Tilt Range | 0–30° (0.1° increments) |
| Rotation | 360° continuous, variable speed |
| Swing Angle | ±10° to ±120° (5° increments) |
| Vacuum System | Oil-free diaphragm pump + HiPace 80 Neo turbomolecular pump |
| Gas Supply | 99.999% purity Ar, precision needle valve control |
| Imaging | 5 MP CMOS camera with on-image measurement |
| Cooling Options | LN₂ or Peltier |
| Optional Accessories | Vacuum Transfer Unit (VTU), Automated Stage Calibration via Ion Beam |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | SEMPREPSMART |
| Ion Gun Energy | Up to 16 keV |
| Sample Stage Options | 30° cross-section, 90° cross-section, and EBSD-compatible planar stages (flat-head: Ø50 mm × 4 mm |
| standard | Ø32 mm × 15 mm |
| hollow | Ø25 mm × 23 mm) |
| Tilt Range | 0–30° (0.1° incremental adjustment) |
| Rotation | 360° continuous variable-speed |
| Swing Angle | ±10° to ±120° (5° increments) |
| Vacuum System | Oil-free diaphragm pump + HiPace 80 Neo turbomolecular pump |
| Gas Supply | Ultra-high-purity argon (99.999%), precision needle-valve flow control |
| Optional Features | Low-Energy Gun (LEG), LN₂ or Peltier cooling, Vacuum Transfer Unit (VTU), Independent alignment stage for 90° sectioning |
| Imaging | 5 MP CMOS camera with on-image measurement capability |
| Control | Graphical user interface with automated ion beam positioning, stage calibration, and process scripting |
| Brand | Technoorg Linda |
|---|---|
| Origin | Hungary |
| Model | UniMill |
| Ion Beam Energy Range | 100 eV – 16 keV (dual-gun configuration) |
| Beam Current | up to 500 µA (ultra-high-energy gun) |
| Beam Diameter (FWHM) | 0.9–2.2 mm |
| Tilting Angle | 0°–40° (0.1° resolution) |
| In-Plane Rotation | 360° continuous |
| Lateral Translation | ±10° to ±120° (10° increments) |
| Sample Thickness Compatibility | 30–200 µm |
| Imaging | High-resolution color CMOS camera with 50–400× manual zoom |
| Vacuum System | Pfeiffer dry diaphragm + turbomolecular pump |
| Gas Supply | Ultra-high-purity Ar (99.999%), regulated at 1.3–1.7 bar absolute |
| Power | 100–120 V/10 A or 220–240 V/5 A, 50–60 Hz |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Model | Glow Discharge 91000 |
| Plasma Current | 0–30 mA |
| Power | 30 W |
| Polarity | Adjustable (Positive/Negative) |
| Sample Stage Diameter | 75 mm |
| Stage Height Adjustment | 1–25 mm |
| Processing Delay Time | 0–14,400 s |
| Processing Duration | 0–900 s |
| Chamber Dimensions | Ø120 × 100 mm |
| Inlet Ports | 2 × Ø6 mm |
| Vacuum Control | Pirani gauge, range: atmospheric pressure to 0.01 mbar |
| Operating Vacuum Range | 0.20–1.1 mbar |
| Touchscreen Display | 3-inch LED-backlit with 5 function keys |
| Control Modes | Automatic (4 programmable user protocols) and Manual |
| Safety Interlocks | Dual hardware + software vacuum interlock |
| Dimensions (Main Unit) | 305 × 292 × 230 mm |
| Weight (Main Unit) | 6.26 kg |
| Optional GD4 Vacuum Pump | 337 × 138 × 244 mm, 11 kg, pumping speed 2.5 m³/hr, ultimate vacuum 0.03 mbar |
| Power Supply | 230 V, 50 Hz, 10 A |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Model | Dimpler |
| Z-Axis Accuracy | ±1 µm |
| Z-Range | 2000 µm |
| Z-Termination Accuracy (Tool 1i/3i) | <±1 µm |
| Z-Termination Accuracy (Tool 2i/4i) | <±2 µm |
| Tool Load Range | 1–200 g (1 g increments) |
| Balance Sensitivity | 1 g (Range: 50 g) |
| Tool Rotation Speed | 100–600 RPM |
| Platen Rotation Speed | 10 RPM |
| Spindle Runout (TIR) | 0.5 µm |
| Tool TIR (1i/3i) | <±1 µm |
| Tool TIR (2i/4i) | <±2 µm |
| Platen Surface TIR | <0.5 µm |
| Dimensions (L×W×H) | 68.6 × 35.6 × 33 cm |
| Weight | 32 kg |
| Power Input | 85–264 VAC, 47–63 Hz |
| Product Codes | 84000 (Dimpler), 83050 (Video Alignment Tool), 83031 (Standard 3 mm TEM Tool Set), 83032 (Adjustable Clamp Assembly), 83001 (Sapphire Sample Holder) |
| Brand | Ted Pella |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | PELCO easiCore |
| Price | Upon Request |
| Max Rotational Speed | 100–1500 rpm |
| Maximum Applied Load | 1 kg |
| Disc Diameter Range | 2.3–25 mm |
| Positioning Accuracy | X-Y Stage with 1 mm Graduated Scale |
| Compatible Mounting Fixtures | PELCO Precision Wire Saw, PELCO Precision Low-Speed Saw, PELCO Dimpler |
| Optional Accessory | PELCO Abrasive Dispenser (timed abrasive slurry delivery) |
| Brand | PIE |
|---|---|
| Origin | USA |
| Model | TEM Cube |
| Vacuum Performance | ≤1×10⁻⁷ Torr (with turbomolecular pump) |
| Chamber Dimensions | 9 in × 9 in × 9 in (229 mm × 229 mm × 229 mm) |
| Sample Holder Capacity | Up to 8 TEM holders (4 per side) with universal adapters for JEOL, Hitachi, Thermo Fisher/FEI, and ZEISS systems |
