- All
- Favorite
- Popular
- Most rated
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | AXAS-D |
| Detector Type | Integrated Digital Pulse Processing SDD System |
| Active Area Options | 7–50 mm² |
| Energy Resolution (FWHM @ Mn Kα) | ≤133 eV (Premium Class), ≤139 eV (Standard Class), ≤136/144 eV (H15LE variants) |
| Finger Length Options | 50, 100, 160, 200, 300 mm |
| Upper Energy Limit | 20 keV or 30 keV |
| Cooling | Integrated Thermoelectric Control |
| Signal Processing | Onboard Charge-Sensitive Preamplifier + Digital Pulse Processor (DPP) |
| Compliance | Designed for ASTM E1598, ISO 21397, and IEC 62495-compliant XRF and EPMA systems |
| Software Interface | KETEK DPP Software (shaping time adjustable from 0.5–16 µs) |
| Key | Origin: UK |
|---|---|
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | Neutron ICCD |
| Pricing | Available Upon Request |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VITUS Series |
| Energy Resolution (FWHM @ 1 µs peaking time, Cube Class) | 129 eV (H7–H50), 136 eV (H80/R100), 133–136 eV (LE variants) |
| Peak-to-Background Ratio (P/B) | >15,000 (Cube Class H7–H50), >10,000 (H80), >400 (R100), >10,000 (LE variants) |
| Peak-to-Tail Ratio (P/T) | >2,000 (Cube Class), >1,000 (Standard Class) |
| Active Si Thickness | 450 µm |
| Maximum Count Rate | 1,000 kcps |
| Beryllium Window | 8 µm (standard), 12.5 µm (H50), 25 µm (H80/R100), AP3.3 low-energy polymer (H7LE/H18LE) |
| Cooling Performance | ΔT > 75 K (Cube/Premium), ΔT > 55 K (LE variants) |
| Operating Heat Sink Temperature | ≤30 °C |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-XT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 450 µm or 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM @ Mn Kα) | < 170 eV (6 mm²), < 230 eV (13 mm²) |
| Peak-to-Background Ratio @ 1 keV | 3600:1 (6 mm², typical), 3000:1 (13 mm², typical) |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00050 |
| Voltage Range | 4–50 kV |
| Current Range | 0–200 µA |
| Max Output Power | 10 W |
| Optional Anode Materials | Ag, W, Pd, Rh, Ta, Au |
| Input Voltage | 6–12 VDC |
| Weight | 500 g |
| HV Cable Length Options | 1–11.5 in |
| Warranty | 1 year |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VIAMP |
| Detector Type | Silicon Drift Detector (SDD) Module with Flexible Cable Interface |
| Compatible Probes | VITUS H7–H50 Series |
| Operating Temperature Range | −35 °C (TEC-stabilized) |
| Bias Voltage | −140 V DC |
| Power Supply | +5 V / 25 mA, −5 V / 15 mA, TEC: 1.7 V / 280 mA @ −35 °C |
| Energy Resolution | <125 eV FWHM at Mn Kα (5.9 keV), typical for high-performance SDDs |
| Count Rate Capability | >100 kcps (with pulse pile-up rejection) |
| Signal Polarity | Positive |
| Ramp Threshold | +1.8 V (positive), −1.8 V (negative) |
| Preamp Gain | 3 mV/keV (±10%) |
| TEC ΔT | 70 K @ 20 °C heatsink temperature |
| Temperature Diode Slope | 2.35 mV/K @ 1 µA |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-BT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 450 µm or 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM @ Mn Kα) | ≤170 eV (6 mm²), ≤230 eV (13 mm²) |
| Peak-to-Background Ratio @ 1 keV | 3600:1 (6 mm², typical), 3000:1 (13 mm², typical) |
| Brand | Laser Components |
|---|---|
| Model | IG26 Series |
| Detector Type | PIN Photodiode |
| Cutoff Wavelength | 2.6 µm |
| Spectral Range | 0.8–2.6 µm |
| Typical Responsivity @ 2.0 µm | 1.45 A/W |
| Operating Temperature | −40 °C to +85 °C (TE-cooled variants available) |
| Shunt Resistance | >10⁹ Ω (typ. at 0 V, 25 °C) |
| Dark Current | <10 nA (typ. at −5 V, 25 °C) |
| Capacitance | <20 pF (typ. at −5 V, 25 °C) |
| Active Area Options | 0.05–1.0 mm² |
| Package | TO-8, TO-46, or OEM hermetic ceramic |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | AXAS-A |
| Detector Type | Integrated SDD with Pulse Reset Preamp |
| Power Supply | ±12 V DC |
| FWHM (Mn Kα) | ≤133 eV (Premium Class) / ≤149 eV (Standard Class) |
| Finger Length Options | 50, 100 (standard), 160, 200, 300 mm |
| Upper Energy Limit | 20 keV (H7, H20, H30) or 30 keV (H50) |
| Low-Energy Window Options | H7LE*, H15LE* (with FWHM ≤136 eV & ≤144 eV) |
| Cooling | Integrated thermoelectric (Peltier) control |
| High-Count-Rate Capability | Enabled via pulse reset front-end architecture |
| Compliance | Designed for ASTM E1301, ISO 21389, and IEC 62596-compliant XRF and EPMA systems |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00045 |
| Voltage Range | −4 to 40 kV |
