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| Brand | SUSS MicroTec |
|---|---|
| Origin | Germany |
| Model | XBS200 |
| Maximum Wafer Size | 200 mm |
| Bonding Force | up to 100 kN |
| Temperature Range | up to 550 °C |
| Vacuum Chamber Pressure Range | 5×10⁻⁵ mbar to 3 bar |
| Heating/Cooling Rate | up to 40 K/min (heating), up to 30 K/min (cooling) |
| Bonding Force Repeatability | < 2% |
| Temperature Uniformity | < 1% |
| Process Control | Programmable ramp/soak profiles with independent pressure, temperature, and force regulation |
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