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| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | POLI-500 |
| Maximum Wafer Size | 200 mm (8-inch) |
| Platen Diameter | 508 mm (20 inch) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Downforce Range | 70–500 g/cm² |
| Pressure Actuation | Pneumatic bladder-based compliant loading |
| Conditioning | Oscillating arm-type conditioner with optional reciprocating mode |
| Process Monitoring | Optional friction force & temperature sensing |
| Endpoint Detection | Optional Electrochemical Endpoint Detection (EPD) |
| Slurry Delivery | Three independent peristaltic pump channels |
| Loading Interface | Semi-automatic tray-based wafer handling |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-150A / TMP-200A |
| Wafer Size | 4"/6" (TMP-150A), 4"/6"/8" (TMP-200A) |
| Platen Diameter | 406 mm (TMP-150A), 508 mm (TMP-200A) |
| Platen & Carrier Rotation Speed | 0–120 rpm |
| Wafer Backside Pneumatic Pressure | 70–500 g/cm² |
| Retaining Ring Pressure | 70–700 g/cm² |
| Conditioner Type | Swing-Arm Diamond Dresser |
| Conditioner Speed | 0–80 rpm |
| Loading Mode | Semi-Automatic |
| Brand | TSD |
|---|---|
| Origin | Beijing, China |
| Model | TMP-200S / TMP-300S |
| Wafer Size | 6–8 inch (TMP-200S), 8–12 inch (TMP-300S) |
| Platen Speed | 30–200 rpm |
| Carrier Head Speed | 30–200 rpm |
| Wafer Backside Pneumatic Pressure | 0–700 g/cm² |
| Zone-Based Pressure Control | 3-zone (TMP-200S), 3/6-zone (TMP-300S) |
| Retainer Ring Pressure | 0–700 g/cm² |
| Loading/Unloading | Semi-automatic dual-tray (load/unload trays) |
| Conditioning | Swing-arm diamond dresser |
| Brand | MCF |
|---|---|
| Origin | Germany |
| Model | customized-17 |
| Platen Diameter | ≥508 mm (20 inch) |
| Platen Speed | 30–200 rpm |
| Wafer Pressure Range | 70–500 g/cm² |
| Retaining Ring Pressure Range | 70–700 g/cm² |
| Carrier Head Speed | 30–200 rpm |
| Oscillation Amplitude | ±10 mm |
| Slurry Delivery | 3-channel peristaltic pump system with adjustable flow and positionable nozzles |
| Endpoint Detection | Integrated friction force & infrared surface temperature monitoring |
| Control System | PC-based industrial controller with touchscreen HMI, 20 programmable recipes, up to 6 process stages per recipe |
| Within-Wafer Non-Uniformity (WIWNU, 1σ, EE=5 mm) | ≤5% |
| Wafer-to-Wafer Non-Uniformity (WTWNU) | ≤5% |
| Brand | G&P |
|---|---|
| Origin | South Korea |
| Model | GNP POLI-762 / POLI-500 / POLI-400L |
| Platen Diameter | Φ762 mm (30″), Φ508 mm (20″), Φ406 mm (16″) |
| Platen Material | Anodized Aluminum (optional Teflon-coated) |
| Head & Table Rotation Speed | 30–200 rpm |
| Head Oscillation | ±15 mm |
| Downforce Range | 70–500 g/cm² (1–7.1 psi) |
| System Height | 1850–1960 mm |
| Process Mode | Automated Dry/Wet Sequential Operation |
| Wafer Compatibility | Up to 300 mm (12″), 200 mm (8″), or 150 mm (6″) |
| Compliance | Designed for GLP/GMP-aligned R&D and process qualification environments |
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