Empowering Scientific Discovery

Shanghai Microwell Semiconductor Technology Co., Ltd.

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BrandAXIC
OriginUSA
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelBenchMark 800
Heating MethodHot-Wall
Deposition Rate1 nm/s (typical, process-dependent)
Base Vacuum≤1×10⁻⁶ Torr
Operating Pressure Range2–200 mTorr
Chamber Internal Diameter6-inch (152 mm)
Substrate CompatibilityUp to 8-inch wafers
Application DomainSemiconductor Thin-Film Fabrication
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BrandAxic
OriginFrance
Manufacturer TypeAuthorized Distributor
Origin CategoryImported
ModelSSDR150
Heating MethodHot-Wall
Application FieldSemiconductor
Deposition Rate1 nm/s (typical for diamond)
Base Vacuum1×10⁻⁶ mbar
Operating Pressure Range20–400 mbar
Chamber Internal Diameter6 inch (Ø152 mm)
Microwave Power6 kW @ 2.45 GHz
Substrate StageØ60 mm with Z-axis motion
Max. Continuous Process Duration≥3 weeks
Temperature ControlPrecision ±1°C over full operating range
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BrandAxic
OriginFrance
Manufacturer TypeAuthorized Distributor
Product OriginImported
ModelSSDR400
Heating MethodHot-Wall
Application FieldSemiconductor & Advanced Materials
Deposition Rate1 µm/h (typical for diamond)
Base Pressure1×10⁻⁶ mbar
Operating Pressure Range2–200 mbar
Chamber Internal Diameter6 inch (Ø152 mm)
Substrate StageØ158 mm, Z-axis motorized translation
Plasma Source915 MHz, up to 36 kW microwave generator
Process Duration CapabilityUp to 500 h continuous operation
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