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| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 6110 |
| Spindle Power | 2.2 kW |
| Max Spindle Speed | 60,000 rpm |
| Spindle Torque | 0.42 N·m |
| θ-Axis Drive | Direct-Drive (DD) Motor |
| Machine Width | 490 mm |
| Control Interface | 17-inch LCD Touchscreen GUI |
| Standard Features | Auto-Calibration, Auto-Cutting, Blade-Trace Inspection |
| Optional Features | Fragment Shape Recognition, One-Touch Position Verification |
| Sample Compatibility | Si, SiC, GaAs, Glass, Ceramic, Solar Wafers |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Model | 7920 |
| Blade Diameter Range | 2"–3" |
| Maximum Spindle Speed | 60,000 rpm |
| Spindle Power | 1.2 kW per axis |
| Workpiece Capacity | Ø12" or 12" × 10" |
| X-Axis | Pneumatic Linear Slide |
| Y-Axis Resolution | 0.1 µm |
| Z1/Z2-Axis Resolution | 0.2 µm |
| Z1/Z2 Travel | 30 mm |
| Z1/Z2 Repeatability | ±1.0 µm |
| θ-Axis Repeatability | ±4 arc-sec |
| θ-Axis Travel | 350° |
| Cumulative Positioning Accuracy | ±1.5 µm |
| Step Positioning Accuracy | ±1.0 µm |
| Electrical Supply | 200–240 VAC, 50–60 Hz, Single-Phase |
| Dimensions (W×D×H) | 875 × 975 × 1450 mm |
| Weight | 900 kg |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Regional Classification | Domestic (China) |
| Model | 8230 |
| Pricing | Available Upon Request |
| Brand | ADT |
|---|---|
| Origin | Shanghai, China |
| Manufacturer Type | Authorized Distributor |
| Region of Manufacture | Domestic (China) |
| Model | 7234 |
| Pricing | Upon Request |
| Brand | UniTemp |
|---|---|
| Model | VSS-300 |
| Origin | Germany |
| Chamber Dimensions | 350 × 350 × 75 mm (expandable to 300 mm height) |
| Max Ramp-Up Rate | 150 K/min |
| Max Ramp-Down Rate | 120 K/min |
| Bottom Heating Power | 2 × 12-lamp arrays, 18 kW total |
| Cooling | Water-cooled graphite plate (310 × 310 mm) |
| Control System | SIMATIC PLC with 7" touchscreen HMI |
| Programmable Steps | 50 programs × 50 steps each |
| Process Gas Flow | Standard 1.5 sL/min MFC (up to 4 gas lines optional) |
| Vacuum Options | MPC (10 hPa) or RVP (10⁻³ hPa) |
| Power Supply | 3-phase + N + PE, 230 V, CEE 3×32 A |
| Weight | ~140 kg |
| Compliance | Designed for ISO 9001-compliant SMT manufacturing environments |
| Enclosure Material | Polished aluminum chamber walls (stainless steel optional) |
| Brand | TSD |
|---|---|
| Model | IVG-2040 / IVG-3040 |
| Max Wafer Size | 200 mm (8") / 300 mm (12") |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Table Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Repeatability | ±0.001 mm |
| In-Line Thickness Range (OMM) | 0–4800 µm |
| Integrated Auto Load/Unload | Yes |
| Non-Contact Gauging (NCG) | Optional |
| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | DSM8/200 Gen2 |
| Measurement Principle | Dual-microscope optical alignment metrology with TIS-compensated image registration |
| Accuracy | ≤ 0.2 µm (after TIS compensation) |
| Configuration Options | Manual loading (DSM8 Gen2) / Robotic handling with custom chuck (DSM200 Gen2) |
| Illumination Options | Visible + optional IR illumination (for through-silicon feature imaging) |
| Software Platform | Cognex PatMax®-powered automated image analysis with recipe-driven operation |
| Compliance Context | Designed for GLP/GMP-aligned semiconductor process development and high-reliability packaging workflows |
| Brand | TSD |
|---|---|
| Model | IVG Series |
| Origin | Beijing, China |
| Type | Semi-Automatic Dual-Axis Wafer Thinning System |
| Maximum Wafer Size | 200 mm (IVG-2020) / 300 mm (IVG-3020) |
| Grinding Wheel OD | 203 mm / 303 mm |
| Spindle Power | 6.0 kW / 9.5 kW |
| Spindle Speed | 0–6000 rpm / 0–4000 rpm |
| Chuck Rotation Speed | 0–380 rpm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec |
| In-Line Thickness Measurement Range | 0–4800 µm |
| Thickness Repeatability | ±1 µm |
| Non-Contact Gauging (NCG) | Optional |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Manufacturer Type | Authorized Distributor |
| Country of Origin | China |
| Model | IHG-2010 |
| Price | Upon Request |
| Maximum Wafer Size | 6-inch (150 mm) |
| Grinding Wheel OD | Ø200 mm |
| Spindle Speed Range | 0–3000 rpm |
| Chuck Table Speed | 0–400 rpm |
| Z-Axis Travel | 70 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional high-resolution mode: 0.01 µm/sec) |
| Industry Compliance Options | SECS/GEM interface, MES integration support |
| Brand | Mengqi |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Wafer Size Capacity | 8-inch |
| Grinding Wheel OD | 203 mm |
| Spindle Speed Range | 0–6000 rpm |
| Chuck Rotation Speed | 0–400 rpm |
| Z-Axis Stroke | 130 mm |
| Z-Axis Feed Rate | 0.1–1000 µm/sec (optional down to 0.01 µm/sec) |
| In-situ Thickness Measurement Resolution | 0.1 µm |
| In-situ Thickness Repeatability | ±0.001 mm |
| Material Compatibility | Si, GaAs, SiC, GaN, Sapphire, and other brittle semiconductor substrates |
| Customization | Fully configurable chuck, coolant delivery, metrology integration, and process recipe management |
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