| Plasma Source | EM-KLEEN remote RF plasma source (O₂, H₂, or ambient air compatible) |
| Vacuum Isolation | Electromagnetically actuated valves per holder port |
| Pump Configuration | Separated turbomolecular or oil-free dry scroll vacuum station |
| Chamber Door | Hinged tempered glass door with mechanical locking knob |
| Operating Temperature | Slightly above ambient (±2 °C stability) |
| Compliance | Designed for GLP/GMP-aligned lab environments |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER |
| Price Range | USD 920,000 – 1,315,000 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported Instrument |
| Model | TESCAN AMBER X |
| Price Range | USD 1.3–2.0 million |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Thermal Field-Emission Gun (TFEG) |
| Secondary Electron Resolution | 0.9 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 200 V – 30 kV (with deceleration mode down to 50 V) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV (in low-vacuum mode) |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun (FEG) |
| Secondary Electron Resolution | 0.6 nm @ 15 kV |
| Magnification Range | 2× to 2,000,000× |
| Accelerating Voltage | 0.2–30 kV (deceleration mode down to <50 V) |
| Backscattered Electron Resolution | 1.6 nm @ 15 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer | TESCAN ORSAY HOLDING a.s. |
| Type | Floor-Standing SEM |
| Electron Source | Schottky Field-Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Magnification Range | ×2 to ×1,000,000 |
| Accelerating Voltage | 50 V (decelerated mode) to 30 kV |
| Chamber Configuration | AMU (Advanced Macro-Utility) Ultra-Large Specimen Chamber |
| Compliance | CE, ISO 9001, IEC 61000-6-3/6-4 |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Instrument Type | Floor-standing SEM |
| Electron Source | Schottky Field Emission Gun |
| Secondary Electron Resolution | 1.0 nm @ 30 kV |
| Magnification Range | 2× to 1,000,000× |
| Accelerating Voltage | 50 V–30 kV (with beam deceleration mode) |
| Backscattered Electron Resolution | 2.0 nm @ 30 kV |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Origin Category | Imported |
| Model | NanoSpace |
| Price Range | USD 1.9M – 3.2M |
| Main Chamber Base Pressure | 5 × 10⁻¹⁰ mbar |
| Bake-Out Temperature | Up to 120 °C |
| Sample Transfer Time (Atmosphere → UHV Main Chamber) | ≤30 min |
| Stage X/Y Travel Range | 100 mm ± 50 nm |
| BrightBeam e-Optics Resolution | <1.6 nm @ 12 mm WD, 0.5–30 keV, beam current: few pA to >350 nA |
| e-CLIPSE+ e-Optics Resolution | 5 nm @ 1 pA, 0.5–30 keV, beam current: 1 pA–2.5 µA @ 30 keV, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| DeepFIB Ga⁺ Source Resolution | 2.5 nm @ 1 pA, 250 V–30 keV, max ion current: 125 nA |
| PFIB Gas Field Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 25 nm @ 1 pA @ 3 keV, beam current up to 3.5 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%), Si milling rate: 800 µm³/s |
| Veloce LMAIS (AuGe/AuSi/Bi) | 5 nm @ 1 pA, mass range: 14 (Si⁺) to 613 (AuSi⁺), 1–30 keV, max current: 50 nA |
| iVeloce Wien-filtered Gas Ion Source (Xe⁺/O₂⁺/Ar⁺/He⁺/N⁺) | 3–30 keV, max current: 1 µA, FOV @ 10 keV: 1250 × 1250 µm (±10%) |
| Brand | TESCAN |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Product Category | Domestic |
| Model | FIB/SEM Column Upgrade Service |
| Instrument Form Factor | Floor-Standing |
| Electron Source Type | Thermal Field Emission |
| Microscope Class | Ultra-High-Resolution Field-Emission SEM/FIB |
| Secondary Electron Imaging Resolution | ≤1.6 nm (Brightbeam), ≤5 nm (e-CLIPSE+), ≤2.5 nm (DeepFIB), ≤25 nm (PFIB), ≤5 nm (Veloce), ≤30 nm (iVeloce) |
| Accelerating Voltage Range | 0.5–30 keV (e-beam) |
| Backscattered Electron Imaging Resolution | Comparable to SE resolution under optimized conditions |
| Ion Beam Current Range | Up to 125 nA (DeepFIB), up to 3.5 µA (PFIB), up to 50 nA (Veloce), up to 1 µA (iVeloce) |
| Field of View (at 10 keV) | 1250 × 1250 µm (±10%) for e-CLIPSE+, PFIB, iVeloce |
| Brand | TESCAN |
|---|---|
| Origin | Czech Republic |
| Manufacturer Type | Original Equipment Manufacturer (OEM) |
| Import Category | Imported Instrument |
| Model | RISE Microscope |
| Electron Gun Type | Cold Field Emission |
| Secondary Electron Image Resolution | 1.0 nm @ 15 kV |
| Accelerating Voltage Range | 0.2–30 kV |
| Backscattered Electron Image Resolution | 1.0 nm @ 15 kV |
| Confocal Raman Spatial Resolution | 360 nm (with 532 nm laser) |
| Optical Architecture | Parallel-Axis Co-Localized SEM–Raman Design |
| Maximum Sample Chamber Capacity | Compatible with TESCAN’s Ultra-Large Chamber Platforms |
| Detector Compatibility | Full Integration with BSE, CL, EDS, and Other In-Chamber Detectors |
