Empowering Scientific Discovery

Shanghai Microwell Semiconductor Technology Co., Ltd.

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BrandAXIC
OriginUSA
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelBenchMark 800
Etching PrincipleReactive Ion Etching (RIE)
Deposition PrinciplePlasma-Enhanced Chemical Vapor Deposition (PECVD)
Substrate CompatibilityUp to 200 mm (8-inch) wafers
Operation ModesSingle-wafer and batch processing
Chamber ConfigurationModular single-chamber and dual-chamber options
RF MatchingAutomatic impedance matching
Pressure ControlDownstream capacitance manometer with optional closed-loop regulation
Vacuum Pumping OptionsMechanical pump, mechanical + roots blower, or turbomolecular pump
Endpoint DetectionOptional optical emission spectroscopy (OES)-based endpoint monitoring
Gas DeliveryReplaceable showerhead with multi-gas capability
Electrode ConfigurationsPlanar, RIE, and PECVD-specific electrode modules
Software InterfaceWindows-based PC control with recipe management and audit trail logging
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BrandSENTECH
OriginGermany
ModelSENTECH Multi-Chamber Platform
Etching PrincipleCapacitively Coupled Plasma (CCP) and/or Inductively Coupled Plasma (ICP)
Chamber ConfigurationModular multi-port transfer chamber (3–6 ports)
Wafer HandlingLoad-lock pre-vacuum chamber and/or vacuum cassette station
Maximum Wafer Size200 mm
Integration CapabilitiesICP etcher, RIE etcher, ALD, PECVD, ICPECVD modules
Control InterfaceGUI-based process control software compliant with industrial automation standards
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BrandSAMCO
OriginJapan
ModelRIE-200C
Etching PrincipleCapacitively Coupled Plasma (CCP) Reactive Ion Etching
Uniformity±2% across 200 mm wafer
ConfigurationDirect-Load, Parallel-Plate Electrode Architecture
Upgrade OptionsEndpoint Detection, High-Capacity Vacuum Pumping, Load Lock Integration, Multi-Gas Delivery System
Control ArchitectureClient-Server Software with PLC-Based Real-Time Hardware Control
ComplianceDesigned for ISO Class 5 cleanroom integration and compatible with SEMI S2/S8 safety standards
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