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Ultrafast Technologies (Hong Kong) Limited

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OriginUSA
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelDG535
PriceUpon Request
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BrandMVSystems
OriginUSA
ModelCluster
Substrate Size30 × 40 cm
Chamber Configuration8-port cluster architecture
Deposition MethodsPlasma-Enhanced CVD (PECVD), Hot-Wire CVD (HWCVD), DC/RF Sputtering
Control SystemFully computer-integrated with programmable process sequencing
CategoryCluster-Type Thin-Film Deposition System
Import StatusImported Equipment
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BrandMVSystems
OriginUSA
ModelSiNx-PECVD
Throughput>475 wafers/hr
SiNx Film Uniformity<5% (1σ, across 156 mm × 156 mm wafer)
Deposition TechnologyRF (13.56 MHz) Plasma-Enhanced CVD
Precursor GasesSilane (SiH₄) and Ammonia (NH₃)
Substrate Temperature200–400 °C
Chamber ConfigurationSingle-wafer, Load-lock compatible
Process ControlFully automated recipe-based operation with real-time RF power, pressure, and gas flow monitoring
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OriginGermany
Manufacturer TypeAuthorized Distributor
Origin CategoryImported Instrument
ModelSpecEL-2000-VIS
PricingUpon Request
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BrandEdmund Optics
OriginUSA
Model225
Filter TypeLongpass
Substrate MaterialOptical Glass (UV-Longpass), Optical Polymer (NIR-Longpass)
Transmission RangeUV-Blocking / Visible-Transmitting (UV-LP) or Visible-Blocking / NIR-Transmitting (NIR-LP)
Available DiametersMultiple Standard Sizes (e.g., 12.5 mm, 25 mm, 50 mm)
Optical Density (OD) @ Blocking Region≥4.0 (typical)
Surface Quality60–40 scratch-dig
Clear Aperture≥90% of diameter
Operating Temperature–20 °C to +70 °C (glass)
ComplianceRoHS 2015/863/EU, REACH SVHC-free
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BrandMVSystems
OriginUSA
ModelReel-to-Reel Cassette System
Web Width15 cm – 30 cm
Process CapabilitiesPECVD, HWCVD, Sputtering
PatentUS Patent No. 6,258,408B1
Architecture8-Port Cluster Tool with Robotic Cassette Transport
ControlFully Computer-Controlled
Chamber IndependenceIndividual Chamber Servicing Enabled
Cross-Contamination MitigationCassette-Based Isolation Between Process Steps
ComplianceDesigned for GLP/GMP-aligned thin-film R&D environments
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BrandMVSystems
OriginUSA
ModelMVS-PECVD
PriceUSD $1,000,000
Chamber ConfigurationModular Cluster Tool (8–10 port), In-Line, or Single-Chamber Options
Substrate CompatibilityRigid (15.6×15.6 cm, 30×40 cm) and Flexible Web (15–30 cm width)
Deposition TechnologiesPECVD, HWCVD, Sputtering, Annealing
Vacuum ArchitectureHigh-Vacuum (≤1×10⁻⁷ Torr base pressure)
Process ControlFully Computer-Controlled with Real-Time Parameter Logging
In-Situ Characterization OptionIntegrated UHV-compatible optical/electrical test module
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BrandYenista
OriginFrance
ModelXTM(A)-50
TypeBandwidth-Tunable Tunable Optical Filter
CategoryImported Instrument
Distribution StatusAuthorized Distributor
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BrandEdmund Optics
ModelNT72-375
Dimensions12 in × 12 in × 0.007 in
Operating Temperature Range20–25 °C (68–77 °F)
MaterialCholesteric Liquid Crystal Polymer Film
SubstratePolyester (PET)
Response Time< 1 s
ReusabilityFully reversible, >10⁴ thermal cycles
Storage Stability2 years at 25 °C / 50% RH
ComplianceRoHS 2 compliant, REACH SVHC-free
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BrandEdmund Optics
OriginUSA
Model226
Diffuser SurfaceFrosted White Coating
Coating Thickness0.45 mm (±0.35 mm, –0.2 mm)
Shape OptionsCircular or Square
ComplianceISO 10110-7 (Surface Quality), MIL-PRF-13830B (Scratch-Dig)
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