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| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 604-ST |
| Wafer Diameter | 50–200 mm |
| Thickness Range | 60–300 µm or 250–750 µm |
| Thickness Accuracy | ±1 µm |
| Sensor Active Diameter | 8 mm |
| Sensor Housing Diameter | 20 mm |
| Edge Exclusion Distance | 10 mm |
| Measurement Time per Point | 0.3 s |
| Sheet Resistance Range | 10–2000 Ω/sq |
| Resistivity Range | 0.25–50 Ω·cm (at 250 µm) / 0.75–150 Ω·cm (at 750 µm) |
| Software | EHMaster |
| Brand | E+H Metrology |
|---|---|
| Origin | Germany |
| Model | MX 608 |
| Wafer Sizes Supported | 4", 5", 6", 8" |
| Thickness Range | 300–800 µm (standard 500–800 µm) |
| Max. Warp | 100 µm |
| Resistivity Range | 0.001–200 Ω·cm |
| Thickness Accuracy | ±0.3 µm |
| TTV Accuracy | ±0.1 µm |
| Thickness Resolution | ±0.05 µm |
| Resistivity Accuracy | ±1% (0.001–30 Ω·cm), ±2% (30–100 Ω·cm), ±5% (100–200 Ω·cm) |
| Measurement Time | 7 s (single-point center), 10 s (full radial scan, 180 points on 8″ wafer), ~3 min (18 angular scans × 180 points = 3240-point full mapping) |
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