- All
- Favorite
- Popular
- Most rated
| Brand | TRY |
|---|---|
| Model | Customized |
| Application Scope | High-power IC packaging (e.g., IGBT modules), semiconductor manufacturing, materials R&D, automotive electronics |
| XY Stage | 150 × 150 mm |
| Max Shear Force Capacity | 1000 kg |
| Compliance | ASTM F468, ISO 13473-2, JEDEC JESD22-B116 (Bond Strength), MIL-STD-883 Method 2011 |
| Sensor Technology | Digital load cell with thermal drift compensation |
| Control Interface | Touchscreen HMI + Ethernet/RS232 for integration into factory MES/LIMS |
| Software | TRY-BondTest Suite v3.2 with audit trail, user role management, and 21 CFR Part 11–compliant electronic signatures |
Show next