- All
- Favorite
- Popular
- Most rated
| Brand | AML |
|---|---|
| Origin | United Kingdom |
| Model Series | AWB-04, AWB-08, ROCK-04, ROCK-08 |
| Maximum Wafer Size | 200 mm |
| Heating Range | Up to 650 °C |
| Bonding Chamber Vacuum | ≤1 × 10⁻⁵ mbar (with turbomolecular pump) |
| Control Interface | Windows-based HMI with full process logging |
| Compliance | Designed for GLP/GMP-aligned R&D and pilot-line environments |
| Automation Level | Semi-automatic (manual load/unload, fully automated alignment, activation, and bonding) |
| Brand | SET/Sensor Electronic Technology |
|---|---|
| Origin | Germany |
| Model | G5/2017 Series |
| Bonding Accuracy | ±0.5 µm |
| Bonding Methods | Thermocompression, Reflow Soldering, UV Curing |
| Compatible Materials | Au, Au/Sn, In, Cu, Cu/Sn |
| Applications | Flip-Chip, Die-to-Substrate (D2S), Chip-to-Chip (C2C), Chip-to-Substrate (C2S), MEMS, MOEMS, MCM, Photonic Integrated Circuits (PICs), Silicon Photonics, Optoelectronic Assembly |
| Brand | TPT |
|---|---|
| Origin | Germany |
| Model | HB100 |
| Bonding Types | Ball & Wedge |
| Wire Diameter Range | 17–75 µm |
| Ultrasonic Frequency | 63.3 kHz (PLL-controlled, optional 110 kHz) |
| Ultrasonic Power | 0–10 W |
| Bonding Force | 10–200 cN·mm |
| Z-Axis Resolution | 0.5 µm |
| X-Y Resolution | 0.1 µm |
| X-Y Travel | 90 mm |
| Z Travel | 100 mm |
| Heating Stage | Ø90 mm, up to 200 °C ±1 °C |
| Power Supply | 100–240 V AC, 50/60 Hz, ≤10 A |
| Dimensions (W×D×H) | 620 × 750 × 680 mm |
| Weight | 72 kg |
Show next