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| Brand | SHNTI |
|---|---|
| Origin | Shanghai, China |
| Model | CMP20 |
| Wafer Size | 2", 4", 6" |
| Platen Count | 1 |
| Platen/Head/Conditioner Speed | 0–300 rpm (continuously adjustable) |
| Polishing Head Downforce | 0–4 psi (at 4") |
| Slurry & DI Water Flow | 0–300 mL/min (per channel, peristaltic pump) |
| Stroke Range (Head/Conditioner Reciprocation) | 90 mm |
| Dimensions (L×W×H) | 800 mm × 1000 mm × 2000 mm |
| Optional Modules | Electrochemical Unit (±10 V / ±250 mA, 2-/3-electrode support, CV, etc.), UV Module (λ = 95 nm, 1020 mm × 100 mm emission area, 200 W input power) |
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