| Current Range | 0–100 µA |
| Max Output Power | 4 W |
| Optional Anode Materials | Ag, W, Pd, Rh, Ta, Au |
| Input Voltage | 7–12 VDC |
| Weight | 450 g |
| Warranty | 1 Year |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | TUB00082 |
| Tube Voltage | 4–50 kV |
| Tube Current | 0–200 µA |
| Max Output Power | 4 W |
| Anode Materials | Ag, W, Rh |
| Focal Spot Size | 400 µm |
| Input Voltage | 6–12 VDC |
| Weight | 350 g |
| Warranty | 1 year |
| Brand | KETEK |
|---|---|
| Origin | Germany |
| Model | VITUS |
| Active Area Options | 7–100 mm² |
| Window Material | 8 µm or 25 µm Beryllium (standard) / AP3.3 polymer (low-energy) |
| Cooling | Peltier, ΔT ≤ 75 °C @ 30 °C heatsink (standard class) / ≤ 55 °C @ 20 °C heatsink (low-energy class) |
| Energy Resolution (FWHM) | ≤133 eV @ Mn-Kα (5.9 keV), 8 µs peaking time |
| Count Rate Capability | >15,000 cps (standard), >10,000 cps (low-energy), dead time <50% at 100 kcps |
| Peak-to-Background Ratio (P/B) | >6,000 (guaranteed) |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | TUB00083 |
| Tube Voltage | 4–50 kV |
| Tube Current | 0–200 µA |
| Max Output Power | 4 W |
| Anode Materials | Ag, W, Rh |
| Focal Spot Size | 400 µm |
| Input Voltage | 6–12 VDC |
| Weight | 350 g |
| Warranty | 1 year |
| Origin | United Kingdom |
|---|---|
| Distribution Model | Authorized Distributor |
| Import Status | Imported |
| Model | sCMOS_4MP |
| Pricing | Available Upon Request |
| Active Area (Single Module) | 22.5 × 22.5 mm to 95.5 × 95.5 mm |
| Multi-Module Array Configurations | 134 × 134 mm, 268 × 67 mm, 191 × 191 mm, 382 × 95.5 mm |
| Scintillator Options | Gd₂O₂S:Tb (1–55 keV), CsI:Tl (20–300 keV) |
| Pixel Array | 2048 × 2048 |
| Pixel Size | 11 × 11 µm |
| Full-Well Capacity | 80,000 e⁻ |
| Read Noise | 1.8 e⁻ rms |
| Dark Current | <1 e⁻/pixel/s |
| Quantum Efficiency (Peak) | 58% @ scintillator emission wavelength (no microlens) |
| Exposure Time Range | 50 µs – 60 s |
| Operating Sensor Temperature | −20 °C (water-cooled) |
| Bit Depth | 16-bit |
| Dynamic Range | 20,000:1 |
| Spatial Resolution | Gd₂O₂S:Tb — 25 lp/mm |
| CsI | Tl — 20 lp/mm |
| Frame Rate | 18 fps (full frame), 4.5 fps (full frame, no binning) |
| Interface | Gigabit Ethernet / GenICam-compliant |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | Monoblock |
| Tube Type | Metal-Ceramic |
| Target Materials | Ag, W, Pd, Rh |
| Operating Voltage Range | 10–50 kV |
| Current Range | 0–0.2 mA |
| Max Output Power | 10 W |
| Focal Spot Size | 400 µm |
| Stability | < 1.0% RSD |
| Beryllium Window Thickness | 0.25 mm |
| Max Input Power | 20 W |
| Operating Temperature | −10 °C to +50 °C |
| Storage Temperature | −40 °C to +60 °C |
| Weight | 500 g |
| Compliance | RoHS, CE (per IEC 61010-1), FDA 21 CFR Part 1020.40 (X-ray equipment) |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Origin Category | Imported |
| Model | TUB00046 |
| Voltage Range | ±4–40 kV |
| Current Range | 0–100 µA |
| Max Power Output | 4 W |
| Anode Target Options | Tungsten (W), Rhodium (Rh), Copper (Cu) |
| Focal Spot Size | 300 µm |
| HV Cable Length Options | 1–11.5 inches |
| Warranty | 12 months |
| Brand | Moxtek |
|---|---|
| Origin | USA |
| Model | XPIN-BT |
| Active Area | 6 mm² or 13 mm² |
| Silicon Thickness | 625 µm |
| Beryllium Window Thickness | 8 µm or 25 µm |
| Collimator Materials | Tungsten / Cobalt / Titanium / Aluminum |
| Energy Resolution (FWHM) | < 170 eV (6 mm²), < 230 eV (13 mm²) |
| Peak-to-Background Ratio | 3600:1 @ 1 keV (6 mm², typical), 3000:1 @ 1 keV (13 mm², typical) |
| Brand | Dexela |
|---|---|
| Origin | USA |
| Manufacturer Type | Authorized Distributor |
| Product Origin | Imported |
| Model | CMOS X-ray Camera |
| Pricing | Upon Request |
| Effective Area | 114.9 × 64.6 mm |
| Resolution | 1536 × 864 pixels |
| Pixel Size | 74.8 µm (1×1), 149.6 µm (2×2), 299.2 µm (4×4) |
| Frame Rate | Up to 65 fps at full resolution (Camera Link) |
| MTF @ 6 lp/mm | >20% (with 150 µm high-resolution CsI scintillator, no binning) |
| DQE | ~0.7 at 0.5 lp/mm (28 kV, W/Al filtration) |
| Binning Modes | 1×1, 1×2, 2×2, 1×4, 2×4, 4×4 |
| Dynamic Range | 6400:1 (low-noise mode), 2400:1 (high-dynamic-range mode) |
| ADC Resolution | 14-bit |
| Interface | Camera Link or Gigabit Ethernet |
| Max. X-ray Energy | Standard ≤220 kV |
| Scintillator Options | Gd₂O₂S (Gadox) or columnar CsI, thickness customizable per application |
| Dimensions | 241 × 150 × 42 mm |
| Weight | 1.9 kg |
Show next