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| Brand | ZhiCheng |
|---|---|
| Origin | Imported |
| Manufacturer Type | Authorized Distributor |
| Model | Customized-3 |
| Wafer Size | 150 mm – 300 mm |
| Uniformity Performance | Within-Wafer (WiW) ≤ 5%, Within-Lot (WtW) ≤ 5%, Run-to-Run (RtR) ≤ 5% |
| Configuration | Up to 3 Loadports, Up to 24 Plating Chambers (Cu, Ni, Sn/Ag, Au), Up to 4 Pre-wet Chambers, Up to 4 Rinse Chambers |
| Chamber Architecture | Horizontal, Cross-Contamination-Free |
| Maintenance Design | Modular |
| Sealing Technology | Elastomeric Gasket Sealing |
| Electrode Isolation | Anode-Cathode Separation for Electrolyte Stability |
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