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| Brand | ATI |
|---|---|
| Origin | Germany |
| Manufacturer Type | Authorized Distributor |
| Product Category | Imported Instrument |
| Model | WIS-1000 |
| Instrument Type | Optical Patterned Wafer Defect Inspection System |
| Target Applications | Semiconductor Front-End Process Monitoring |
| Process Node Support | Sub-28 nm FinFET and FD-SOI Technologies |
| Compatible Wafer Sizes | 200 mm and 300 mm |
| Throughput | Up to 120 wafers per hour (depending on inspection recipe and defect density) |
| Optical Resolution | ≤ 150 nm (at λ = 405 nm, high-NA dark-field imaging) |
| Defect Detection Sensitivity | ≥ 95% for ≥ 80 nm particles and ≥ 120 nm pattern bridging/bridging defects on metal and dielectric layers |
| Compliance | ISO 9001-certified manufacturing |
| Brand | Netzsch |
|---|---|
| Origin | Germany |
| Model | DSC 214 Polyma |
| Temperature Range | −100 °C to 600 °C |
| Heating/Cooling Rate | up to 500 °C/min |
| Sensor Type | Corona® high-reproducibility heat-flux sensor |
| Crucible System | Concavus® concave-bottom crucibles with fixed annular contact geometry |
| Software Platform | Proteus® with Smart Mode, Expert Mode, TM-DSC, Beflat® baseline correction, Auto-Analysis, Identify™ polymer recognition database |
| Compliance | ISO 11357-1, ASTM E794, ASTM E1356, USP <1151>, GLP/GMP-ready audit trail (FDA 21 CFR Part 11 optional) |
| Brand | ATI |
|---|---|
| Model | WIND |
| Category | Wafer Defect Electron Beam Inspection Equipment |
| Origin | South Korea |
| Frame Material | Hairline Stainless Steel with White Powder Coating |
| Dimensions (W×D×H) | 1900 mm × 1680 mm × 2100 mm |
| Weight | 3.5 tons |
| Wafer Compatibility | 200 mm & 300 mm bare wafers |
| Load Port Support | FOUP, open cassette, ring cassettes (8″, 12″) |
| Alignment | Dual-wafer-size auto-alignment (200/300 mm bare |
| Automation Interface | SECS/GEM compliant, SEMI E84 standard |
| Vision System | Dual-optic 2D/3D module with real-time auto-focus |
| Inspection Modes | Normal/sawing inspection, bump inspection, edge/kerf measurement, 3D bump height/warpage/coplanarity/thickness/BLT metrology |
| Algorithm | Die-to-Die (D2D) registration using optimal die selection from adjacent four dies |
| Optional Module | IR imaging for subsurface crack and silicon bulk defect detection |
| Compliance | Fully aligned with SEMI standards |
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