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| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | SET/Sensor Electronic Technology |
|---|---|
| Origin | Germany |
| Model | G5/2017 Series |
| Bonding Accuracy | ±0.5 µm |
| Bonding Methods | Thermocompression, Reflow Soldering, UV Curing |
| Compatible Materials | Au, Au/Sn, In, Cu, Cu/Sn |
| Applications | Flip-Chip, Die-to-Substrate (D2S), Chip-to-Chip (C2C), Chip-to-Substrate (C2S), MEMS, MOEMS, MCM, Photonic Integrated Circuits (PICs), Silicon Photonics, Optoelectronic Assembly |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | PP7 |
| Type | Semi-Automatic Pick-and-Place Die Bonder for Precision Semiconductor Assembly |
| Compliance | Designed for ISO Class 5–7 cleanroom environments |
| Mechanical Architecture | Vibration-isolated granite base with motorized Z-axis and coaxial optical alignment system |
| Imaging | Dual-axis programmable high-magnification telecentric optics with real-time focus tracking |
| Placement Accuracy | ≤ ±1.5 µm (3σ, under controlled environmental conditions) |
| Bond Height Independence | Achieved via dynamic focus-servo loop synchronized with Z-motion control |
| Substrate Compatibility | Wafers (up to 8″), ceramic packages, leadframes, and custom carriers with curvature compensation |
| Tooling Interface | Standard vacuum nozzle exchange (ISO 9409-1-22-6-40) |
| Software Platform | JFP ControlSuite v4.x with audit trail, user-level permissions, and exportable placement logs (CSV/Excel) |
| Brand | JFP |
|---|---|
| Origin | France |
| Model | MPPS |
| Maximum Wire Saw Speed | 400 mm/s |
| Sample Stage | Vacuum-Chuck with Rotatable Platform (Max Ø200 mm) |
| Angular Adjustment Resolution | 0.006° (Range ±4°) |
| Scribing Stroke Length | 250 mm |
| Scribing Width | 240 mm |
| Positioning Accuracy | 0.01 mm |
| Max Sample Thickness | 10 mm |
| Adjustable Scribing Force | 5–581 g |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB75 |
| Z-Axis Drive | Motorized |
| Control Interface | 6.5" TFT Touchscreen |
| Placement Accuracy | Sub-10 µm (typical, under optimized conditions) |
| Chip Size Range | 100 µm × 100 µm to 10 mm × 10 mm |
| Placement Time | 1–10,000 ms (optional extension to 20,000 ms) |
| Placement Force | 10–150 cN·m (350 cN·m optional) |
| Vacuum Source | Integrated pump |
| Nozzle Diameter | Ø1.58 mm, 19 mm length |
| Z-Travel | 17 mm |
| Arm Length | 165 mm |
| X-Y Manipulator Range | ±10 mm |
| Mechanical Lever Ratio | 6:1 |
| Temperature Control | Up to 250 °C ±1 °C |
| Power Supply | 100–240 VAC, ±10%, 50/60 Hz, max. 10 A |
| Dimensions (W×D×H) | 680 × 640 × 490 mm |
| Net Weight | 42 kg |
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