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| Brand | Kingsemi |
|---|---|
| Model | KS-S150 |
| Configuration | Star-type fully automated coater/developer |
| Substrate Compatibility | Sapphire, GaAs, SiC wafers (4", 6") |
| Throughput | ≥190 wafers/hour (coating module) |
| Photoresist Consumption | 0.6 mL per 4" wafer |
| Certification | CSA Certified |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Coater/Developer for Patterning Processes |
| Application Scope | LED-PSS, compound semiconductor fabrication, sensor ICs, optical communication chips, power devices, patterned sapphire substrates |
| Brand | Canon |
|---|---|
| Origin | Japan |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | FPA5000 ES4 |
| Resolution | 0.13 µm |
| Exposure Wavelength | 248 nm |
| Maximum Exposure Field | 26 mm × 33 mm |
| Numerical Aperture (NA) | 0.5–0.8 |
| Reduction Ratio | 4:1 |
| Overlay Accuracy | ±25 nm |
| Brand | Kingsemi |
|---|---|
| Origin | Liaoning, China |
| Model | KS-FT200/300 (8"/12" Front-End Process) |
| Application | ArF/KrF/I-Line photoresists, PI, BARC, SOC, SOD, SOG |
| Integration | Compatible with track-to-scanner inline lithography systems |
| Certification | Compliant with SEMI S2/S8 safety standards, ISO 14644-1 Class 5 cleanroom operation |
| Architecture | Modular stackable design |
| Thermal Control | Optional high-precision hot/cold plates (±0.1°C uniformity) |
| Inspection | Optional integrated Wafer Edge Exposure (WEE) and Automated Optical Inspection (AOI) modules |
| Maintenance | Front-accessible modular units with tool-less panel removal |
| Brand | Kingsemi |
|---|---|
| Model | KS-S150-6ST |
| Origin | Liaoning, China |
| Equipment Type | Semiconductor Resist Stripping System |
| Configuration | 6-Station Wet Processing Platform |
| Vacuum Handling | Dual-Vacuum Dual-Clamp High-Speed Robotic Arm |
| Alignment | Automated Wafer Centering (AWC) with Vision-Based Recognition |
| Bath Compatibility | Multi-Size & Multi-Angle Immersion Modules (150 mm to 200 mm wafers) |
| Pressure Control | Closed-Loop High-Pressure Fluid Delivery (±0.2 MPa accuracy) |
| Heating System | In-Line High-Pressure Resistant Heater (PID-controlled, ≤120 °C) |
| Chuck Type | Actively Clamped, Backside-Protected Electrostatic/ Mechanical Chuck |
| Chemical Recovery | Integrated Solvent Recovery and Recirculation Loop |
| Compliance | Designed for Class 100 Cleanroom Integration |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | WS-650-8B |
| Maximum Substrate Size | 200 mm wafer or 178 mm × 178 mm square substrate |
| Max Speed | 12,000 rpm (at 100 mm Si wafer) |
| Controller | 650 Series Microprocessor-Based Process Controller |
| Software | Spin3000 PC Control & Simulation Suite (free, optional but fully compatible) |
| Housing Material | Chemically resistant solid copolymer blend (standard) or PTFE Hostaflon® TFM-1600 / Teflon® AF (optional, high-temp/ultra-clean) |
| Sealing | Proprietary labyrinth seal with N₂ purge capability |
| Compliance | Designed for ISO Class 5–4 cleanroom integration |
| Brand | LEBO Science |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-2 |
| Wafer Compatibility | Fragments to 200 mm (customizable up to 300 mm with quad-nozzle configuration) |
| Development Modes | Single-step & Multi-step Programmable Process |
| Max. Spin Speed | 3000 rpm (no-load) |
| Speed Resolution | ±1 rpm |
| Acceleration Range | 10–10,000 rpm/sec (no-load) |
| Step Duration Range | 0–3000 sec |
| Time Resolution | 0.1 sec |
| Nozzle Control | Motorized XYZ-positioning with programmable trajectory |
| Fluid Delivery | 1 dedicated developer channel + 1 deionized water rinse channel + 1 N₂ purge channel |
| Compliance | Designed for Class 100–1000 cleanroom environments |
| Software | Onboard HMI with 100 user-editable process recipes |
| Brand | Laurell |
|---|---|
| Origin | USA |
| Model | H6-15 |
| Maximum Speed | 12,000 rpm (at 100 mm Si wafer) |
| Substrate Compatibility | up to 300 mm wafers and 9″ × 9″ (229 mm × 229 mm) square substrates |
| Control Interface | Wireless tablet with Laurell Touch software |
| Firmware Upgradability | Field-upgradable via downloadable updates |
| Software | Spin3000 PC-based process management suite (free, includes virtual simulation mode) |
| Enclosure Compatibility | Designed for integration into gloveboxes |
| Modular Expansion | Field-upgradable via plug-in modules |
| Compliance | Supports GLP/GMP traceability requirements through audit-ready process logging |
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